Type Ordering
Code
Tape and Reel Information
Pin Configuration Marking Package
1 2 3
BS 170 Q67000-S061 bulk S G D BS 170 TO-92
BS 170 Q67000-S076 E6288: 1500 pcs/reel;
2 reels/carton; gate first
Maximum Ratings
Parameter Symbol Values Unit
Drain-source voltage
V
DS 60 VDrain-gate voltage,
R
GS = 20 kΩV
DGR 60Gate-source voltage
V
GS ± 14Gate-source peak voltage, aperiodic
V
gs ± 20Continuous drain current,
T
A= 25 ˚CI
D 0.3 APulsed drain current,
T
A = 25 ˚CI
D puls 1.2Max. power dissipation,
T
A = 25 ˚CP
tot 0.63 WOperating and storage temperature range
T
j,T
stg – 55 … + 150 ˚CThermal resistance, chip-ambient
R
thJA ≤ 200 K/WSIPMOS
Small-Signal Transistor BS 170
1 2
3
1 2 3
●
V
DS 60 V●
I
D 0.3 A●
R
DS(on) 5.0 Ω●
V
GS(th) 0.8 … 2.0 V● N channel
● Enhancement mode
● Logic level
BS 170
Electrical Characteristics
at
T
j = 25 ˚C, unless otherwise specified.Parameter Symbol Values Unit
min. typ. max.
Static Characteristics
Drain-source breakdown voltage
V
GS = 0,I
D = 0.25 mAV
(BR)DSS60 – –
V
Gate threshold voltage
V
GS =V
DS,I
D = 1 mAV
GS(th)0.8 1.4 2.0
Zero gate voltage drain current
V
DS= 60 V,V
GS = 0T
j = 25 ˚CV
DS= 50 V,V
GS = 0T
j = 125 ˚CI
DSS–
–
0.05
–
0.5
5
µA
Gate-source leakage current
V
GS = 20 V,V
DS = 0I
GSS– 1 10
nA
Drain-source on-resistance
V
GS = 10 V,I
D = 0.2 AR
DS(on)– 2.5 5.0
Ω
Dynamic Characteristics Forward transconductance
V
DS≥ 2 ×I
D×R
DS(on)max,I
D = 0.2 Ag
fs0.12 0.18 –
S
Input capacitance
V
GS = 0,V
DS = 25 V,f
= 1 MHzC
iiss– 40 60
pF
Output capacitance
V
GS = 0,V
DS = 25 V,f
= 1 MHzC
oss– 15 25
Reverse transfer capacitance
V
GS = 0,V
DS = 25 V,f
= 1 MHzC
rss– 5 10
Turn-on time
t
on, (t
on =t
d(on) +t
r)V
DD = 30 V,V
GS = 10 V,R
GS = 50 Ω,I
D = 0.29 At
d(on) – 5 8 nst
r – 8 12Turn-off time
t
off, (t
off =t
d(off) +t
f)V
DD = 30 V,V
GS = 10 V,R
GS = 50 Ω,I
D = 0.29 At
d(off) – 12 16t
f – 17 22Package Outline
Electrical Characteristics (cont’d) at
T
j = 25 ˚C, unless otherwise specified.Parameter Symbol Values Unit
min. typ. max.
Reverse Diode
Continuous reverse drain current
T
A = 25 ˚CI
S– – 0.3
A
Pulsed reverse drain current
T
A = 25 ˚CI
SM– – 1.2
Diode forward on-voltage
I
F = 0.5 A,V
GS = 0V
SD– 0.9 1.2
V
TO-92
Bulk version Taped version
BS 170
Characteristics
at Tj = 25 ˚C, unless otherwise specified.
Total power dissipation
P
tot =f
(T
A)Typ. output characteristics
I
D =f
(V
DS) parameter:t
p = 80 µs
Safe operating area
I
D =f
(V
DS) parameter:D
= 0.01,T
C = 25 ˚CTyp. drain-source on-resistance
R
DS(on) =f
(I
D)parameter:
V
GSTyp. transfer characteristics
I
D =f
(V
GS) parameter:t
p= 80 µs,V
DS ≥ 2 ×I
D ×R
DS(on)max
Drain-source on-resistance
R
DS(on) =f
(Tj)parameter:
I
D = 0.2 A,V
GS = 10 V, (spread)Typ. forward transconductance
g
fs =f
(I
D) parameter:V
DS ≥ 2 ×I
D ×R
DS(on)max.,t
p = 80 µsTyp. capacitances
C
=f
(V
DS) parameter:V
GS = 0,f
= 1 MHzBS 170
Gate threshold voltage
V
GS(th) =f
(T
j) parameter:V
DS =V
GS,I
D = 1 mA, (spread)Drain current
I
D =f
(T
A) parameter:V
GS ≥ 5 VForward characteristics of reverse diode
I
F =f
(V
SD)parameter:
t
p= 80 µs,T
j,
(spread)
Drain-source on breakdown voltage
V
(BR)DSS =b
×V
(BR)DSS (25 ˚C)