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T2514xKS T2516xKS

SNUBBERLESS TRIACS

Symbol Parameter Value Unit

IT(RMS) RMS on-state current (360°conduction angle) Tc = 85°C 25 A

ITSM Non repetitive surge peak on-state current

(Tj initial = 25°C) tp = 8.3ms 260 A

tp = 10ms 250

I2t I2t vakue for fusing tp = 10ms 312 A2s

dl/dt Critical rate of rise of on-state current IG = 500mA dlG/dt = 1A/µs

Repetitive F = 50Hz

20 A/µs

Non repetitive 100 Tstg

Tj

Storage and operating junction temperature range - 40 + 150 - 40 + 125

°C Tl Maximum lead temperature for soldering during 10s 260 °C ABSOLUTE RATINGS (limiting values)

RD107 (Plastic) IT(RMS)= 25A

HIGH COMMUTATION : (dl/dt)c≥12A/ms T2514xKS

≥ 22A/ms T2516xKS

INSULATING VOLTAGE = 2500V(RMS)

(UL RECOGNIZED : E81734) FEATURES

Symbol Parameter Voltage

Unit

D M S N

VDRM

VRRM

Repetitive peak off-state voltage Tj= 125°C

400 600 700 800 V

The T2514/T2516xKS series of isolated triacs uses a high performances MESA GLASS techno- logy.

The SNUBBERLESSTMconcept offer suppression of RC nerwork and it is suitable for application such as phase control and static switching on in- ductive or resistive load.

DESCRIPTION

A1

G A2

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PG (AV)= 1 W PGM= 10 W (tp = 20µs) IGM= 4 A (tp = 20µs) GATE CHARACTERISTICS (maximum values)

Symbol Parameter Value Unit

Rth(j-c) Junction to case for D.C 1.7 °C/W

Rth(j-c) Junction to case for A.C 360°conduction angle (F=50Hz) 1.3 °C/W THERMAL RESISTANCES

ORDERING INFORMATION

T 25 16 M KS

TRIAC MESA GLASS

CURRENT

PACKAGES :

KS = RD107 Insulated VOLTAGE

SENSITIVITY

Symbol Test Conditions Quadrant Sensitivity

Unit

14 16

IGT VD=12V (DC) RL=33Ω Tj= 25°C I-II-III MIN 2 mA

MAX 35 50

VGT VD=12V (DC) RL=33Ω Tj= 25°C I-II-III MAX 1.5 V VGD VD=VDRM RL=3.3kΩ Tj= 125°C I-II-III MIN 0.2 V

tgt VD=VDRM IT= 35A

IG= 500mA dlG/dt= 3Aµs

Tj= 25°C I-II-III TYP 2 µs

IH* IT= 250mA Gate open Tj= 25°C MAX 35 50 mA

IL IG= 1.2 IGT Tj = 25°C I-III TYP 35 50 mA

II TYP 70 100

VTM* ITM= 35A tp= 380µs Tj= 25°C MAX 1.5 V

IDRM

IRRM

VD= VDRM

VR= VRRM

Tj= 25°C MAX 10 µA

Tj= 125°C MAX 3 mA

dV/dt * VD=67%VDRM Gate open Tj= 125°C MIN 500 750 V/µs

(dI/dt)c * Without snubber Tj= 125°C MIN 12 22 A/ms

TYP 24 44

* For either polarity of electrode A2 voltage with reference to electode A1

ELECTRICAL CHARACTERISTICS

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0 2 4 6 8 10 12 14 16 18 20 22 24 26 0

5 10 15 20 25 30 35

180O

= 180o

= 120o

= 90o

= 60o

= 30o

T(RMS)

I (A)

P(W)

Fig.1 : Maximum RMS power dissipation versus average on-state current.

0 10 20 30 40 50 60 70 80 90 100 110 120 130 0

5 10 15 20 25 30

= 180o

Tcase ( C)o

I (A)

T(RMS)

Fig.3 : RMS on-state current versus case tempera- ture.

2.6 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4

Igt

Ih

-40 -20 0 20 40 60 80 100 120 140

Igt[Tj]

Igt[Tj=25 C]o Ih[Tj]

Ih[Tj=25 C]o

Fig.5 : Relative variation of gate trigger current and holding current versus junction temperature.

0 20 40 60 80 100 120 140

0 5 10 15 20 25 30

35 o

o o o

P (W)

-85 -95 -105 -115 -125 Rth = 0 C/W

0.75 C/W 1.5 C/W 2.5 C/W

Tamb ( C)o

Tcase ( C)o

Fig.2 : Correlation between maximum RMS power dissipation and maximum allowable temperature (Tamb and Tcase) for different thermal resistances heatsink + contact).

tp( s)

1E-3 1E-2 1E-1 1E +0 1 E +1

0.01 0.1 1

Zth(j-c)/Rth(j-c)

Fig.4 : Relative variation of thermal impedance junction to case versus pulse duration.

1 10 100 1000

0 50 100 150 200 250

Tj initial = 25 Co

Number of cycles ITSM(A)

Fig.6 : Non repetitive surge peak on-state current versus number of cycles.

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ITSM(A). I2t (A2s)

1 10

10 100 1000

Tj initial = 25 Co ITSM

tp(ms) I2t

Fig.7 : Non repetitive surge peak on-state current for a sinusoidal pulse with width : tp≤10ms, and corresponding value of I2t.

0 0.5 1 1.5 2 2.5 3 3.5 4 4.5

0.1 1 10 100 1000

ITM(A)

Tj initia l 25 Co

Tj max

Tj max Vto =0.92 V Rt =0. 0145

VTM(V)

Fig.8 : On-state characteristics (maximum values).

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PACKAGE MECHANICAL DATA RD107 (Plastic)

A K a1 a2

G H

B F b1

C

L

c2 c1

E J I

REF.

DIMENSIONS Millimeters Inches Typ. Min. Max. Typ. Min. Max.

A 40.0 1.575

a1 29.9 30.3 1.177 1.193

a2 22.0 0.867

B 27.0 1.063

b1 24.0 0.945

C 14.0 0.552

c1 3.5 0.138

c2 1.95 3.0 0.767 0.118

E 0.75 0.85 0.029 0.033

F 4.0 4.5 0.157 0.177

G 0.45 0.55 0.018 0.022

H 6.2 6.3 0.244 0.248

I 4.7 4.8 0.185 0.189

J 9.5 11.7 0.374 0.461

K 11.35 0.446

L 1.4 1.6 0.551 0.630

Marking : type number Weight : 20g

Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.

SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics.

1995 SGS-THOM SON Microelectronics - Printed in Italy - All rights reserved.

SGS-THOMSON Microelectronics GROUP OF COMPANIES

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