SOIC8−NB EP CASE 751BU
ISSUE E
DATE 01 APR 2015
SEATING PLANE
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.10mm IN EXCESS OF MAXIMUM MATERIAL CONDITION.
4. DIMENSION D DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15mm PER SIDE. DIMENSION E DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25mm PER SIDE. DIMENSIONS D AND E ARE DETERMINED AT DATUM F.
5. DIMENSIONS A AND B ARE TO BE DETERMINED AT DATUM F.
6. A1 IS DEFINED AS THE VERTICAL DISTANCE FROM THE SEATING PLANE TO THE LOWEST POINT ON THE PACKAGE BODY.
7. TAB CONTOUR MAY VARY MINIMALLY TO INCLUDE TOOLING FEATURES.
A SCALE 1:1
DIM MIN MAX
MILLIMETERS
G 1.55 2.39
A 1.35 1.75
b 0.31 0.51
e 1.27 BSC
A1 0.00 0.10 b1 0.28 0.48
h 0.25 0.50
C 0.25
MGENERIC MARKING DIAGRAM*
*This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G”, may or not be present.
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
L2 0.25 BSC
A
TOP VIEW C
0.20
A-B D C 0.10
NOTE 5
C 0.10 b
8X
B
C
8X
SIDE VIEW
END VIEW
DETAIL A
7.00
8X
1.52
8X
0.76 1.27
PITCH
RECOMMENDED
1
L F
SEATING PLANE
DETAIL A D
1 8
L2
A1
C
NOTE 6
1
4 5 8
C 0.10 A-B
NOTE 5
e
NOTE 7
F
G
BOTTOM VIEW
2.60 2.60
c 0.17 0.25
L 0.40 1.27
XXXXX = Specific Device Code A = Assembly Location L = Wafer Lot
Y = Year
W = Work Week G = Pb−Free Package
XXXXXXXXX ALYWX
G 1 8
2X
NOTE 4 2X 4 TIPS
C 0.10
2X NOTE 4
h
c1 0.17 0.23
F 1.55 2.39
D 4.90 BSC
E 6.00 BSC
E1 3.90 BSC
E E1
D
D
B
ÇÇÇ
ÇÇÇ
ÇÇÇ
SECTION B−B c c1
b b1
ÉÉÉ
ÉÉÉ
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
http://onsemi.com 1
© Semiconductor Components Industries, LLC, 2002
October, 2002 − Rev. 0
Case Outline Number:
XXX DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
DESCRIPTION:
98AON66222E
ON SEMICONDUCTOR STANDARD
SOIC8−NB EP
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
PAGE 1 OF 2
DOCUMENT NUMBER:
98AON66222E
PAGE 2 OF 2
ISSUE REVISION DATE
O RELEASED FOR PRODUCTION. REQ. BY I. CAMBALIZA. 03 JAN 2012 A CORRECTED EXPOSED DIMENSIONS. REQ. BY I. CAMBALIZA. 12 APR 2012 B CORRECTED SIDE VIEW LABEL A TO REFLECT FROM TOP OF PACKAGE TO
SEATING PLANE. REQ. BY I. CAMBALIZA.
30 AUG 2012
C CHANGED MAX VALUE FOR DIMENSIONS F AND G FROM 3.07 TO 2.39. REQ.
BY B. LOFTS.
17 JUL 2013
D CHANGED EXPOSED PAD IN SOLDER FOOTPRINT TO 2.6X2.6. REQ. BY B.
LOFTS.
23 JUL 2013
E CHANGED DIMENSION A1 MIN FROM −−− TO 0.00. REQ. BY B. LOFTS. 01 APR 2015
© Semiconductor Components Industries, LLC, 2015
April, 2015 − Rev. E
Case Outline Number:
751BU
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