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CP108

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Central

Semiconductor Corp.

PROCESS CP108

TM

Schottky Rectifier

Schottky Barrier Rectifier Chip - 2.0 Amp

PRINCIPAL DEVICE TYPES 1N5817

1N5818 1N5819 CXSH-4 CZSH-4

Process EPITAXIAL PLANAR

Die Size 52 X 52 MILS

Die Thickness 9 MILS

Anode Bonding Pad Area 47 X 47 MILS Top Side Metalization Al - 20,000Å Back Side Metalization Au - 10,000Å PROCESS DETAILS

R7 (1 -August 2002)

GEOMETRY

BACKSIDE CATHODE

145 Adams Avenue

Hauppauge, NY 11788 USA Tel: (631) 435-1110

Fax: (631) 435-1824 www.centralsemi.com

GROSS DIE PER 4 INCH WAFER 5,110

Central

Semiconductor Corp.

TM

(2)

Central

Semiconductor Corp.

Central

TM

Semiconductor Corp.

TM

The Typical Electrical Characteristics data for this chip is currently being revised.

For the latest updated data for this Chip Process, please visit our website at:

www.centralsemi.com/chip

PROCESS CP108

Typical Electrical Characteristics

145 Adams Avenue

Hauppauge, NY 11788 USA Tel: (631) 435-1110

Fax: (631) 435-1824

www.centralsemi.com R7 (1 -August 2002)

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