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BAS17

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Type Ordering Code Pin Configuration Marking Package (tape and reel) 1 2 3

BAT 17 BAT 17-04 BAT 17-05 BAT 17-06

Q62702-A504 Q62702-A775 Q62702-A776 Q62702-A777

A A A C

– C A C

C C/A C/C A/A

53 54 55 56

SOT-23

Maximum Ratings

Parameter Symbol Values Unit

Reverse voltage

V

R 4 V

Forward current

I

F 130 mA

Total power dissipation

T

S≤ 60 °C

P

tot 150 mW

Junction temperature

T

j 150 °C

Operating temperature range

T

op – 55 … + 150 °C Storage temperature range

T

stg – 55 … + 150 °C Thermal Resistance

Junction-ambient1)

R

th JA ≤ 750 K/W

Junction-soldering point

R

th JS ≤ 590 K/W

1) Package mounted on an epoxy pcb 40 mm x 40 mm x 1.5 mm/1cm2 Cu.

Silicon Schottky Diode BAT 17…

For mixer applications in the VHF/UHF range

For high-speed switching

Semiconductor Group 1 10.94

(2)

Semiconductor Group 2

BAT 17…

Electrical Characteristics

at

T

A = 25 °C, unless otherwise specified.

Package Outline

Parameter Symbol Value Unit

min. typ. max.

DC Characteristics Breakdown voltage

I

R = 10 µA

V

(BR)

4 – –

V

Reverse current

V

R = 3 V

V

R = 3 V,

T

A = 60 °C

V

R = 4 V

I

R

– – –

– – –

0.25 1.25 10

µA

Forward voltage

I

F = 0.1 mA

I

F = 1 mA

I

F = 10 mA

V

F

200 250 350

275 340 425

350 450 600

mV

Diode capacitance

V

R = 0 V

f

= 1 MHz

C

T

– 0.75 1

pF

Differential forward resistance

I

F = 5 mA,

f

= 10 kHz

r

S

– 8 15

SOT-23

(3)

Semiconductor Group 3

BAT 17…

Forward current

I

F =

f

(

V

F)

Diode capacitance

C

T =

f

(

V

R)

f

= 1 MHz

Reverse current

I

R =

f

(

V

R)

Differential forward resistance

R

F =

f

(

I

F)

f

= 10 kHz

(4)

Semiconductor Group 4

BAT 17…

Forward current

I

F =

f

(

T

A;

T

S*)

*Package mounted on aluminum

Cytaty

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