• Nie Znaleziono Wyników

BLF175

N/A
N/A
Protected

Academic year: 2022

Share "BLF175"

Copied!
4
0
0

Pełen tekst

(1)

tJ

L/-*ioauet±, Line.

20 STERN AVE.

SPRINGFIELD, NEW JERSEY 07081 U.S.A.

HFA/HF power MOS transistor

TELEPHONE: (973) 376-2922 (212)227-6005 FAX: (973) 376-8960

BLF175

FEATURES

• High power gain

« Low intermodulation distortion

• Easy power control

• Good thermal stability

• Withstands full load mismatch

• Gold metallization ensures excellent reliability.

DESCRIPTION

Silicon N-channel enhancement mode vertical D-MOS transistor designed for large signal amplifier applications in the HF/VHF frequency range.

The transistor has a 4-lead, SOT123A flange package, with a ceramic cap.

All leads are isolated from the flange.

A marking code, showing gate-source voltage (Vcs) information is provided for matched pair applications. Refer to the handbook 'General' section for further information.

PIN CONFIGURATION

Fig.1 Simplified outline and symbol.

PINNING -SOT123A PIN

1 2 3 4

DESCRIPTION drain

source gate source

QUICK REFERENCE DATA

RF performance at Th = 25 °C in a common source test circuit.

MODE OF OPERATION class-A

class-AB CW, class-B

f (MHZ)

28 28 108

VDS (V) 50 50 50

IDQ (mA)

800 150 30

PL (W) 8 (PEP) 30 (PEP)

30

Gp

(dB)

>24 typ. 24 typ. 20

>1D

(%) -

typ. 40<1>

typ. 65

d3

(dB)

<-40 typ. -35

- Note

1. 2-tone efficiency.

NJ Semi-Conductors reserves the right to change test conditions, parameter limits and package dimensions without notice. Information furnished by NJ Semi-Conductors is believed to be both accurate and reliable at the time of going to press. However. NJ Semi-Conductors assumes no responsibility for any errors or omissions discovered in its use.

NJ Semi-Conductors encourages customers to verify that datasheets are current before placing orders.

Quality Semi-Conductors

(2)

HF/VHF power MOS transistor BLF175

LIMITING VALUES

In accordance with the Absolute Maximum System (IEC 60134).

SYMBOL VDS

±VGS

ID

Ptot

Tstg

Tj

PARAMETER drain-source voltage gate-source voltage DC drain current total power dissipation storage temperature junction temperature

CONDITIONS

Tmb < 25 °C

MIN.

- - - - -65 -

MAX.

125 20 4 68 +150 200

UNIT V V A W

O/"4

!C

THERMAL CHARACTERISTICS

SYMBOL

Rthj-mb Rth mb-h

PARAMETER

thermal resistance from junction to mounting base thermal resistance from mounting base to heatsink

CONDITIONS Tmb = 25 °C; Ptot = 68 W Tmb = 25 °C; Ptot = 68 W

VALUE 2.6 0.3

UNIT K/W K/W

10

b

(A)

1

10~1

1

(1) Cur (2) Tmb

MRAS05

-2-

f

/

i f

4- -\ ^

\.

\

— S. J

)

10 VDS(V) 1°2

ent is this area may be limited by RDSOO

= 25 "C.

Fig.2 DC SOAR.

100

ptot (W) 80

60

40

20

0

(1) Con (2) Sho

\h.

X

\>

~\'

j ~"

<

2)\

^ X,

X \s

MSP063

40 80 120 T , _ 160

Th < c>

inuous operation.

1-time operation during m smatch.

Fig.3 Power derating curves.

(3)

HF/VHF power MOS transistor BLF175

CHARACTERISTICS

Tj = 25 1JC unless otherwise specified.

SYMBOL

V(BR)DSS

loss IGSS

Vcsth

AVGS

9fs RDSOR IDSX

Cis

Cos Crs

PARAMETER drain-source breakdown voltage drain-source leakage current gate-source leakage current gate-source threshold voltage gate-source voltage difference of matched pairs

forward transconductance drain-source on-state resistance on-state drain current

input capacitance output capacitance feedback capacitance

CONDITIONS ID= 100 mA; VGS = 0 VGS = 0; VDS = 50 V

±VGS = 20 V; VDS = 0 ID= 10mA; VDS = 10V ID= 10mA; VDS = 10V

b = 1 A; VDS = 10V ID= 1 A; VGS = 10V VGS = 10 V; VDS = 10V VGs = 0;VDs = 5 0 V ; f = 1 MHz VGs = 0; VDS = 5 0 V ; f = 1 MHz VGs = 0; VDs = 5 0 V ; f = 1 MHz

MIN.

125 - - 2

1.1 - - - - -

TYP.

- - - -

1.6 0.75 5.5 130 36 3.7

MAX.

- 100

1

4.5 100

- 1.5 - - - -

UNIT V HA uA V mV

S Q A PF PF PF

group indication

GROUP

A B C D E F G H J K L M N

LIMITS (V) MIN.

2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2

MAX.

2.1 2.2 2.3 2.4 2.5 2.6 2.7 2,8 2.9 3.0 3.1 3.2 3.3

GROUP

O P Q R S T U V

w

X Y

z

LIMITS (V) MIN.

3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 4.1 4.2 4.3 4.4

MAX.

3.4 3.5 3.6 3.7 3.8 3.9 4.0 4.1 4.2 4.3 4.4 4.5

(4)

HFA/HF power MOS transistor BLF175

PACKAGE OUTLINE

Flanged ceramic package; 2 mounting holes; 4 leads SOT123A

- D

5 10 mm i i i i _ , i scale

DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT

inches A

7,47 6.37 ,294 .251

b

582 5.56 0.229 0,219

c 018 010 0007 0.004

D

973 9.47 0.383 0373

°1 978 942 0385 0371

F

272 231 0107 0.091

H

20,71 1993 0815 0785

P

3.33 1 3,04 0,131 0.120

Q

4,63 4.11 0.182 0.162

q

18.42

0.725

Cytaty

Powiązane dokumenty

kNN do klasyfikacji – predykcja klasy dla nowego przykładu odbywa się na podstawie informacji na temat sąsiadów regresją liniową do regresji – predykcja wartości dla

Finally, Markiewicz notes that Nycz at first advocates an aspectual and perspective-oriented method of literary history, while later he proposes to describe the

The variations seen between devices fabricated in different grains using the -Czochralski process can therefore be characterized in a circuit context through the fabrication

NJ Semi-Conductors encourages customers to verify that datasheets are current before placing orders.

dtiigntd to tniblt tht tnglnttr to &#34;program&#34; unijunction char acltrltl lei wen «i Bog, ij, ly, ind Ip by merely selecting two rnvitor vulirni.. Hnxvevcr M Scini-C

Pragnie jednak, by człowiek z własnej woli sam najpierw do Niego się zwrócił, aby skierował do Niego modlitwę, która jest jakby kluczem do jego Miłosierdzia.. Bóg przybrał

Dalej opowieść o kloszardzie rozwija się nadspodziewanie sprawnie, czemu sprzyja jego sen kamienny, jak gdyby „sarkofagową pozę&#34; wziął z wnętrza katedry, natomiast

w ogóle nie mają zastosowania, chociaż są formalnie recypowane (należy to uznać za błąd techniki legislacyjnej), b. przepisy, które stosuje się do u.k.s. przepisy, które