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Delft University of Technology

MEMS-Electronics Integration

A Smart Temperature Sensor for an Organ-on-a-chip Platform

Martins da Ponte, Ronaldo; Giagka, Vasso; Serdijn, Wouter

Publication date 2017

Document Version Final published version

Citation (APA)

Ponte, R. M., Giagka, V., & Serdijn, W. A. (2017). MEMS-Electronics Integration: A Smart Temperature Sensor for an Organ-on-a-chip Platform. 1-1. Abstract from DMD Europe 2017 - Design of Medical Devices Conference, Eindhoven, Netherlands.

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(2)

MEMS

ͲElectronicsIntegration:ASmartTemperatureSensorforan

Organ

ͲonͲaͲchipPlatform

RonaldoM.Ponte,VasilikiGiagka,WouterA.Serdijn

MicroelectronicsDepartment,TUDelft,Delft,TheNetherlands,r.martinsdaponte@tudelft.nl

1. Introduction

Incubators in cell cultures are used to grow and maintaincellsunderoptimaltemperaturealongside with other key variables. As enzymatic activity and proteinsynthesisproceedoptimallyat37ûC,atemͲ perature rise can cause protein denaturation, whereas a drop can slow down catalysis and polyͲ peptideinitiation[1].

Inside the incubator, measurements nowadays are gaugedviathetemperatureoftheheatingelement whichisnotexactlythesameofthecells.Apartfrom that, time spent outside the incubator can greatly impactcellhealth.Infact,outͲofͲincubatortemperaͲ ture and its evolution is an unknown variable to researchers.ForanonͲincubatortemperaturemoniͲ toring,besidesamoreaccuratetemperaturemeasͲ urementofthecellculture,insitutemperaturesensͲ ing is of paramount importance. This also enables growth optimization of the cultured cells. To the authors' best knowledge, no fully integrated in situ temperature sensing for organͲonͲaͲchip (OOC) existstodateandthisisthefirsttimesuchintegraͲ tion is being reported using a customͲdesigned cirͲ cuitfabricatedonthesamesiliconsubstrateofthe OOC.

Moreover, the simple, robust and flexible IC techͲ nologyusedforthesensorfabricationgrantsavery costͲeffective integrated solution in virtue of the reduced cost per wafer along with the large silicon areaavailableintheplatform.

2. Methods

ThetemperaturesensorcircuitoutputsasquareͲlike waveform conveying a proportional to absolute temperature frequency information that can be postͲprocessed with a microcontroller unit. SimulaͲ tions of the circuit were run in Spectre from CaͲ dence.

Thefabricationuseda“MEMSͲlast”processtoavoid potentialPDMSandothermaterialcontamination.A planar BiCMOS IC technology that requires only 7 masksstepsisusedtofabricatethreemaindevices inthecircuit:NPN,nMOSandpMOStransistors.The start material is a doubleͲpolished pͲtype silicon wafer. Mask 1 is used to define the nͲwell and the collector area of the NPN transistor, while masks 2 and 3 define, respectively, the n/pͲtype diffusion areas for the CMOS and the emitter/base area for

thebipolardevice.Contactopeningsarewetetched afterthepatterningofmask4,whilemask5isused to pattern the interconnect and gate material via deposition of AlSi (1%). Masks 6 and 7 are used to openviasanddepositthesecondlayerofmetal.This laststepisalsousedtodepositthefirstmetallayer of the OOC module. The process follows with the SiO2depositionusingPECVDonthefrontandbackof thewafer.TheSiO2layeronthebackispatternedby dry etching to define the membrane area. Then, PDMSisspunontothefrontofthewaferandcured for 30 min at 90 °C. Finally, the membrane is reͲ leased removing the Si and the SiO2 layers from underneaththemembraneusingDRIEandbuffered hydrofluoricacid,respectively.Theenvisionedresult ofthisprocessisshowninFigure1.

3. Results

Simulation results of the circuit reveal a responsivͲ itity of 4766 ppm/°C ranging from 30 °C to 44 °C, withafrequencyconversionof1.25kHz/°Candjitter of600ps.Totalpowerconsumptionisabout75mW at15Vofpowersupply.

Measurements and more detailed pictures of the OOCplatformwiththeintegratedsensorwillbepreͲ sentedintheconference.

4. Discussion

&Conclusion

The in situ temperature sensor presented here will allow a moreaccuratemeasurementthanmethods in use nowadays and, for the first time, outͲofͲ incubator temperature monitoring using a simple, robustandverycostͲeffectiveICsolution.

References



[1] Neutelingsetal.,“Effectsofmildcoldshock(25°C)followed by warming up at 37 °C on the cellular stress response”, PLoSONE,vol.8,p.e69687,2013.

[2] Gaio et al., “Cytostretch, an OrganͲonͲChip Platform”, Micromachines,vol.8,p.120,2016

Figure1:EnvisionedMEMSͲ

electronics integration of the smart temperature sensor and the OOC showͲ ing the PDMS membrane airͲinflatedat10kPa[2].

InF

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