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2N6849

Siliconix

P-37010—Rev. A, 06-Jun-94

1

N-Channel Enhancement-Mode Transistor

Product Summary

V

(BR)DSS

(V) r

DS(on)

( ) I

D

(A)

–100 0.30 –6.5

Parametric limits in accordance with MIL-S-19500/564 where applicable.

1

2 3

TO-205AF (TO-39)

Top View D G

S

S

G

D P-Channel MOSFET

Absolute Maximum Ratings (T C = 25 C Unless Otherwise Noted)

Parameter Symbol Limit Unit

Drain-Source Voltage VDS –100

V

Gate-Source Voltage VGS 20 V

Continuous Drain Current (TJ= 150C) TC = 25C

ID

–6.5 Continuous Drain Current(TJ = 150C)

TC = 100C ID

–3.1

A

Pulsed Drain Current IDM –25 A

Avalanche Current IAR –3.1

Maximum Power Dissipation

TC = 25C

PD

25

W Maximum Power Dissipation

TC = 100C PD

10 W

Operating Junction and Storage Temperature Range TJ, Tstg –55 to 150

Lead Temperature (1/16” from case for 10 sec.) TL 300 CC

Thermal Resistance Ratings

Parameter Symbol Limit Unit

Maximum Junction-to-Ambient RthJA 175

C/W

Maximum Junction-to-Case RthJC 5.0 C/W

Subsequent updates to this data sheet may be obtained via facsimile by calling Siliconix FaxBack, 1-408-970-5600. Please request FaxBack document

#1489 .

(2)

2N6849

2 Siliconix

P-37010—Rev. A, 06-Jun-94

Specifications (T J = 25 C Unless Otherwise Noted)

Limit

Parameter Symbol Test Condition Min Typa Max Unit

Static

Drain-Source Breakdown Voltage V(BR)DSS VGS = 0 V, ID = –1000 mA –100

V

Gate Threshold Voltage VGS(th) VDS = VGS, ID = –250 mA –2.0 –4.0

V

Gate-Body Leakage IGSS VDS = 0 V, VGS = "20 V "100 nA

Zero Gate Voltage Drain Current IDSS VDS = –80 V, VGS = 0 V –25

mA Zero Gate Voltage Drain Current IDSS

VDS = –80 V, VGS = 0 V, TJ = 125C –250 mA

On-State Drain Currentb ID(on) VDS = –2.1 V, VGS = –10 V –6.5 A

Drain-Source On-State Resistanceb rDS(on)

VGS = –10 V, ID = –4.1 A 0.25 0.30 W Drain-Source On-State Resistanceb rDS(on)

VGS = –10 V, ID = –4.1 A, TJ = 125C 0.40 0.54 W

Forward Transconductanceb gfs VDS = –15 V, ID = –4.1 A 2.5 2.8 7.5 S

Dynamic

Input Capacitance Ciss 625

Output Capacitance Coss VGS = 0 V, VDS = –25 V, f = 1 MHz 280 pF

Reverse Transfer Capacitance Crss 105

Total Gate Chargec Qg 14.7 24 34.8

Gate-Source Chargec Qgs VDS = –50 V, VGS = –10 V, ID = –6.5 A 0.8 3.4 6.8 nC

Gate-Drain Chargec Qgd 2.0 13.5 23.1

Turn-On Delay Timec td(on)

W

9 60

Rise Timec tr VDD = –50 V, RL = 10 W

I 4 1 A V 10 V R 7 5W

50 140

Turn-Off Delay Timec td(off) ns

DD , L

ID^ –4.1 A, VGEN = –10 V, RG = 7.5 W 32 140 ns

Fall Timec tf 38 140

Source-Drain Diode Ratings and Characteristics

Continuous Current IS –6.5

A

Pulsed Current ISM –25

A

Diode Forward Voltageb VSD IF = –6.5 A, VGS = 0 V –0.8 –2.0 V

Reverse Recovery Time trr

IF= –6 5 A di/dt = 100 A/ms 110 250 ns

Reverse Recovery Charge Qrr IF = –6.5 A, di/dt = 100 A/ms

0.4 mC

Notes:

a. For design aid only; not subject to production testing.

b. Pulse test; pulse width v 300 ms, duty cycle v 2%.

c. Independent of operating temperature.

(3)

2N6849

Siliconix

P-37010—Rev. A, 06-Jun-94

3

Typical Characteristics (25 C Unless Otherwise Noted)

Output Characteristics Transfer Characteristics

Capacitance Gate Charge

Transconductance On-Resistance vs. Drain Current

VDS – Drain-to-Source Voltage (V) – Drain Current (A)ID

VGS = 10, 9 V

5 V 8 V

7 V

6 V

VGS – Gate-to-Source Voltage (V) – Drain Current (A)ID– Gate-to-Source Voltage (V)– On-Resistance (

Qg – Total Gate Charge (nC) ID – Drain Current (A)

VDS – Drain-to-Source Voltage (V)

C – Capacitance (pF) rDS(on))VGS

– Transconductance (S)gfs

ID – Drain Current (A) 12.5

0 10.0

7.5

5.0

2.5

0

10

8

6

4

2

0

5

4

3

2

1

0

0

15.0 1.0

0.8

0.6

0.4

0.2

0

12.5

10.0

7.5

5.0

2.5

0

2 4 6 8 10 0 2 4 6 8 10

0 5 10 15 20 25 0 5 10 15 20 25

0 10 20 30 40 50 0 10 20 30 40 50

VDS = 50 V

 V ID = 6.5 A

4 V

0 2500

2000

1500

1000

500

TC = –55C

25C 125C

TC = –55C

125C 25C

20 V VGS = 10 V

Ciss

Crss

Coss VGS = 0 V

(4)

2N6849

4 Siliconix

P-37010—Rev. A, 06-Jun-94

Typical Characteristics (25 C Unless Otherwise Noted)

On-Resistance vs. Junction Temperature Source-Drain Diode Forward Voltage

(Normalized)– On-Resistance (

TJ – Junction Temperature (C) VSD – Source-to-Drain Voltage (V)

rDS(on)W) – Source Current (A)IS

TJ = 150C

TJ = 25C

–50 –10 30 70 110 150

200

0 0 100

1 5

10

2 3 4

2.00

1.75

1.50

1.25

1.00

0.75

0

Thermal Ratings

– Drain Current (A)ID

Normalized Effective Transient Thermal Impedance– Drain Current (A)ID

Safe Operating Area Maximum Avalanche and Drain Current

vs. Case Temperature

Normalized Thermal Transient Impedance, Junction-to-Case

Square Wave Pulse Duration (sec) 2

1

0.1

0.01

10–5 10–4 10–3 10–2 10–1 1 3

TC – Case Temperature (C) VDS – Drain-to-Source Voltage (V) 10

0 8

6

4

2

0

25 50 75 100 125 150 1

0.1

1000 10

10 1

100 100

TC = 25C Single Pulse

100 ms

1 ms

10 ms 100 ms dc 10 ms Limited by

rDS(on)

0.2 0.1 0.05 0.02

Single Pulse Duty Cycle = 0.5

Cytaty

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