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BU931Z

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rz 7 S C S -TH O M S O N

^ 7 # H £ i B @ i i ! J ( m © r a r a B U 9 3 1 Z / Z P / Z P F I

NPN PO W ER D A R LIN G TO N

■ HIGH RUGGEDNESS

■ INTEGRATED HIGH VOLTAGE ZENER

AU TO M O TIVE MARKET

■ APPLICATION IN HIGH PERFORMANCE ELECTRONIC CAR IGNITION

DESCRIPTION

The BU931Z. BU931ZP and BU931ZPFI are silicon multiepitaxial biplanar NPN transistors in monolithic darlington configuration mounted respectively in TO-3 metal case, SOT-93 plastic package and ISO- WATT218 fully isolated package.

ISOWATT 218

INTERNAL SCH EM ATIC DIAGRAM c

ABSOLUTE MAXIMUM RATINGS

Symbol Parameter Value Unit

Vq bO Collector-base Voltage (Ie =0) 350 V

< O m n Collector-emitter Voltage (Rbe = 100 £2) 350 V

V cE S Collector-emitter Voltage (Vbe = 0) 350 V

V cE O Collector-emitter Voltage ( Ib = 0 ) 350 V

Ve b o Emitter-base Voltage ( lc = 0) 5 V

lc Collector Current 20 A

Ib Base Current 5 A

TO -3 SO T-93 ISOWATT21 8

P tot Total Dissipation at Tc £ 25 °C 175 125 60 W

T stg Storage Temperature - 40 to 200 - 40 to 150 - 40 to 150 °C

T| Max. Operating Junction Temperature 200 150 150 °C

October 1988 1/4

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BU931Z/ZP/ZPFI

THERMAL DATA

TO -3 SOT-93 ISO W ATT218

Rth j-case Thermal Resistance Junction-case Max 1 1 2.08- °C/W

ELECTRICAL CHARACTERISTICS (Tcase = 25 “C unless otherwise specified)

Symbol Parameter Test Conditions Min. Typ. Max. Unit

•CL Clamping Current Vce =350

either Ib = 0 250 pA

or > LUm II o 250 pA

lcE (o ff) Collector-emitter off State Vcc =16 V T j = 125 °C 0.5 mA

Current (Ib = 0) VBE =300 mV Iebo Emitter Cutoff Current

d c =0) VEB = 5 V 50 mA

<O Clamping Voltage either Ib = 0 or Vbe = C

and lc = 100 mA 350 500 V

same Tj = 125 °C 350 500 V

V cE (sa t)* Collector-emitter Saturation lc = 7 A Ib =70 mA 1.25 1.6 V

Voltage lc = 8 A Ib =100 mA 1.45 1.8 V

lc = 10 A Ib =150 mA 1.65 2 V

Tj = 125 °C

l c = 7 A lB = 7 0 mA 1.6 V

l c = 8 A Ib = 100 mA 1.8 V

lc = 1 0 A l B = 150 mA 2 V

VB E(sat)* Base-emitter Saturation lc = 8 A Ib = 100 mA 2.2 V

Voltage lc =10 A lB =250 mA 2.5 V

VB E(on)* Base-emitter Voltage l c = 5 A VCE = 2 V 1.67 V

T, = - 40 °C 2.1 V

T j = 125 °C 1.1 V

lc =10 A VCE = 2 V 2 V

T j = - 40 °C 2.4 V

T j = 125 °C 1.4 V

Vf* Diode Forward Voltage If = 10 A 2.5 V

E s /b Second Breakdown Energy

Unclamped L = 10 mH l c = 10 A 500 mJ

I s/b Second Breakdown Collector <o II CO o

Current t = 500 ms for BU931Z 6 A

t = 250 ms for BU931ZP 4 A

t = 250 ms for BU931ZPFI 1.7 A

USE TEST (see fig. 2) Vcc = 24 V L = 7 mH 8 A

* Pulsed : pulse duration = 300 us, duty cycle = 1.5 %.

G f7

SCS-THOMSON BsicKBoisBirimjocs 2/4

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BU931Z/ZP/ZPFI

Safe Operating Areas. DC Current Gain.

Collector-emitter Saturation Voltage. Collector-emitter Saturation Voltage.

V CEt*atl IV)

L5

0 5

hFE=60

/

/

7LZ

- 4 0 ^ 2t

7

2 5 ^ ^ I2 5 - :

Base-emitter Saturation Voltage. Base-emitter Saturation Voltage.

SCS-THOMSON MOMBiseimwoei

3/4

(4)

BU931Z/ZP/ZPFI

Collector-emitter Saturation Voltage.

0 5 0 lo o I5 0 IglmA)

Figure 1 : Functional Test Circuit.

ISOWAT T 218 PAC KAGE CH A R A C T E ­ RISTICS AND APP LICAT ION

ISOWATT218 is fully isolated to 4000 V dc. Its ther­

mal impedance, given in the data sheet, is optimi­

zed to give efficient thermal conduction together with excellent electrical isolation.

The structure of the case ensures optimum dis­

tances between the pins and heatsink. These dis­

tances are in agreement with VDE and ULcreepage and clearance standards. The ISOWATT218 package eliminates the need for external isolation so reducing fixing hardware.

The package is supplied with leads longer than the standard TO-218 to allow easy mounting on pcbs.

Accurate moulding techniques used in manufacture assures consistent heat spreader-to-heatsink capa­

citance.

ISOWATT218 thermal performance is better than that of the standard part, mounted with a 0.1 mm mica washer. The thermally conductive plastic has a higher breakdown rating and is less fragile than mica or plastic sheets. Power derating for ISO- WATT218 packages is determined by :

THERM AL IMPE DANCE OF ISO WAT T 218 PACKAGE

Fig. 3 illustrates the elements contributing to the thermal resistance of transistor heatsink assembly, using ISOWATT218 package.

The total thermal resistance Rth(tot) is the sum of each of these elements.

The transient thermal impedance, Zth for different pulse durations can be estimated as follows : 1. for a short duration power pulse less than 1 ms ;

Zth RthJ-C

2. for an intermediate power pulse of 5 ms to 50 m s : Zth = RthJ-C

3. for long power pulses of the order of 500 ms or gre ater:

Zth = RthJ-C + RthC-HS + RthHS-amb It is often possible to discern these areas on tran­

sient thermal impedance curves.

Figure 3.

R thJ-C R thC-HS RthHS-amb

- A A A ^ W W W V -

4/4 S=7 SGS-THOMSON

MocnoajBmiNMcs

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