GMilO(g(a@ilLiCT©IRgD©i________M74HC367/368
HEX BUS BUFFER (3-STATE) HC367 NON-INVERTING, HC368 INVERTING
■ HIGH SPEED
tpD = 13 ns (TYP.) at V cc = 5V
■ LOW POWER DISSIPATION Ice = 4 /iA (MAX.) at TA = 25°C 6V
■ HIGH NOISE IMMUNITY V N|H = V
n il= 28
o/
oVCC (MIN).
■ OUTPUT DRIVE CAPABILITY 15 LSTTL LOADS
■ SYMMETRICAL OUTPUT IMPEDANCE M
o hI = I
ol= 6 mA (MIN.)
■ BALANCED PROPAGATION DELAYS tpLH = tPHL
■ WIDE OPERATING VOLTAGE RANGE V ec (OPR) = 2V to 6V
■ PIN AND FUNCTION COMPATIBLE WITH 54/74LS367/368
DESCRIPTION
The M54/74HC367 and the M54/74HC368 are high speed CMOS HEX BUS BUFFER (3-STATE) fabri
cated in silicon gate C2MOS technology. They ha
ve the same high speed performance of LSTTL combined with true CMOS low power consumption.
These devices contain six buffers, four buffers are controlled by an enable input ( S i) and the other two buffers are controlled by the other enable in
put (G2); the outputs of each buffer group are ena
bled when S T and/or G2 inputs are held low, and when held high these outputs are disabled to be high-impedance.
These outputs are capable of driving up to 15 LSTTL loads. The designer has a choice of non
inverting outputs (HC367) and inverting outputs (HC368).
All inputs are equipped with protection circuits against static discharge and transient excess v o l t a g e .
TRUTH TABLE
INPUTS OUTPUTS
G An Yn (367) Yn (368)
L L L H
L H H L
H X Z Z
X: DON'T CARE Z: HIGH IMPEDANCE
October 1988
B1N F1
Plastic Package Ceramic Frit Seal Package
V *
M1 C1
Micro Package Plastic Chip Carrier ORDERING NUMBERS:
M54HCXXX F1 M74HCXXX C1
M74HCXXX B1N M74HCXXX F1
M74HCXXX M1
PIN CONNECTIONS (top view)
51HC367 1A Ty
2A 2Y
3 A
3Y
GNO
HC368 6i
1A 1Y
2A
2Y
3 A
3 Y
GND
1/5
CHIP CARRIER
NC = No internal Connection
ABSOLUTE MAXIMUM RATINGS
Sym bol Parameter Value Unit
VCC Supply Voltage - 0 . 5 to 7 V
V| DC Input Voltage — 0.5 to Vqq + 0.5 V
Vo DC Output Voltage — 0.5 to Vqq + 0.5 V
l|K DC Input Diode Current ± 20 mA
lOK DC Output Diode Current ± 20 mA
'O DC Output Source Sink Current Per Output Pin ± 35 mA
ICC or !gND DC V c c or Ground Current ± 70 mA
Pd Power Dissipation 500 C) mW
Tstg Storage Temperature - 6 5 to 150 °C
Absolute Maximum Ratings are those values beyond which damage to the device may occur. Functional operation un
der these condition is not implied.
(*) 500 mW: = 65°C derate to 300 mW by 10 mW /°C: 65°C to 85°C
RECOMMENDED OPERATING CONDITIONS
Sym bol Parameter Value Unit
VCC Supply Voltage 2 to 6 V
V| Input Voltage 0 to V c c V
Vo Output Voltage 0 to V c c V
Ta
^ _ , 74HC Series
Operating Temperature 54RC Ser|es - 4 0 to 85
- 5 5 to 125 » c
tr, tf Input Rise and Fall Time
>> >inCkJJ^CD
OO> 0 to 1000
O to 500 0 to 400
ns
2/5
SGS-THOMSON
DC SPECIFICATIONS
Symbol Parameter V cc Test C ondition
TA = 25°C 54HC and 74HC
- 4 0 to 85°C 74HC
- 5 5 tO l2 5 °C 54HC Unit
Min. Typ. Max. Min. Max. Min. Max.
V|H High Level Input 2.0 1.5 — — 1.5 — 1.5 —
Voltage 4.5 3.15 — — 3.15 — 3.15 — V
6.0 4.2 — — 4.2 — 4.2 —
V|L Low Level Input 2.0 — — 0.5 — 0.5 — 0.5
Voltage 4.5 — — 1.35 — 1.35 — 1.35 V
6.0 — — 1.8 — 1.8 — 1.8
VOH High Level Output 2.0 Vi •o
1.9 2.0
_
1.9_
1.9_
Voltage 4.5 VlH - 2 0 fiA 4.4 4.5 — 4.4 — 4.4 — V
6.0 or 5.9 6.0 — 5.9 — 5.9 —
4.5 V|L - 6 . 0 mA 4.18 4.31 — 4.13 — 4.10 —
6.0 - 7 . 8 mA 5.68 5.8 — 5.63 — 5.60 —
VoL Low Level Output 2.0 — 0.0 0.1 — 0.1 — 0.1
Voltage 4.5 V|H 20 \ iA — 0.0 0.1 — 0.1 — 0.1 V
6.0 or — 0.0 0.1 — 0.1 — 0.1
4.5 V|L 6.0 mA — 0.17 0.26 — 0.33 — 0.40
6.0 7.8 mA — 0.18 0.26 — 0.33 — 0.40
l| Input Leakage 6.0 V| = Vc c or GND — — ±0.1 — ± 1 .0 — ± 1 .0 «A Current
•oz 3-State Output 6.0
V| =
V|H or V|L — — ± 0 .5 — ± 5 .0 — ± 1 0 4A Off-State Current V0 = V c c or GNDIcc Quiescent Supply 6.0 V| = VCc or GND — — 4 — 40 — 80 /*A
Current o II o
INPUT AND OUTPUT EQUIVALENT CIRCUIT
SCS-THOMSON
V / . -
3/5
AC ELECTRICAL CHARACTERISTICS (CL = 50pF, Input tr = tf = 6ns)
T / = 25 °C - 4 0 to 85°C - 55 tO l2 5 °C S ym bol Parameter V cc Test C ond ition 54HC and 74HC 74HC 54HC Unit
Min. Typ. Max. Min. Max. Min. Max.
tTLH
Output Transition 2.0 — 22 60 — 75 — 90tTHL
Time 4.5 — 8 12 — 15 — 18 ns6.0 — 7 10 — 13 — 15
tpLH
Propagation Delay 2.0 — 60 120 — 150 — 180tpHL
Time * 4.5 — 15 24 — 30 — 36 ns6.0 — 13 20 — 26 — 31
tpLH
Propagation Delay 2.0 — 56 115 — 145 — 175tPHL
Time ** 4.5 — 14 23 — 29 — 35 ns6.0 — 12 20 — 25 — 30
tpZL Output Enable 2.0 — 60 120 — 150 — 180
tpZH
Time 4.5 Rl = 1KO — 15 24 — 30 — 36 ns6.0 — 13 20 — 26 — 31
tpLZ Output Disable 2.0 — 63 150 — 190 — 225
(PHZ
Time 4.5 Rl = 1KS2 — 20 30 — 38 — 45 ns6.0 — 18 26 — 33 — 38
C|N Input Capacitance
—
- 5 10 - 10 — 10COUT
Output pFCapacitance — — 10 — — — — —
Cpd Power Dissipation — HC 367 — 34 — — — — —
Capacitance — HC 368 - 32 - — - -
—
PFNote (t) CpD is defined as the value of the IC’s internal equivalent capacitance which is calculated from the operating current consumption without load. (Refer to Test Circuit)
Average operating current can be obtained by the following equation.
lCC(opr)= CPD ■ VCC • f|N + lCC/6 (Per circuit).
* For M54/74HC367 only
** For M54/74HC368 only
SCS-THOMSON
4/5SWITCHING CHARACTERISTICS TEST WAVEFORM
(G=” L") 6ns 6ns
NOTE: SUCH A LOGIC LEVEL SHALL BE APPLIED TO EACH INPUT THAT THE OUTPUT VOLTAGE STAYS IN THE APPOSITE SIDE TO THE SWITCH CONNECTION LEVEL, WHEN THE OUTPUT IS ENABLE
TEST CIRCUIT lCc (Opr.)
INPUT WAVEFORM IS THE SAME AS THAT IN CASE OF SWITCHING CHARACTERISTICS TEST
CPD CALCULATION
Cpo is to be calculated with the following formula by using the measured value of Ice (Opr.) in the test circuit opposite
„ ICC (O P r ) PD f|N ' V c c
In determining the typical value of Cpo, a relatively high frequency of 1 MHz was applied to f|N, in order to eliminate any error caused by the quiescent supply current.
5 , 7
SGS-THOMSON
M0«K^(KW.5M(ES
5/5