1
ÉÉÉ
ÉÉÉ
ÉÉÉ
SSOP36 EP CASE 940AB
ISSUE A
DATE 19 JAN 2016 SCALE 1:1
DIM MIN MAX MILLIMETERS
E2 3.90 4.10
A 2.65
A1 --- 0.10
L 0.50 0.90 e 0.50 BSC c 0.23 0.32
h 0.25 0.75 b 0.18 0.30
D2 5.70 5.90
L2 0.25 BSC
M 0 8
_ _
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF THE b DIMENSION AT MMC.
4. DIMENSION b SHALL BE MEASURED BE- TWEEN 0.10 AND 0.25 FROM THE TIP.
5. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. DIMENSIONS D AND E1 SHALL BE DETERMINED AT DATUM H.
6. THIS CHAMFER FEATURE IS OPTIONAL. IF IT IS NOT PRESENT, A PIN ONE IDENTIFIER MUST BE LOACATED WITHIN THE INDICAT- ED AREA.
PIN 1 REFERENCE
D
E1
0.10
SEATING PLANE 36X
b
E
e
DETAIL A
---
GENERIC MARKING DIAGRAM*
*This information is generic. Please refer to device data sheet for actual part marking.
XXXXXXXXXX XXXXXXXXXX XXXXXXXXXX AWLYYWWG
SOLDERING FOOTPRINT
L L2
GAUGE
DETAIL A e/2
DETAIL B
A2 2.15 2.60
E1 7.50 BSC
PLANE
SEATING PLANE
C
X
c h
END VIEW A
0.25
MT B TOP VIEW
SIDE VIEW A-B
0.20 C
1 18
19 36
A
B
D
DETAIL B
36X
A1 A2
C
C D2
E2
BOTTOM VIEW
XXXX = Specific Device Code A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week G = Pb−Free Package
36X
D 10.30 BSC E 10.30 BSC
M1 5
_
15_
5.90
36X1.06
36X
0.50 0.36
DIMENSIONS: MILLIMETERS
PITCH
4.10 10.76
1
0.25 C
S S
4X
H A
X = A or B
h
NOTE 6
M1
M
36X
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
http://onsemi.com 1
© Semiconductor Components Industries, LLC, 2002
October, 2002 − Rev. 0
Case Outline Number:
XXX DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
DESCRIPTION:
98AON46215E
ON SEMICONDUCTOR STANDARD
SSOP36 EXPOSED PAD
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
PAGE 1 OF 2
DOCUMENT NUMBER:
98AON46215E
PAGE 2 OF 2
ISSUE REVISION DATE
O RELEASED FOR PRODUCTION. REQ. BY J. LETTERMAN. 05 NOV 2009 A MODIFIED DIMENSION A2 MIN VALUE AND DIMENSION B MAX VALUE. REQ.
BY B. MARQUIS.
19 JAN 2016
© Semiconductor Components Industries, LLC, 2016
January, 2016 − Rev. A
Case Outline Number:
940AB
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
