• Nie Znaleziono Wyników

DFN18-6X5-0.5P

N/A
N/A
Protected

Academic year: 2022

Share "DFN18-6X5-0.5P"

Copied!
2
0
0

Pełen tekst

(1)

© Semiconductor Components Industries, LLC, 2002

November, 2002 − Rev. 01A

1 Case Outline Number:

505 DFN18 6x5, 0.5P

CASE 505−01 ISSUE D

DATE 17 NOV 2006

SCALE 2:1

GENERIC MARKING DIAGRAM*

C 0.15

E2 D2

L

b

18X

A

XXXXX = Specific Device Code A = Assembly Location WL = Wafer Lot

YY = Year

WW = Work Week G = Pb−Free Package

XXXXXXXX XXXXXXXX AWLYYWW D

NOTES:

1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994.

2. DIMENSIONS IN MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL 4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

E

C

e

A B

DIM MIN MAX

MILLIMETERS

A 0.80 1.00 A1 0.00 0.05

A3 0.20 REF

b 0.18 0.30

D 6.00 BSC

D2 3.98 4.28

E 5.00 BSC

E2 2.98 3.28

e 0.50 BSC

K 0.20 −−−

L 0.45 0.65

C 0.15

PIN 1 LOCATION

A1 (A3)

SEATING PLANE

C 0.08

C 0.10

18X

K

18X

A 0.10 C B 0.05 C

NOTE 3

1 9

10 18

1 18

1

2X

2X

18X

SIDE VIEW TOP VIEW

BOTTOM VIEW

*This information is generic. Please refer to device data sheet for actual part marking.

Pb−Free indicator, “G” or microdot “ G ”, may or may not be present.

5.30

18X

3.24

0.75

18X

0.30 4.19

PITCH

DIMENSIONS: MILLIMETERS

0.50 1

SOLDERING FOOTPRINT

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

http://onsemi.com 1

© Semiconductor Components Industries, LLC, 2002

October, 2002 − Rev. 0

Case Outline Number:

XXX DOCUMENT NUMBER:

STATUS:

NEW STANDARD:

DESCRIPTION:

98AON11920D

ON SEMICONDUCTOR STANDARD

18 PIN DFN, 6X5 MM. 0.5 MM PITCH

Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped

“CONTROLLED COPY” in red.

PAGE 1 OF 2

(2)

DOCUMENT NUMBER:

98AON11920D

PAGE 2 OF 2

ISSUE REVISION DATE

O RELEASED TO PRODUCTION. REQ. BY P. CHAN 12 SEP 2002

A MODIFIED SIDE VIEW TO 9 LEAD INSTEAD OF 8. REQ. BY P. CHAN 20 NOV 2002 B CHANGED DIM b AND L. REMOVED DIM A3. CORRECTED MARKING DIAGRAM.

REQ. BY P. CELAYA.

29 JUN 2002

C ADDED SOLDERING FOOTPRINT. REQ. BY S. CLARK. 31 MAY 2006 D CORRECTED PITCH DIMENSION IN SOLDERING FOOTPRINT TO 0.50. REQ. BY

D. TRUHITTE.

17 NOV 2006

© Semiconductor Components Industries, LLC, 2006

November, 2006 − Rev. 01D

Case Outline Number:

505

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

Cytaty

Powiązane dokumenty

Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees,

Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees,

Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees,

Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees,

Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees,

Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries,

Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees,

Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees,