DS100TB211

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PRODUCTPREVIEW

DS100TB211

www.ti.com SNLS405 – MARCH 2012

DS100TB211

PRODUCT BRIEF Low Power, Dual Lane Thunderbolt Retimer

Check for Samples:DS100TB211

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FEATURES • Programmable output polarity inversion

• Input signal detection, CDR lock

2

• Dual Lane (4 channels, bi-directional)

detection/indicator

• Typical Power Dissipation (EQ+CDR+DE): 500

• On-chip Eye Monitor (EOM), PRBS generator mW

• Single 2.5 V ±5% power supply

• Locks to 10.3125 Gbps with 64b/66b encoding

• I2C/SMBus based register configuration

• Fast lock CDR without reference clock

• Internal loopback: host and cable side

APPLICATIONS

• Adaptive equalization up to 34 dB boost at 5

• Active cable assembly for Thunderbolt: 2m+, GHz

40-AWG

• Adjustable transmit V

_OD

: 600 to 1200 mVp-p

• Thunderbolt docking stations and accessories

• Adjustable transmit de-emphasis to -12 dB

DESCRIPTION

The DS100TB211 is a dual lane low power bi-directional retimer with integrated signal conditioning for Thunderbolt cable and peripheral applications. The DS100TB211 includes a fully adaptive input Continuous Time Linear Equalizer (CTLE), clock and data recovery (CDR) and output de-emphasis (DE) driver to ensure an error free operation over 2m+ of thin, inexpensive 40-AWG copper cable with multiple connectors. Each channel of the DS100TB211 independently locks to serial data of 10.3125 Gbps (64b/66b encoded) without the need for an external reference clock - This simplifies system design and lowers overall cost.

Advanced cable diagnostic features such as on-chip receiver eye processing on each of the input channel reduce manufacturing cost and time. Offered in a tiny 5mm x 5mm QFN package and powered using a single 2.5v power supply, the DS100TB211 consumes less than 250 mW per bi-directional lane and can be implemented on a 6-layer paddle card board design. The programmable settings can be applied easily using the I2C/SMBus interface.

Notice: This document is not a full datasheet. For more information regarding this product or to order samples please contact your local Texas Instruments sales office or visit http://www.ti.com

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice.

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PRODUCTPREVIEW

PADDLE CARD

Thunderbolt Host

Thunderbolt Peripheral Interconnect

Cable DS100TB211

RXP0 RXN0

RXP1 RXN1

TXP2

TXN2

TXP3 TXN3

TXP0 TXN0

TXP1 TXN1

RXP2 RXN2

RXP3 RXN3

DS100TB211 RXN3 RXP3

RXN2 RXP2

TXN1

TXP1

TXN0 TXP0

TXN3

TXP3

TXN2 TXP2

RXN1 RXP1

RXN0 RXP0

Voltage Regulator

Micro Controller

I2C/SMBUS 2.5V

PADDLE CARD

Voltage Regulator

Micro Controller

I2C/SMBUS 2.5V

DS100TB211

SNLS405 – MARCH 2012 www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

Typical Application Diagram

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PACKAGE OPTION ADDENDUM

www.ti.com 6-Feb-2013

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package Drawing

Pins Package Qty Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp

(3)

Op Temp (°C) Top-Side Markings

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Samples

DS100TB211SQ/NOPB PREVIEW WQFN RSB 40 1000 TBD Call TI Call TI

DS100TB211SQE/NOPB PREVIEW WQFN RSB 40 250 TBD Call TI Call TI

DS100TB211SQX/NOPB PREVIEW WQFN RSB 40 4500 TBD Call TI Call TI

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) Only one of markings shown within the brackets will appear on the physical device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

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IMPORTANT NOTICE

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