• Nie Znaleziono Wyników

FQB-CLGA

N/A
N/A
Protected

Academic year: 2022

Share "FQB-CLGA"

Copied!
4
0
0

Pełen tekst

(1)

SECTION A-A NOTCH OFFSETS

2 1

4 3 6 5

7 8

D

C

B

A

DWG NO. SH

8 7 6 5 4 3 1

D

C

B

A

INV11-2006a

2510388 1

TITLE

SIZE DWG NO REV

SCALE SHEET OF

DATE

ENGINEER

QA/CE

CM

APPROVED DRAWN

INSTRUMENTS

Dallas Texas

APPLICATION

NEXT ASSY USED ON

THIRD ANGLE PROJECTION

TEXAS

UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS TOLERANCES:

ANGLES `1~ 2 PLACE DECIMALS `0.25 1 PLACE DECIMALS `0.50

DIMENSIONAL LIMITS APPLY BEFORE PROCESSES INTERPRET DIMENSIONS IN ACCORDANCE WITH ASME Y14.5M-1994

REMOVE ALL BURRS AND SHARP EDGES

PARENTHETICAL INFORMATION FOR REFERENCE ONLY

ICD, MECHANICAL, DMD, .3 WVGA DDR SERIES 220 0.4 mm PITCH CONNECTOR

2510388

1 3 D B

2/25/2009

15:1 P. KONRAD 3/9/2009

2/25/2009

NONE 0314DA

J. HOLM

NOTES UNLESS OTHERWISE SPECIFIED: COPYRIGHT 2009 TEXAS INSTRUMENTS REVISIONS

UN-PUBLISHED, ALL RIGHTS RESERVED.

C

B. HASKETT

J. GRIMMETT 3/9/2009 A

A

E E

REV DESCRIPTION DATE BY

A ECO 2097098 INITIAL RELEASE 03/02/09 J. HOLM

B ECO 2098984 TIGHTEN DIE ROTATION, NOTE 2; ADD 'DD1'

SUFFIX TO CONNECTOR PART#; CHG DWG TO INVENTOR 08/27/09 BMH

0.8`0.1 5 2X

90°`1°

0.6 R `0.1

0.2 R `0.05 4X

3.5 - 0.1+0.2 5

5

7 - 0.1+0.3

14.6`0.08 1 - 0.1+0.2

16.6 - 0.1+0.3 5

5

(1)

2 - 0.1+0.2 2X 3`0.075 0.4

R `0.1 2X

0.65`0.05 1.359`0.079

0.78`0.063

(1.05)

1.4`0.1 (2.139) 2X ENCAPSULANT 6 WINDOW APERTURE

D

ACTIVE ARRAY 1

0.4 MIN (1.4) 0 MIN

(PANASONIC AXT650224DD1, 50-CONTACT, 0.4 mm PITCH BOARD-TO-BOARD HEADER) INTERFACE TO PANASONIC AXT550224DD1 SOCKET

A 3 SURFACES INDICATED IN VIEW B (SHEET 2) (ILLUMINATION

DIRECTION)

c 0.05 0.038 A

f 0.02D DIE PARALLELISM TOLERANCE APPLIES TO DMD ACTIVE ARRAY ONLY.

ROTATION ANGLE OF DMD ACTIVE ARRAY IS A REFINEMENT OF THE LOCATION TOLERANCE AND HAS A MAXIMUM ALLOWED VALUE OF 0.6 DEGREES.

BOUNDARY MIRRORS SURROUNDING THE DMD ACTIVE ARRAY.

DMD MARKING TO APPEAR ON BOTTOM OF CONNECTOR.

NOTCH DIMENSIONS ARE DEFINED BY UPPERMOST LAYERS OF CERAMIC, AS SHOWN IN SECTION A-A.

ENCAPSULANT TO BE CONTAINED WITHIN DIMENSIONS SHOWN IN VIEWS C AND G (SHEET 2).

1 2

3 4 5

6

(SHEET 3) (SHEET 3)

(3) 5

5

5 5

(2)

2 1 4 3

6 5 7

8

D

C

B

A

DWG NO. SH

8 7 6 5 4 3 1

D

C

B

A

INV11-2006a

2510388 2

SIZE DWG NO REV

SCALE SHEET OF

DATE

INSTRUMENTS

Dallas Texas

TEXAS DRAWN 2510388

2 3

D B J. HOLM 2/25/2009 n1.5

0.812 2X 14.6 3X (1)

(3)

(1.8) 3X 1.7

3X

A3 A2

A1

C

VIEW B

DATUMS A, B, AND C

(FROM SHEET 1)

0.812 14.6

7.3

3.7 (n1.5)

VIEW C

ENCAPSULANT MAXIMUM X/Y DIMENSIONS

(FROM SHEET 1)

VIEW G

ENCAPSULANT HEIGHT LIMITS

B

B

40°

6 2X 6 6

6 6

(3)

VIEW E-E

TEST PADS AND CONNECTOR

SCALE 15 : 1 (FROM SHEET 1)

DETAIL F

APERTURE SHORT EDGES

SCALE 50 : 1

2 1

4 3 6 5

7 8

D

C

B

A

DWG NO. SH

8 7 6 5 4 3 1

D

C

B

A

INV11-2006a

2510388 3

SIZE DWG NO REV

SCALE SHEET OF

DATE

INSTRUMENTS

Dallas Texas

TEXAS DRAWN 2510388

3 3 D B

J. HOLM 2/25/2009 F

(3) (n1.5)

C B

(6.5718) ACTIVE ARRAY 5.188`0.075

1.624`0.075

(3.699) ACTIVE ARRAY 1.602`0.05

4.914`0.05 (6.516)

WINDOW

(0.108) 4X

0.377`0.0885

(4.323) APERTURE 3.946`0.0885

6.963`0.0885 0.64`0.0885

(7.603) APERTURE

VIEW D

WINDOW AND ACTIVE ARRAY

(FROM SHEET 1)

2.2`0.05 8.039`0.05

(10.239) WINDOW

3 2

(42°) TYP.

(42°) TYP.

(0.15) TYP.

(0.068) TYP.

(11.8) (0.52)

(0.47) (n0.52) TYP.

4.22

= 0.94 2 X 0.47

(3)

(1.86) 2X 2.11

(n1.5)

2.212

0.93 2X 15.6

15 X 1.04 = 0.314

j 0.4 A B C

C

j 0.4 A B C

BACK INDEX MARK

B

H G

F

E

D

C B

A 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2

31 29 27 25 23 21 19 17 15 13 11 9 7 5 3 1 67X TEST PADS

n0.2 A B C j n0.1A 4

25 20 15 10 5 1

CL CL

CL

CL

(4)

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.

TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.

Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications

Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive

Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications

Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers

DLP®Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps

DSP dsp.ti.com Energy and Lighting www.ti.com/energy

Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial

Interface interface.ti.com Medical www.ti.com/medical

Logic logic.ti.com Security www.ti.com/security

Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Mobile Processors www.ti.com/omap

Wireless Connectivity www.ti.com/wirelessconnectivity

TI E2E Community Home Page e2e.ti.com

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright©2012, Texas Instruments Incorporated

Cytaty

Powiązane dokumenty

To summarize, after modeling the sensitivity to change with first derivatives as described in subsection III-A, and modeling the seasonality described in the current section, there

In Bangladesh and in Bombay (India) the small number of street girls is thought to be because they face less physical violence in the home than boys (Conticini and Hulme,

Sposób percypowania roślin ze względu na ich cykl rozwojowy w języku mieszkańców wsi (Ziajka 2016: 510)... Umieszczenie zwierzęcia w kategorii istot starych dokonuje się w sposób

(i) Copy the tree diagram and add the four missing probability values on the branches that refer to playing with a stick.. During a trip to the park, one of the dogs is chosen

Let p, q be different

The expressions used in formal and informal letters have been mixed.. Decide if they are typical for formal (F) or informal

Czy istnieją i jak zmieniają się granice leczenia chirurgicznego miejscowo zaawansowanego i rozsianego raka nerki (metastatic Renal Cell Cancer – mRCC).. W

By means of a connected sum on the pair: (X, the Z m -manifold), along two points of ψ −1 (0), we can change the manifold so that the monodromy along a connected component of ψ −1