DFN16, 4x1.6, 0.5P CASE 506AC
ISSUE D
DATE 22 AUG 2013
SCALE 4:1
NOTES:1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION b APPLIES TO TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
GENERIC MARKING DIAGRAM*
XXX = Specific Device Code A = Assembly Location
Y = Year
W = Work Week
G = Pb−Free Package
*This information is generic. Please refer to device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”, may or may not be present.
DIM MIN MAX MILLIMETERS A 0.80 1.00 A1 0.00 0.05 A3 0.20 REF
b 0.18 0.30
D 4.00 BSC
D2 3.10 3.30
E 1.60 BSC
E2 0.30 0.50
e 0.50 BSC
K 0.20 −−−
L 0.20 0.40
0.15 C
D
E B A
2X 2X
16X
A
A1 (A3) 0.15 C
PIN ONE REFERENCE
0.08 C 0.10 C
C
SEATING PLANE
D2
E2
BOTTOM VIEW b e
16X
0.10 B
0.05 A C C L
16X
K
16X
SIDE VIEW TOP VIEW
NOTE 3
1 8
9 16
1 16
XXX AYWG G
2X0.25 x 0.40 mm TEST PAD SIZE
(A3)
0.50
4.10 0.50 PITCH
1.91
0.51 0.28
16X16X
*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
(Note: Microdot may be in either location)
DETAIL A
L1
DETAIL A L
OPTIONAL CONSTRUCTION
L1 0.00 0.15
DIMENSION: MILLIMETERS
RECOMMENDED
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
http://onsemi.com 1
© Semiconductor Components Industries, LLC, 2002
October, 2002 − Rev. 0 Case Outline Number:
XXX DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
DESCRIPTION:
98AON19168D
ON SEMICONDUCTOR STANDARD
DFN16, 4.0X1.6 MM, 0.5 LEAD PITCH
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
PAGE 1 OF 2
DOCUMENT NUMBER:
98AON19168D
PAGE 2 OF 2
ISSUE REVISION DATE
O RELEASED FOR PRODUCTION. REQ. BY A. TAM. 13 SEP 2004
A CHANGED MARKING DIAGRAM. REQ. BY A. TAM. 07 JAN 2005
B ADDED SOLDERING FOOTPRINT. REQ. BY A. TAM. 08 JUN 2005
C ADDED DETAIL A AND DIMENSION L1. REQ. BY K. LIM. 14 JAN 2010 D ROTATED GENERIC MARKING DIAGRAM 90 DEGREES COUNTER−CLOCKWISE.
REQ. BY M. BEGONIA. 22 AUG 2013
© Semiconductor Components Industries, LLC, 2013
August, 2013 − Rev. D Case Outline Number:
506AC
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