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CRANFIELD

INSTITUTE OF TECHNOLOGY

SHOCK-TUBE MEASUREMENTS O F THERMAL ACCOMMODATION

BETWEEN A HOT GAS AND A COLD SOLID

by

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Cranfield Report Aero No. 2. September, 1970.

CRANFIELD INSTITUTE OF TECHNOLOGY

SHOCK-TUBE MEASUREMENTS OF THERMAL ACCOMMODATION BETWEEN A HOT GAS AND A COLD SOLID

by

R. K. Hanson. B. So. , M . S c , Ph.D.

SUMMARY

An analysis is presented for the response of a finite-thickness,

thin-film resistance thermometer mounted on the end wall of a shock tube and exposed to a gas suddenly heated by shock-wave reflection. It is shown that both the finite thickness of the gauge and gas-solid thermal accommodation effects play a significant role in determining the actual response of such gauges.

Shock-tube measurements are also presented and combined with the theoretical model to yield the thermal accommodation coefficient for N on platinum. Tests v/ere run with platinum thin-film thermometers deposited on pyrex by three different methods: chemical deposition (Hanovia 05-X), vacuum sputtering in an Argon atmosphere, and vacuum evaporation with an electron-beam-heated source. The results for the accommodation coefficient on all three gauges are in close agreement [a = 0. 5) and also compare favourably with previous measurements at lower pressures using conventional steady-state techniques.

The shock-tube technique provides hope for obtaining accommodation coefficients at conditions not previously accessible with other methods.

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1. INTRODUCTION " 1 2. T H I N - F I L M - G A U G E RESPONSE WITH NO T E M P E R A T U R E

J U M P 2 3. THIN F I L M - G A U G E RESPONSE WITH A T E M P E R A T U R E

J U M P 8 4. THE E X P E R I M E N T 15 4. 1 E x p e r i m e n t a l D e t a i l s 16 4 . 2 Gauge C o n s t r u c t i o n 18 4 . 3 R e s u l t s 22 5. CONCLUSIONS 26 R E F E R E N C E S 27 A P P E N D I C E S : A. The T e m p e r a t u r e - J u m p B o u n d a r y Condition A l B. The C h a r a c t e r i s t i c Accom.niodation T i m e B l C. The C o l l i s i o n T i m e I n t e r v a l C I F I G U R E S : 1. T h i n - F i l m - G a u g e t e m p e r a t u r e a s a function of t i m e (No t e m p e r a t u r e j u m p at s u r f a c e ) 2. T h i n - F i l m - G a u g e t e m p e r a t u r e a s a function of t i m e (With t e m p e r a t u r e jumip a t s u r f a c e ) 3. T h i n - F i l m - G a u g e t e m p e r a t u r e a s a function of t i m e (With t e m p e r a t u r e j u m p a t s u r f a c e )

4. C o l l i s i o n t i m e i n t e r v a l a t the a v e r a g e g a s t e m p e r a t u r e following shock r e f l e c t i o n . 5. R e c o r d i n g c i r c u i t for t h i n - f i l m r e s i s t a n c e t h e r m o m e t e r 6. T h i c k n e s s d i s t r i b u t i o n s for t h i n - f i l m t h e r m o m e t e r s 7. T e m p e r a t u r e - t i m e h i s t o r i e s obtained with c h e m i c a l l y d e p o s i t e d p l a t i n u m g a u g e ; 2^4 m V / d i v 8. T e m p e r a t u r e - t i m e h i s t o r i e s obtained with v a c u u m e v a p o r a t e d p l a t i n u m g a u g e , = i 4 m V / d i v 9. T e m p e r a t u r e - t i m e h i s t o r i e s obtained with v a c u u m - s p u t t e r e d p l a t i n u m g a u g e ; !i;3mV/div

10. D a t a r e d u c t i o n plot for t h e r m a l a c c o m m o d a t i o n coefficient : v a c u u m -s p u t t e r e d g a u g e , P = 5. 1 t o r r , M = 2. 25

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11. Temperature - time history with vacuum-sputtered thin-film t h e r m o m e t e r ; P = 5. 1 t o r r . , M = 2. 25.

1. s

12. Experimental r e s u l t s for the thermal accommodation coefficient of N on platinum

13. Comparison of measured thermal accommodation coefficients for N-on platinum.

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c Mean molecular speed in gas C Capacitance of circuitry

C Specific heat at constant pressure (gas) P

C Specific heat at constant volume (gas) E Supply voltage

g Temperature-jump distance k Thermal conductivity

I Molecular length

L Collisional mean free path m Mass of gas molecule M Molecular weight

M Primary-shock Mach number n Molecular number density p P r e s s u r e

P r Prandtl number q Heat flux

Q Ratio of material properties, see Eqs . (2.26) V (2.27)

R Gas constant (per unit mass) R Electrical resistance of gauge R_ Load resistance

L

t Time

T Temperature T Initial gas temperature

00

T Initial solid temperature T Wall-surface temperature V Voltage across thin-film gauge V Primary-shock velocity s

X Spatial coordinate

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Accommodation coefficient Equation (2. 16) Specific-heat ratio Film thickness Molecular energy Thermal diffusivity

Temperature coefficient of resistance Coefficient of viscosity

Equation (2, 36) Density

Molecular diameter

Characteristic accommodation time Collision time interval

Characteristic gtiuge-response time Equation (2. 29)

Lagrangian coordinate Cross-section correction

Condition upstream of primary shock wave condition behind reflected shock wave average

film

Gas. gauge Substrate Wall

Denotes substantial derivative Denotes Laplace transform

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1. INTRODUCTION

Previous measurements of thermal accommodation (Ref. 1) between a gas and a solid boundary have relied heavily on the conductivity cell, a device in which heat is conducted from an electrically heated wire to a colder, coaxial cylinder (of much larger radius) by means of a gas usually at low p r e s s u r e . The quantity used to express the efficiency of the

energy transfer between the gas and the solid is the thermal accommodation coefficient, and this can be inferred from the steady-state, conductivity-cell experiments using an energy balance and measured values for the

temperature of the wire and the cylinder.

Recently the theory was put forward by Clarke (Ref. 2) for dealing with the transient accommodation effects which follow a sudden change in the temperature and pressure of a moderately dense gas in contact with a solid. Only one-dimensional unsteady effects were considered, and the gas was treated as a continuum with the exception of the layer of gas immediately adjacent to the wall. From a practical viewpoint, Clarke's problem represents an idealization of the situation which a r i s e s when a plane normal shock wave reflects from the co-planar end wall of a shock tube, and this similarity was later exploited by Busing and Clarke (Ref. 3) in a shock-tube investigation of the thermal accommodation coefficient of air on platinum. The reflected shock wave leaves behind a gas with increased values of temperature and p r e s s u r e , and the subsequent energy transfer between the hot gas and the cold wall induces motion in the compressible gas and r a i s e s the temperature of the solid. Busing and Clarke employed a platinum thin-film resistance thermometer to monitor the tem.perature changes on the solid surface and were able to infer the accommodation coefficient from a comparison of theoretical and measured temperature histories.

Unfortunately, the value for the accommodation coefficient found by Busing and Clarke (Ref. 3) was anomalously low in comparison with conductivity-cell results, and this cast doubt on the shock-tube method. It is now clear that the discrepancy was due simply to the neglect of the thin-film response time in the data reduction, and that a proper theoretical model must, in general, account for the influence of the finite gauge

thickness.

The present report modifies the previous theoretical model of Busing and Clarke to include the effect of gauge thickness, and presents some calculational results which illustrate the dependence of thin-film-gauge response on the ratio of the characteristic accommodation and gauge-response times. New shock-tube data are also presented for N on platinum, and the results for the accommodation coefficient based on the modified theory are shown to be in good agreement with conductivity-cell measurements at low p r e s s u r e s .

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2

-2. TIIIN-FILM-GAUGE RESPONSE WITH NO TEMPERATURE JUMP The influence of gauge thickness on the response of a thin-film-resistance thermometer can best be appreciated by considering first the transient gauge output, following shock-wave reflection, when there is no temperature difference between the gas and the solid at their interface, i . e . , the case of no temperature jump.

We begin by assuming that the heat transfer to the end wall of a shock tube, subsequent to shock-wave reflection, is adequately modeled by considering a sudden and uniform change in the temperature and pressure of a semi-infinite expanse of gas in contact with a solid. This should be a suitable model for times greater than. say. 10 collision time intervals after shock reflection, since shock-structure effects should be essentially over and the shock wave will have receded far enough from the wall to be considered at infinity. The gas-solid interface is taken at x = o. and the change in gas temperature is taken to occur at t = o. The solid is assumed to occupy the complete half space x < o. with an Interface at x = - 6

separating the thin-film material and its substrate. Only one-dimensional heat transfer need be considered on the time scale of interest here, so the temperatures throughout the film and substrate regions must satisfy the diffusion equations

ET^/at = (k/pc)j (8^Tj/ax^) = ;,^0^T^/8x^) (2.1) and

aT /at = (k/pc) (a^T /ax^) = Kjdhjbx^), (2.2) where T, k , p and c a r e , respectively, the temperature, thermal

conductivity, density and specific heat of the material in question;

K= k / p c is the thermal diffusivity. which can be considered constant in

view of the snaall changes of solid temperature which will occur in practice. The subscripts f and s denote film and substrate respectively.

At the interface of the two solids we require continuity of both energy flux and temperature, so that

l k f ( 8 V 8 ^ ) ] ^ = - 6= tl^s^^V^^^Ix = - 6 . <2.3) where the thermal conductivities k, and k are taken to be constants, EUid

f s

Tj( - 6,t) = T g ( - 6,t). (2.4) Similar boundary conditions apply at the interface of the gas and

the film, i, e . ,

IkgOTg/ax)] ^ , ^ = [kjOT^/ax)] ^ ^ ^ (2.5) and

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T (O.t) = T^(O.t). (2.6)

Finally we have the additional boundary information that conditions remain unchanged at infinity, and so we can put

T - ^ T as X - . - 00, t > 0, (2. 7) s o

where T is the initial temperature of the solid, and o

T -•T as X -* «i t > 0, (2.8)

g 00

where T is the gas temperature behind the reflected shock wave.

00

The appropriate equation for one-dimensional energy transfer in an ideal gas (calorically and thermally perfect) is, neglecting viscous effects,

pC (DT /Dt) = 9 [k (eT /ax) ]/dx - Dp/Dt. (2.9) where T„, p, p and C are the gas temperature pressure, density and specific neat at constant p r e s s u r e , respectively; D/Dt is the usual

convective operator. We now argue that the pressure term may be dropped, since both Goldsworthy (Ref. 6) and Clarke (Ref. 7 and Ref. 16) have shown that, to first-order accuracy, the pressure in the thermal boundary layer is constant in both space and time.

Following Busing and Clarke (Ref. 3). to simplify Eq. (2.9) we transform^ from Eulerian x. t coordinates to Lagrangian ^, t coordinates where X >p = J p(x.t)dx (2. 10) o and a/ax = pd/diiu (2.11)

The transformed version of Eq. (2.9) becomes

aT / a t = a i ( p k / c )(aT /a^) ]/dip (2,12)

while conditions (2.5), (2.6) and (2.8) treuisform into

lpkg(aTg/a^) ] ^ , 0 = I k j ( a T j / 8 x ) ] ^ ^ Q. (2. 13)

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4

-and

T _, T a s I/;-, 00, t > 0. (2. 15) g 00

If we now a s s u m e that k is p r o p o r t i o n a l to T . which is n e a r l y t r u e , then pk is p r o p o r t i o n a l to p, and is t h e r e f o r e constant. We define the c o n s t a n t /3 as

/3 = pk / C (2. 16) so that we a r e left with a s i m p l e diffusion equation for the g a s ,

9T / a t = i3(9^T /d4'^). (2.17) O o

E q u a t i o n s ( 2 . 1 ) . (2.2) and ( 2 . 1 7 ) , t o g e t h e r with the conditions of E q s . (2.3), ( 2 . 4 ) , (2.7) and (2.13) to (2.15) a r e a c o m p l e t e s e t of l i n e a r equations and boundary c o n d i t i o n s . Addition of the i n i t i a l - v a l u e information t h a t T = T ; X < - 6. t « 0 ; (2. 18) s o T j = T ; - 6 < X < 0, t s 0; (2. 19) and T = T ; X > 0, t $ 0, (2. 20) g 00

c o m p l e t e s the d e s c r i p t i o n of the p r o b l e m which can now be solved by Laplace t r a n s f o r m m e t h o d s . Denoting the t r a n s f o r m of a quantity by a b a r (~) o v e r the r e l e v a n t s y m b o l , and using z as the t r a n s f o r m v a r i a b l e , we find that

f - T ^ z = A(z)exp(- ^ i ^ ) , (2.21) T^ - T / z = B(z)exp( /z/iT^'x) + C(z)exp(--/z/k ^x) (2.22)

and

f - T / z = D(z)exp ( v ^ x) (2.23) w h e r e the functions A(z), B(z), C(z) and D(z) a r e to be evaluated using the

boundary conditions for continuity of heat flux and t e m p e r a t u r e at the two i n t e r f a c e s . We find for the film, after s o m e tedious a l g e b r a ,

T^ - Tjz = [ D ( z ) / 2 ] ((1 + Q^g)exp(- / " Ï / T 6 + VzT^ 6+ / T / ^ K )

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w h e r e

^ 0 0 - V ^ / ^ ^ < ^ f s Y ' " ^ f g \

D(z) =V ;: A\ 2 ^~Q ^ ^""P^" "'"^s * + ^ ^Z-^f M

fg

X - ^ J J e x p ( - > ^ 6 -^^ 6)

(2, 25) Qfs = l ( p c k ) ^ / ( p c k ) j ]' (2.26) and 1 *^fg " ^ p C p k ) g / ( p c k ) J ] ^ (2.27) It i s w o r t h noting in p a s s i n g that both Q and Q have values l e s s than

1 (for e x a m p l e , Q = 0. 11 for a platinum film on a pyrex s u b s t r a t e , and ts

and Q , ~ 0. 004 for a i r at s t a n d a r d conditions on platinum.) for a l l situations of i n t e r e s t h e r e .

The actual thin-film r e s p o n s e depends on the a v e r a g e t e m p e r a t u r e (and hence r e s i s t a n c e ) throughout the film, but for t i m e s g r e a t e r than a few diffusion t i m e s in the film (the diffusion t i m e , T . e q u a l s 6 / « , ) the film t e m p e r a t u r e is n e a r l y uniform and we c a n a c c u r a t e l y a p p r o x i m a t e the a v e r a g e t e m p e r a t u r e with the t e m p e r a t u r e at a specific value of x. s a y x = 0. The change in film t e m p e r a t u r e , away from the initial t e m p e r a t u r e T , is thus taken a s the i n v e r s e t r a n s f o r m of Eq. (2. 24) evaluated at x = 0, i . e . , AT.(t) = T , - T f f o • 1 , / T - T V / Q , 1 - Q, 00 ~.

2 ~ v"exp(- 2n/57;r^ 6)1 (2.28)

1 - Q, s^ / I - Q

<r^(T^)<'-Making u s e of s t a n d a r d t r a n s f o r m i n v e r s i o n t a b l e s (the brief one in C a r s l a w and J a e g e r (Ref. 8) is p a r t i c u l a r l y handy) one c a n now show that

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6

T T

-AT (t) = -^ ~ \ \ / er f c( n6/ y; ^ - )

^ " ^ f s - ^ n

+ > Ai-fc [(n + i)6;y;r7t] 1 (2.3o)

^f s n = o

where erfc is the usual complementary e r r o r function and Q „ = 1/Q„ . gf ' fg This last equation can be made more compact by combining the two summations and at the same time introducing the thin-film diffusion time, which we shall refer to hereafter as the characteristic gauge-response time; the result is

Arf(t) T - T 00 00 o ^ z , n . I 7-1 + ''^7- ^ erfc nVr / t

^ ^ <^gf ' - % n 4 l '

(2.31)

It is worthwhile now to inspect this result for two limiting cases. For small values of time, i. e . , as -/rpr _, 0, we see that

Arj(t) _ (T^ - T^)/(l + Q g p , (2.32) which is the well-known result for the surface temperature change on a

homogeneous end wall with properties corresponding to the film material. For large values of time, i. e . , as /TpF~ -» oo, we observe that

T - T

AT Jt) -, , "" ^ ° I 1 +

' '^%f I ' - %

T - T 00 o 1 + Q (2.33)

which is the expected solution for a homogeneous end wall with properties corresponding to the substrate material. This last result is of course the solution obtained when the thickness of the thin film is neglected, so that insofar as the physical model employed here is the correct one, the response of an "ideal" thin-film resistance thermometer would be a simple step. (The response, or output, of a thin-film themiometer is directly proportional to its change in temperature. ) Finite gauge thickness serves to degrade the quality of the step, but does not change the magnitude of the long-time, asymptotic temperature level.

For the purpose of plotting the results obtained, it is convenient to put the solution in dimensionless form. We do so by dividing Eq. (2.31)

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by the asymiptotic t e m p e r a t u r e change indicated in Eq. (2. 33). The r e s u l t i s 1 + Q ATj(t)/ATj(oo) gs 1 + Q gf 1 + Q 00 / 4, erfc nvV / t ,

F ^ l

g J fg n = 1 (2. 34) Making u s e of the information that Q ^ and Q a r e both g e n e r a l l y much l a r g e r than 1, we have, to a high d e g r e e of a c c u r a c y ,

ATj(t)/ATj(oo) = Qj^ r i + 2 n= 1 V erfc n / r 7t g' Q fs w h e r e 1 + Q. (2,35) (2.36) fs

which does not depend on shock s t r e n g t h o r gas conditions. R e s u l t s for a t e m p e r a t u r e gauge composed of platinum film a i pyrex s u b s t r a t e

( i . e . , Q = 0.11) and based on Eq. (2.35) a r e p r e s e n t e d in Fig. 1. The sirq^le dependence on the d i m e n s i o n l e s s t i m e t / r m a k e s the plot useful for c o m p a r i n g the r e l a t i v e perfornaance of gauges with different film t h i c k n e s s , and if the c h a r a c t e r i s t i c gauge r e s p o n s e t i m e T is known, for e s t a b l i s h i n g the magnitude of the final t e m p e r a t u r e change from m e a s u r e m e n t s made at m o d e r a t e values of /^tpr .

' g

Also plotted in F i g . 1 is an a p p r o x i m a t e form of Eq. (2. 35), acceptable for l a r g e values of / t / x , and obtained in the following way. F i r s t we expand erfc nJr 7T in a form valid for n / r T t < 1.

"^ g' g'

erfc nPT^ = 1 - (2//;F) [ r W ^ t - ( l / 3 ) ( n y 7 ^ ) ^ + 1 ,

and then we substitute in Eq. ( 2 . 3 5 ) , a s an approximation for erfc nvr / t . the first two t e r m s of the expansion.

use of the identities

(2.37) Since v < 1. we c a n make -22-and >

v" =y

i^"

- 1 =

i//(l

-

v)

y ni/ = i//(l - v) (2.38) (2.39)

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to show that the a p p r o p r i a t e form of Eq. (2. 35) r e d u c e s to

Ar^(t)/AT^(oo) ~- 1 - / ^ / t /{Q^/7). (2.40) F o r a p l a t i n u m - o n - p y r e x gauge, this l a s t equation has the

n u m e r i c a l form

AT,(t)/Ar„(oo) = 1 - 5. 1 J^TJt (2. 41)

I I g

so that the time r e q u i r e d for the r e s p o n s e to r e a c h 95% of its final

4 2 magnitude is t - 10 T . K- i s about 0. 25 c m / s e c for bulk platinum

o S I _g so a gauge 100 A thick has a c h a r a c t e r i s t i c r e s p o n s e t i m e T = 4 x 1 0 /Lisec

and r e q u i r e s 0. 04 usee to r e s p o n d to 95% of the s t e p value; the c o r r e s p o n d i n g t i m e s for 10.000 A (1 m i c r o n ) gauge a r e 0 . 0 4 /.sec and 400 ;^sec. r e s p e c t i v e l y .

C l e a r l y the gauge t h i c k n e s s can play a c r u c i a l r o l e in the i n t e r -p r e t a t i o n of the r e s u l t s of t r a n s i e n t e x -p e r i m e n t s such as those -p e r f o r m e d in a shock tube w h e r e the r e c o r d i n g t i m e s m a y be limited to. s a y . 10-50 A4sec. and gauge t h i c k n e s s e s have typically been in the range 500-5000 A, We mention, as an e x a m p l e , m e a s u r e m e n t s of the t e m p e r a t u r e - s t e p height on a s h o c k - t u b e end wall to d e t e r m i n e the t h e r m a l conductivity of the hot g a s , (Refs. 3. 9. 10. and l l ) - To the p r e s e n t author's knowledge, w o r k e r s using t h i s method to m e a s u r e t h e r m a l conductivity have not p r e v i o u s l y accounted for finite gauge t h i c k n e s s when reducing t h e i r data. F o r the accommodation coefficient e x p e r i m e n t s to be d e s c r i b e d in following s e c t i o n s , the thin-film t h i c k n e s s is even m o r e c r i t i c a l , since we a r e i n t e r e s t e d in making definitive e n d - w a l l t e m p e r a t u r e m e a s u r e m e n t s for t i m e s of the o r d e r of 1 ;^sec and l e s s following shock reflection.

It is w o r t h noting that an a n a l y s i s dealing with the r e s p o n s e of a f i n i t e - t h i c k n e s s , thin-film t h e r m o m e t e r in the s e p a r a t e c a s e of a constant heat flux has been p r e s e n t e d by K u r z r o c k (Ref. 12).

3. THIN-FILM-GAUGE RESPONSE WITH A TEMPERATURE JUMP In the p r e v i o u s section we c a l c u l a t e d the r e s p o n s e of a finite-t h i c k n e s s , finite-thin-film r e s i s finite-t a n c e finite-t h e r m o m e finite-t e r mounfinite-ted on a shock-finite-tube end wall and exposed to a gas suddenly heated by shock-wave reflection. The solution obtained made u s e of the boundary condition that the t e m p e r a t u r e of the gas and the thin film a r e equal at t h e i r i n t e r f a c e . In fact the l a r g e t e m p e r a t u r e g r a d i e n t in the gas i m m e d i a t e l y adjacent to the end wall i s . at l e a s t for s h o r t t i m e s following shock reflection, i n c o n s i s t e n t with a continuum gas m o d e l . An i m p r o v e d boundary condition, allowing for a " j u m p " in t e m p e r a t u r e at the g a s - s o l i d i n t e r f a c e , can be formulated from a c o n s i d e r a t i o n of the m i c r o s c o p i c n a t u r e of the interaction between gas and s o l i d - m a t e r i a l m o l e c u l e s which o c c u r s in the gas l a y e r next to the end wall.

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so-called Knudsen layer have relied heavily on the concept of the accommodation coefficient, which is designed to express the efficiency of energy transfer between a gas and its (solid or liquid) boundary. By definition, the accommodation coefficient a is specified by (Refs. 4 and 5)

a = (e' - e )/e' - e ) (3.1 m ' w * where e' is the average energy per molecule for incoming particles which

strike the wall, e is the average energy per molecule for those particles re-emitted by the wall and e is the average energy which molecules would have issuing from a gas stream at a temperature equal to the wall

temperature T .

This definition suggests the following limiting values for a :

a = 1 if e = e , which is the limiting case if the molecules re-emitted by the wau are completely accommodated to the wall temperature T ; and at the opposite extreme, a = 0 if e = e', i . e . , if the molecules are r e -emitted with their initial, incoming energy. Since the average energy of the gas particles at the wall is simply | ( e + e') = c , say, it is clear that there will always be a discontinuity in energy between gas and solid-material molecules, i. e , , between e and e , unless a = 2, which is not

a w

physically acceptable. Thus a temperature (energy) jump exists at the gas-solid interface (whenever heat is being conducted) for all possible values of a.

In a steady-state situation the number of incoming molecules per unit time is balanced by the number of re-emitted molecules, so the

limiting case a = Q corresponds to an energy-transfer rate of zero between gas and solid, while the case a = 1 corresponds to the maximum energy-transfer rate for fixed values of e and e". Clearly the actual value of the accommodation coefficient is intimately connected with the rate of energy transfer as well as the m.agnitude of the temperature jump at the gas-solid interface.

Extending the ideas introduced above, one can show (see Appendix A or Kennard, Ref, 5) that the appropriate temperature-jump boundary condition at the gas-solid interface is, for a steady or quasi-steady situation.

T - T = gOT/ax) (3.2) g w '

where T i s . as before, the wall surface temperature, T is the

temperature of the gas at the wall, and g is the "temper^ure-jump distance" given by

2 - a \ ( _ _ 2 _ \ / 9 y - 5 \ . (3- 3)

t-)(.

aT/ax represents the temperature gradient (normal to the wall) in the gas a few mean paths away from the wall. In Eq. (3. 3), 7 is the ratio of the specific heats and L is the collisional mean free path.

(N. B. The continuum limit of no temperature jump employed in section 2 is recovered by letting the mean free path shrink to zero. ) Using the

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10

-Lagrangian coordinate system, and the notation of section 2, Eq. (3. 2) becomes

Tg (4, = 0,t) - T^(x = 0,t) = lpg('óT^/d4)] ^ ^ Q. (3.4) The quantity pL is very nearly constant apart from a slight dependence

on temperature, so that we propose to fix its magnitude, for each case of shock reflection, at a value corresponding to the average gas temperature at the wall. We have little to guide us regarding the constancy or otherwise of

a for the present circumstances, but previous work at lower pressures and

with different techniques has not found a strong dependence on temperature. Therefore we propose to take o as a constant as well, also evaluated at the average gas tenaperature. To emphasize these assumptions we write

Pg = (pg)ay " constant (3. 5) so that Eq. (3.4) becomes

T^i^j = O.t) - Tj(x = 0,t) = ( p g ) a v ( 9 V ' ' * V = 0- ^^-^^

Anticipating the results ahead, it is convenient to introduce a characteristic accomnaodation time T ,

a

where T is the collision tinae interval in the gas evaluated at the average gas temperature, i . e .

and c is the mean naolecular speed in the gas.

(See Appendix B for details of the derivation leading to Eq, (3, 7).) We can now proceed with the solution for the response of a finite-thickness resistance thermometer, properly accounting for accommodation and temperature-jump effects. The solution is accomplished in the same manner as that presented in section 2 with the substitution of Eq. (3.6) for Eq. (2. 14); the other boundary conditions remain the same.

We find, for the Laplace transform of the film temperature, Tf - Tjz = - ^ ^ j (1 + Qfs)exp F- v ^ T ^ 6 + VIJT^ 5 + ^ x j

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w h e r e D(z) = T - T 00 o 1 + Q

fs ^ „ _ r

; exp 1 - A / k 6 + - / ï ^ 6 I ! Q (1 + y S ^ ) + 1 / L s J L g* / I - Qfg N r - , . - 1

^ — 2 y^^'P [ • ' ^ ^ ^ • ^^ü ^ v ^ "^ ^ ^ 'A J

(3.10) Equation (3.9) can be simplified to yield

T , - T / z f o' T - T 00 O exp(-/z/K x) + 1/ exp - VZ/K (x + 26) I

g^d . yiT) + ij ^ l - . e x p ( - 2 y i 7 ^ 6 ) ^ L _ , _ _ _ }

Q w h e r e , a s in s e c t i o n 2, '^= (1 - Qfg)/(l + Qfg) < l . (3.11) (3.12) Now Q » 1, and Re >^T > 0 for all points on the i n v e r s i o n contour in the complex plane, s o we can now rewrite Eq. (3. 11) in the s e r i e s form

r p npi exp / Z / K X Qgf ( 1 + v ^ ) + 1 1 + f exp :t€77(x + 6) J n=o Q g f d + y ^ r p - 1

v ^ + ^ ) + 1

exp( - 2n^Tfr^ 6). (3. 13)

We c a n simplify the solution to a m o r e p r a c t i c a l forna by setting the

b r a c k e t e d t e r m in the s u m m a t i o n equal to unity, since IQ „(1 + 7 ZT ) | » 1, and approximating [Q .(1 + yzr ) + 1 ] with Q (1 + yzr ). F o r s i m p l i c i t y , we a l s o take the solution at x = 0 a s r e p r e s e n t a t i v e of the a v e r a g e t e m p e r a t u r e throughout the film for t i m e s g r e a t e r than a few T .

O

The simplified t r a n s f o r m for the film t e n a p e r a t u r e is thus T - T T - T / z = f o' Q gf 1 + V e x p ( - 2/ZT ) z(i + yzT~) a n=o V e x p ( - 2nyZT ) g (3.14)

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12

-which h a s the i n v e r s e t r a n s f o r m (see C a r l s a w and J a e g e r , Ref. 8)

T ^ - T r r -,

AT,(t) = T , - T„ = 2 _ | 1^1 . exp(t/T J e r f c / t / T ^ J

Q gf

2 ^ I/" rerfc(nyy^) - exp (2^7 g/r ^+ t/r ^ V ^ ^ " ^ ' V ^ ^"^^^^ 1 }

(3.15) F o r the p u r p o s e of plotting the p e r f o r m a n c e of a thin-film gauge, we c a s t the r e s u l t s into d i m e n s i o n l e s s form by dividing Eq. (3. 15) by its own a s y m p t o t i c , l o n g - t i m e l i m i t , s o that Ar^(t)/AT^(oo) = Q^g 1 - e x p ( t / T )erfc A / 7 ~ + 2 2_ ^^ ^ *J n=l erfc n 4T TT

e'

exp(2n/T / T + t / r )erfc(nVT / t W t / r ) g' a ' a g ^

}

(3, 16)

We c a n o b s e r v e that t h i s solution h a s the expected behaviour in c e r t a i n l i m i t i n g c i r c u m s t a n c e s . F o r e x a m p l e , in the l i m i t a s / r -. 0, i . e . , a s the acconamodation t i m e goes to z e r o while the g a u g e - r e s p o n s e t i m e r e m a i n s finite, we r e c o v e r the r e s u l t of s e c t i o n 2 for no t e m p e r a t u r e jump, Eq. (2.35). In the l i m i t a s T - « o . i . e . , a s the g a u g e - r e s p o n s e time

g

goes to z e r o while the a c c o m m o d a t i o n t i m e r e m a i n s finite, we r e c o v e r

ATj(t)/ATj(«)l^__^jj=ri - exp(t/T^)erfc/t777l

J g L J (3.17) which is the s a m e r e s u l t o r i g i n a l l y found by Busing and C l a r k e (Ref. 3) zind u s e d to r e d u c e t h e i r data for the accommodation of a i r on platinum.

F o r s m a l l values of t i m e , i . e . , a s / t / r , / t / r "* 0, we obtain

T / a " ' g

[AT^(t)/AT^(„)]^/- ^

(3.18)

g

which i s the p r o p e r behaviour w h e n e v e r s u r f a c e accommodation effects a r e p r e s e n t , s i n c e the wall r e q u i r e s a finite time to adjust to the changed s t a t e of the g a s . F o r v e r y l a r g e v a l u e s of t i m e , a s T t / r , -I t / r -«oo. we r e c o v e r the n e c e s s a r y r e s u l t Ar^(t)/AT^(oo) y t / r , / t / r -• 00 ' a ' g = 1 (3. 19)

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This last result also confirms that a step response is obtained in the limit of zero gauge-response and accommodation times.

Calculated results based on Eq. (3. 16) are presented in Figs. 2 and 3 for a platinum-on-pyrex gauge (Q =0.11). Figure 2 illustrates the influence of increasing the characteristic accommodation time for a fixed thin-film gauge ( i . e . , fixed T - Note that the limiting case T / T = 0

corresponds to the result plotted in Fig. 1 for which accommodation effects were absent. Accommodation effects have little effect on the gauge response for T / T < 1, and only for T / T > 100 is accommodation responsible for a

a' g a g ~

larger perturbation to the ideal step response than the gauge thickness. For experiments intended to measure T , we clearly should arrange conditions such

cL

T / T > 1000 in order to minimize the importance of the gauge thickness and a g ~

hence optimize the accuracy of the naeasurement.

Figure 3 presents the same results, but plotted as a function of the dimensionless time (t/r^^) 2_ jn this case we observe the influence of changing the gauge response time for a fixed acconamodation time. Again it is clear that we should arrange for r / T to be as large as possible in order to enaphasise the influence of accommodation rather than gauge-thickness effects.

The changed shape of the curve for T / T = 0. 1 in Fig. 3. at i a' g

values of (t/r )^ < 4. is due to the use of the surface temperature for the average gauge tenaperature at times t less than T .

We can provide a useful approximate form of Eq. (3. 16) in the following way. We first expand erfc / t / r in a form valid for

y t/T » 1, (Ref. 8).

erfo/rpr = exp( - t / r J [ ( t / r J " ^ - (l/2)(t/T J ' ^ ^ ^ + . . . . ] //~n.

(3.20) _ i

and retaining ternas to order t ^ we find

exp(t/T^)erfc/t/T^ =/VJ^ I / ^ - (3.21) *

Similarly we expand the term erfc n / r / t for n / r Jx « 1, and retaining t e r m s to order t ^ we have

erfc nfr~Jl=^ 1 - (2n//i)/T / t (3.22) Finally we expand to order t" ^ the last term in Eq. (3. 16) to find

exp(2nyT / T + t / r )erfc(n/T / t + /ÏÏT~)=' Jr / t / -fir (3.23)

' g' a ' a g' a a

* It can be shown that truncation of the series in (3. 15) at an n which still allows this condition to be met does not lead to significant e r r o r in the final result.

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14

Substituting the results of Eqs. (3. 21) to 3. 23) in Eq. (3. 16), we obtain, for

/t/^a' ^ ^ 7 ^ » ^•

ATj(t)/Arj(oo) = 1 -/TJi I y i - / ^ (1 - Qf3)/(Qfs/^). (3.24) or more approximately

AT^(t)/AT^ (<») = 1 - ( / 7 ^ / y ¥ ) ( y 7 7 7 g + i/Q^^). (323)

This approximate form of the response is quite useful for reducing the data of shock-tube experiments as will be seen in the next section. In addition it clearly exhibits the relative importance of gauge-thickness and

acconamodation effects.

We can say a few more words about the ratio of characteristic times T / T which plays a critical role in the design of a proper shock-tube experiment. For a given gas-solid combination, aj;id hence fixed values of

a.K, , and 7. the ratio T / T is proportional to T /6 . Clearly then we wish

I a g c to make 6. the filna thickness, as small as possible, and at the sanae time we will want to adjust T to be as large as is practically reasonable. The minimum value of 6 depends on the process used to construct the film (see section 4). but present deposition techniques are capable of producing films as thin as 100-1000 A. The practical upper limit for T depends strongly on the size of the shock tube used since low pressures are the source of several non-ideal effects in shock tubes and we wish to avoid these if possible. Generally, the larger the shock tube, the lower the pressure level one can satisfactorily use and still obtain a well-defined, uniform slug of test gas behind the reflected shock wave.

Values for p T , the product of the initial shock-tube pressure and the collision time interval in the gas (evaluated at the average temperature. T = j(T + T )) are presented in Fig. 4 for a variety of gases. Of course the results depend strongly on the strength of the shock wave employed, but somewhat surprisingly there are not great differences between the various gases at the same primary-shock Mach number. M . The details of these calculations are presented in Appendix C.

With a shock tube a few inches in diameter, a reasonable lower limit for the initial pressure p is about 1 torr, so the collision time interval

-8

T will be in the range of 10 seconds for shock strengths of about

'^ 2

M = 2-3. For a platinum gauge with K ~ 0.25 cm / s e c and a diatomic gas wnh y = 7/5, we have the ratio

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(where ó is in cm). Thus, for a 100 A gauge and an initial pressure of 1 torr, we find

T / T = [(2 - ö ) / a ] ^ 10^ (3.27) a g

which is quite an acceptable time ratio, even for values of a near unity. For a thicker gauge of 1000 A, and the same initial pressure,

T^/Tg = [(2 - ö)/] ^ 100 (3.28) 2

and we have only a marginally acceptable experiment unless [(2 - a)/»] > 10. At higher p r e s s u r e s , say 100 t o r r , we have T = 10 sec and

T „ / T - [(2 - a)la] ^ 100 (3.29)

o

for a 100 A gauge, and we again have a naarginal situation unless [(2 - a)la] > 10. Tests with the thicker gauge would be generally unsatisfactory at this pressure level. The flexibility of the thinner gauge for operating over a range of shock conditions (and particularly for working at higher pressure levels where the shock-tube performance is guaranteed) is obvious.

Before closing this section, it is worth remenabering that the shock-tube technique is restricted (with the present theory) to values of t / j > 10, in order to avoid shock-structure effects. For cases in which p,T « 10

1 c t o r r - n s e c , say, we thus can only make use of data acquired after at least

_1

t = IOT - 10 ^sec/p (3,30) but this is not much of a restriction since the times involved are only

0. 001 /usee at 100 t o r r and 0, 1 /usee at 1 torr.

It is also worth recalling that one basic assunaption of the theory is that the pressure remains constant after shock reflection; this was shown to be true to first-order accuracy (Refs. 6 and 7) for the case of no temperature jump, but the assumption is more accurate yet when a temperature jump is present (Ref. 16), and especially for small values of a, since the heat-transfer rate is decreased and hence the extent of any perturbations to the flow field. In the limit that o = 0 of course there is no heat transfer to the wall, the gas remains motionless and the pressure is exactly constant.

4. THE EXPERIMENT

The experiment made use of shock-wave reflection from the closed end of a shock tube filled with nitrogen in order to create a one-dimensional,

unsteady heat-conduction situation between a hot gas and a cold solid wall. The efficiency of energy transfer between the hot gas and a thin metal film mounted on the (electrically nonconducting) end wall was then inferred by monitoring the temperature-time history of the film, the latter being obtained by passing a current through the film and using it as a resistance thermometer. The result

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16

-of each experiment was a value for the thermal accommodation coefficient at the pressure level produced by the shock-reflection process.

4.1 Experimental Details

The shock tube used for these tests was a simple pressure-driven tube made of brass waveguide tubing with 3. 1 cm by 7. 1 cm inside dimensions. The high-pressure and test sections were, respectively, 2 m and 4 m long. The diaphragm material was Melinex, with a thickness of 0. 023 mm, and the diaphragms were burst with a manually operated needle plunger. The normal sequence of operation consisted of reducing the pressure in the test chamber to less than 0. 1 torr with a mechanical vacuum pump and then purging the system with about 100 t o r r of N from a high-pressure cylinder of commercial-grade nitrogen (British Oxygen (Jo. Ltd. ). After re-evacuation, the tube was filled to the desired final pressure as read on a Wallace and Tiernan (0-20, or 0-800 torr) pressure gauge. The initial gas temperature was taken as the temperature of the tube wall near the end plate, and this was monitored with a standard mercury thernaonaeter.

The primary-shock Mach numbers ranged from 1.3 to 2. 7, and the initial tube pressure varied from 1 to 200 torr, the lower Mach numbers

occurring with the higher initial p r e s s u r e s . The shock velocity was measured just upstream of the reflecting end plate by detecting the shock passage over two thin-film resistance thermometers set flush with the side wall of the tube and spaced 24 cm apart. The detector outputs triggered transistorized pulse generators and these pulses were used to start and stop a digital chronometer which recorded the time interval to lO. 1 /usee.

A resistance thermometer operates on the principle that the electrical resistance of most metals changes with temperature. Thus if an electrical current is passed through the thin-film element any change in temperature will manifest itself as a change in the voltage drop across the gauge. The magnitude of the temperature change can thus be inferred from a resistance-temperature calibration of the thin filna and measured values for the gauge current and voltage.

The electrical circuit employed in the present study is shown in Fig. 5. R is the gauge resistance, R is the load resistance and E is the D. C. supply voltage. The voltage across the gauge prior to shock reflection is

Vg = l V * \ ^ ^L^^^ ^^'^^

For the small change in gauge resistance induced by heat transfer from the shock-heated gas one can show that the change in gauge voltage is given by

AV /V = (^R /H )/(! I K / R . ) (4.2) g' g g g g L

Over a reasonable range of temperature, the change in resistance of the metal film is specified sufficiently well by the linear relation

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AR = R X(T - T ) = R X A T (4.3) g g o g

w h e r e X is the r e s i s t a n c e - t e m p e r a t u r e coefficient and T r e f e r s to the initial gauge t e m p e r a t u r e . T h e r e f o r e we c a n w r i t e , for the r e s p o n s e of a gauge in the c i r c u i t of Fig. 5,

AV / V = XAT/(1 + R / R - ) . (4.4)

g g g I-'

The s e n s i t i v i t y of such a gauge is s i m p l y

AV /AT = XV / ( I + R /R^ ), (4.5) g' g' g' L

and this quantity can be v a r i e d to suit the r e q u i r e m e n t s of the e x p e r i m e n t by adjusting the voltage a c r o s s the gauge, by changing the r a t i o R / R , o r by

using a m a t e r i a l with a different value of X. ° While the gauge r e s p o n s e depends on V d i r e c t l y , the m w e r

d i s s i p a t e d by the gauge in the f o r m of h e a t i s p«*oportional to V / R , and this should not be too l a r g e in o r d e r to avoid u n d e s i r a b l e h e a t i n g of°the s u b s t r a t e . Thus it is advantageous to o p e r a t e thin-film t h e r m o m e t e r s with r e s i s t a n c e and low c u r r e n t .

Another factor which i s affected by the gauge r e s i s t a n c e is the e l e c t r o n i c r e s p o n s e time of the c i r c u i t r y , and we w e r e e s p e c i a l l y c o n c e r n e d with that h e r e . To nainimize the r e s p o n s e t i m e we needed to m i n i m i z e the product RC w h e r e R w a s the equivalent r e s i s t a n c e of R and R in p a r a l l e l and C was the input c a p a c i t a n c e of the r e c o r d i n g oscillCTSCope plus any p a r a s i t i c c a p a c i t a n c e . T h u s , from the viewpoint of e l e c t r o n i c r e s p o n s e t i m e , a snaall gauge r e s i s t a n c e was d e s i r e d .

A f u r t h e r p r a c t i c a l r e s t r i c t i o n on the gauge r e s i s t a n c e employed in the p r e s e n t study w a s i m p o s e d by the d e s i r e for a thin gauge, s i n c e the gauge r e s i s t a n c e i n c r e a s e s r a p i d l y with d e c r e a s i n g gauge t h i c k n e s s (for a given m a t e r i a l and g e o m e t r y ) .

The optimum value for the gauge r e s i s t a n c e was thus a c o m p r o m i s e which depended upon the p a r t i c u l a r r e q u i r e m e n t s of a c c o m m o d a t i o n - c o e f f i c i e n t e x p e r i m e n t s . The gauges s e l e c t e d had r e s i s t a n c e s varying from 220 to 800 o h m s , and t h e s e values a r e c o n s i d e r a b l y l a r g e r than those n o r m a l l y used in s h o c k - t u b e experinaentation. A c o n s e q u e n c e of using l a r g e gauge r e s i s t a n c e s was that the c i r c u i t could not (with the power supply available) be o p e r a t e d in the usual c o n s t a n t - c u r r e n t mode, so the factor 1 + R / R in the equations

above was not s e t equal to 1 a s is usually done. ° In fact, R / R was chosen to be equal to 1/5 in the c i r c u i t for the c h e m i c a l l y deposited %auge and 1/2 for the v a c u u m - s p u t t e r e d gauge.

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-18-short (12 cm), low-capicitance coaxial cables (25 pF/m) between the gauge circuit and the recording oscilloscope. Further, a wide-bandwidth

oscilloscope (Tektronix 556) and differential-amplifier plug-in unii (Tektronix 1A5, AC coupled) were employed to retain the high-frequency quality of the input signals. With this arrangement, the response time with the 800 ohm gauge was measured (using the same recording) circuit and a high-quality square wave for an input signal) to be less than 10 nsec (0 to 63% response). The circuit response times were correspondingly less with lower gauge resistances, and so electronic lag time was completely neglected in the analysis of accommodation data acquired with all three gauges.

4. 2 Gauge Construction

Three different thin-film thermometers were used in this study, each constructed by a different technique. The first gauge was made by the same method employed by Busing and Clarke (Ref. 3). chemical deposition. This technique is well documented and will only be outlined here. In brief, a thin line about 10 mm long by 0. 4 mm wide of liquid bright platinum paint (Hanovia 05-X) was applied with a draughting pen onto a circular disc of hard glass 5 mm thick and 50 mm in diameter. After a brief interval of air drying, the glass was placed in a small electric furnace and heated to its softening temperature (about 680 C for pyrex glass), and then allowed to soak at this temperature for 5 minutes. The gauge was then removed from the furnace and allowed to cool in the open air. Current leads were formed by painting strips of silver paste (Hanovia silver paste No, 38 thinned with white spirit) from the ends of the platinum to the edge of the glass and then reheating the glass to its softening temperature. Shielded copper wires were soldered to the ends of the silver and the entire glass disc was mounted flush in a steel plate with the leads passing through small holes drilled in the plate. Vacuum wax was used as a seal. This steel plate was then used as the shock-tube end wall, taking care to ensure that the gauge surface was normal to the geometrical axis of the tube.

Several gauges were constructed by this technique*, the thinnest being finally selected for shock-tube testing. Measurements of its thickness distribution were obtained with a Talysurf surface-finish measuring device, and a sketch of one reasonably typical result is presented in Fig. 6a. The thickness distribution exhibited is roughly parabolic, but records obtained at different positions along the film axis showed occasional random "holes" and "spikes" superposed on the basic distribution, so the film does not have a uniform thickness distribution along its axis. Allowing for some interpenetration of glass and metal at their interface, the average film thickness was estimated to be about 500 K.

The temperature coefficient of the film was determined by passing * The author is grateful to V. Marshall and J. Lewak for assistance

in constructing these chemically deposited gauges. Taylor-Hobson Ltd.. England.

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a stabilized 1 mA current through the gauge and measuring the voltage across the gauge at different gauge temperatures with a digital voltmeter (10 /uV resolution). To stabilize the gauge temperature, the gauge was immersed in a small volume of silicone oil and heated in a water bath. The silicone oil had no observable short or long-term effect on the gauge resistance^ Over a temperature range of about 20 C, the coefficient was 2. 3 X 10' C . Although this numerical value was not needed for reducing the accommodation-coefficient data, it was important for purposes of comparing the sensitivity of the three different thin-film gauges. The gauge resistance was 220 ohms.

Chemically deposited gauges are extremely robust but have three important disadvantages for use in accommodation-coefficient studies: (1) the minimum film thickness is still rather large, (2) the filna thickness i s not uniform and cannot be accurately determined because of the glass-metal matrix formed during the bonding process, and (3) the film material is not pure platinum. For these reasons it was decided to construct a second gauge with improved characteristics making use of vacuum-evaporation techniques.

Vacuum evaporation is a well established method for depositing metal on glass, but it is not always a simple naatter to obtain a robust film of the desired material and thickness. Platinum is a particularly difficult material to deposit because of its high evaporation temperature, but after considerable effort a number of quite satisfactory gauges were constructed. The major difficulty was obtaining a film with suitable adherence to the glass substrate. This problena was eventually solved using a vacuum chamber equipped with an electron-beam heating unit*. With this apparatus, a molybdenum filament was used as a ring cathode, held at about -4 kV, and a carbon crucible filled with platinum was used as the anode, held at earth potential. The filament was heated with a high current (about 30 amps) until it emitted electrons which were accelerated and focussed onto the platinum, thus heating it to the proper evaporation temperature. The glass substrate, appropriately masked, was held about 15 cm above the crucible. A thin quartz crystal, vibrating in shear mode, was mounted at about the same distance from the crucible so that the glass substrate and the quartz crystal received the same evaporated-layer thickness and the changing frequency of the crystal could be monitored to infer the filna thickness.

It is well known that as the thickness of a vacuum-evaporated metal film is reduced below a certain limit its resistivity begins to increase from the usual bulk-material value. This limit is about 1000 A. In addition to the increasing resistivity, the temperature coefficient of resistance, X, which is normally positive, begins to decrease. At a thickness normally in the range of 100 A the coefficient X actually turns negative. The thinness of a temperature sensor constructed by this technique is thus usually limited by the minimum value of X acceptable, i. e. . by the minimum acceptable gauge sensitivity. The reason for the variation in X has to do with changes in the naode of electrical conduction which occur in very thin layers. Since

* Bir-Vac, electron-bombardment source RG2; Swindon Road. Cheltenham. England.

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20

-electron mean free paths in bulk metals may be in the range 400-800 A at room temperature, it is easy to appreciate that surface effects will act to decrease the effective mean free path in films less than 1000 A thick. In addition, for films less than, say, 100 A. the material structure is likely to be quite different than that of the bulk material and probably resembles aggregates of atoms or crystallites slightly separated on the glass substrate. Electrons might then move by a type of tunneling which would explain the observed negative values for X.

Previous construction of thin-film resistance thermometers has made use of films with positive values of X, but it was decided here, because of the importance of obtaining a very thin filna, to attempt to build a gauge with a negative value of X. The results of the initial attempts reported here are both encouraging and discouraging. A number of gauges with negative X were actually constructed, and the values of X were in some cases larger in

naagnitude than the value for the bulk material, but it was not possible to reproduce given gauge characteristics with any degree of reliability. Further-naore, the thickness of the gauge with the most-negative X value was much greater than expected. These irregularities can probably be explained by the fact that the character of an evaporated film depends on several factors

which were not rigidly controlled or monitored in our initial experiments.

Amongst these factors we may mention: the nature of the substrate, and its previous treatnaent and cleanliness; the temperature of the substrate during and following deposition, the distance of the substrate from the source; the rate of deposition; the ability of defects in the film to diffuse or anneal out of the film at the temperature of the glass during and following deposition; the amount of oxygen or other inapurities in the vacuum chamber and in the substrate itself.

The gauge finally selected for use in shock-tube tests was constructed as follows. F i r s t the glass, a pyrex disc 5 nam thick by 50 mm in diameter was thoroughly cleaned with isopropyl alcohol and cotton and naounted in the vacuum chamber. After evacuating the chamber to about 10 torr, a 1 cna square of platinum was deposited onto the glass using the electron beam to heat the platinum source. The glass and mask were held about 15 cm from the source and the deposition rate maintained for one minute was about 50 A/minute according to the crystal monitor. The glass was renaoved from the chamber after 30 minutes of cooling and its resistance was measured to be about 8000 ohms/square. Current leads 1 cm wide were then applied leading

from opposite edges of the glass and approaching within j nam of each other.

The resistive element was thus a strip of bare platinum ^ mm long (in the direction of current flow) by 10 mm wide, and the final resistance was 400 ohms. The current leads were formed by deposition a 10 A layer of chrome followed by a 5000 A layer of gold. The thin layer of chrome greatly

improved the bond between the gold and the glass substrate. It was important that the vacuum was not broken between the deposition of chrome and gold in order to maintain the bond between the chrome and the glass, and this was accomplished with a mechanism which permitted a new crucible to be rotated into the heating position by external controls,

The thickness of the platinum layer was measured by the Talysurf and a sketch of the result is shown in Fig. 6b. Note the uniformity of the deposit compared with the chemically deposited film shown in Fig. 6a. This

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is an important advantage for purposes of accommodation experiments since it is important to know the film thickness rather accurately and to present a uniform, smooth surface to the hot gas molecules undergoing thermial accommodation. The thickness of the evaporated gauge is, surprisingly, about 400 A. A much thinner layer was expected on the basis of the crystal frequency readings, the resistance of the film and the optical transparency of the film. It is felt in retrospect that an oxide layer naust have formed on the surface of the platinuna and this was

responsible for the unexpectedly large thickness. The measurement e r r o r introduced by the Talysurf is thought to be negligible.

The resistance-temperature coefficient of this gauge was measured (with the thermal-bath apparatus described earlier) to be - 3 . 6 x lo" C " ' This is actually larger in magnitude than the bulk value of X and hence

represents a considerable improvement in sensitivity over previous chemically or vacuum-deposited platinum resistance thermometers. For purposes of the thermal-accommodation experiments, however, the present gauge was only a partial success, since it was only naarginally thinner than the chemically deposited film and the surface of the filna was suspected of being contaminated by oxygen.

In spite of its imperfections, the vacuum-evaporated gauge developed here furnishes evidence that the concept of a truly thin temperature sensor with a highly negative resistance-temperature coefficient is feasible, and this evidence together with the potential of such a device certainly justifies further research along these lines,

During the development stages of the "negative-X" gauge, contact was established with the Fluid Dynamics Group of the Physics Department of Eindhoven University, The Netherlands, where similar work was in progress. Their efforts were directed towards the development of thin vacuum-sputtered films, also of platinum, and Mr, M. van Dongen of that group graciously loaned one of their conapleted gauges for use in the present study. Thus three thin-film gauges, each constructed by an entirely different technique, were available for shock-tube testing aimed at measuring the thermal accommodation coefficient of N on platinum,

The Eindhoven sputtered gauge was made with the cathode sputtering technique, which involved depositing the film by means of an electrical discharge between an anode and a platinuna cathode. The process was carried out with a pyrex disc (10 mm thick by 20 mna diameter)

appropriately masked and mounted in a chamber filled with about 0, 03 torr argon. The gauge was then baked in an atmosphere of hydrogen at 400 C for half an hour. The final resistance element of the Eindhoven gauge was a platinum strip 1 nam wide and 15 mm long with silver paste used to connect the platinuna to copper leads buried in the sides of the pyrex disc. The element resistance was 800 ohms. The resistance-temperature coefficient was measured by the Eindhoven group to be about 1. 0 x lO' C ' , which is rather small, but this value was acceptable in view of the primary objective of constructing the thinnest usable gauge. A sketch of the thickness

distribution measured with the Talysurf is shown in Fig. 6c. An accurate estimate of the thickness is made difficult by the roughness of the pyrex

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22

-surface but an approximate thickness is 225 K. This gauge was thus thinner than either the chemically deposited gauge or the "negative-X" evaporated gauge. Unfortunately, the present sputtered gauge suffered from the disadvantages of reduced sensitivity and non-uniform surface finish, although it should be possible to construct a similar gauge with inaproved surface finish using a highly

polished pyrex disc for the substrate. 4, 3 Results

A series of shock-tube tests was conducted with each of the three thin-film thermometers discussed above. The test was was nitrogen in all cases. The ultimate objective was to obtain values for the accommodation coefficient representative of each gauge material over a range of gas pressures, and this was accomplished by using different combinations of initial pressure and shock-wave Mach number. The electronic circuitry was the same for all the tests except that the load resistors were different for each gauge and the value of the supply voltage was varied from run to run in order to provide the desired anaplitude for the gauge response.

The influence of changing the pressure level is apparent in Fig. 7 which presents the results of three experiments conducted with the chemically

deposited gauge. The oscilloscope traces record the change in the voltage drop across the gauge with time, and this is directly equivalent to a record of the change in the average gauge temperature versus time, (Time increases from left to right on all traces. ) Records are presented with two sweep speeds for each experiment, the fast sweep being useful for resolving the initial transients while the slow sweep is useful for estimating the final. asymptotic signal amplitude. In addition, the slow sweep record provides a convenient check on the performance of the shock tube and recording apparatus since theory predicts the signal should asymptote to a constant value while non-ideal effects, such as unaccounted-for gas dynamic influences, would have altered this result. The individual records at each test condition were obtained by repeating the experinaent rather than by recording the result of a single run simultaneously with two different oscilloscope plug-in units as this latter naethod would have increased the circuit response time. Differences in the anaplitude of the fast and slow-sweep signals for the sanae test conditions were due to small variations in the power supply voltage.

The primary observation to be naade from Fig. 7 is that the

character of the signal becomes more like a step at higher pressures, and this is in agreement with the theory (see Section 3) which says that the characteristic accommodation time is proportional to the collision time interval in the gas. Increasing the pressure level decreases the average collision time interval in the gas and hence the characteristic accommodation time. Ultimately, as the pressure level is increased enough, accommodation effects naay be neglected and the deviation from a perfect step response is due exclusively to finite gauge thickness. In this limiting circumstance we r e -cover the continuum result discussed in Section 2 in which no temperature jump is present at the gas-solid interface.

Results obtained with the vacuum-evaporated gauge at similar conditions are presented in Fig. 8. The signal is negative-going rather

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than positive-going for t h e s e e x p e r i m e n t s because the t e m p e r a t u r e coefficient of r e s i s t a n c e is negative for this gauge. O t h e r w i s e , the r e s u l t s a r e s i m i l a r to those p r e s e n t e d in Fig. 7 except that the c h a r a c t e r i s t i c r e s p o n s e t i m e s exhibited by the v a c u u m - e v a p o r a t e d gauge a r e s o m e w h a t l e s s owing to a s m a l l e r value of film t h i c k n e s s .

R e s u l t s obtained with the v a c u u m - s p u t t e r e d gauge a r e shown in F i g , 9. The influence of gauge t h i c k n e s s is now m o r e afiparent and is p a r t i c u l a r l y obvious if one c o m p a r e s the r e s u l t s shown in F i g s . 7c and 9c. Note a l s o that the signal amplitudes a r e s m a l l e r in Fig. 9 than in F i g s 7 and 8 owing to the r e d u c e d s e n s i t i v i t y of the s p u t t e r e d gauge.

The r e s u l t s p r e s e n t e d in F i g s . 7-9 provide confidence in the shock-tube technique as a m e a n s of obtaining t r a n s i e n t - t e m p e r a t u r e r e c o r d s s e n s i t i v e to the c h a r a c t e r i s t i c accommodation t i m e in the g a s . The s i g n a l s a r c r e a s o n a b l y free from e l e c t r i c a l noise and the oscilloscope t r a c e s a r e of good quality so that the a c c u r a c y of data e x t r a c t e d from t h e s e r e c o r d s should be r e l a t i v e l y high. The constancy of the signal a m p l i t u d e s for l a r g e t i m e s s u g g e s t s that the shock tube was operating s a t i s f a c t o r i l y over this r a n g e of t e s t conditions. In o r d e r to verify this l a s t point, e s p e c i a l l y for those c a s e s w h e r e the a s y m p t o t i c signal level w a s not obvious, a n u m b e r of r e c o r d s w e r e a l s o obtained with a 5 o r

10 /..sec/div sweep speed, and t h e s e i n v a r i a b l y showed a suitable period of uniforna t e m p e r a t u r e following the a c c o m m o d a t i o n p r o c e s s . At low i n i t i a l p r e s s u r e s this period of constant gauge t e m p e r a t u r e was of c o u r s e much s h o r t e r , and a g r a d u a l i n c r e a s e in gauge t e m p e r a t u r e owing to s i d e - w a l l boundary l a y e r effects began to be a p p a r e n t . P r i m a r i l y for this r e a s o n , t e s t s w e r e not made at initial p r e s s u r e s l e s s than 1 t o r r .

The task of i n f e r r i n g the c h a r a c t e r i s t i c accommodation time from the e x p e r i m e n t a l r e c o r d s was a c c o m p l i s h e d by first replotting each of the r e c o r d s in the form shown in F i g . 10. In brief, the p r o c e d u r e followed w a s to e s t i m a t e the asympotic signal l e v e l , AT (oo), from the slow s w e e p -speed r e c o r d and then to use this value to [)ut flie data s c a l e d from the o s c i l l o g r a m s into the d i m e n s i o n l e s s form AT (t)/AT (oo). The d i m e n s i o n l e s s r e s p o n s e was then s u b t r a c t e d from 1.0 and plotted v e r s u s 1/Vl so that the gauge r e s p o n s e at l a r g e t i m e s fell on a s t r a i g h t line passing through the origin. (Small c o r r e c t i o n s to the e s t i m a t e of the a s y m p t o t i c signal level w e r e usually r e q u i r e d to e n s u r e that the line through the data did p a s s through the origin. ) The choice of the nonlinear time s c a l e was suggested by Eq. (3. 25) which is an a p p r o x i m a t e r e s u l t for the gauge r e s p o n s e valid for l a r g e t i m e . The slope of the asymptotic line through the data for l a r g e values of AT (t)/AT (oo) was then used in conjunction with Eq. (3. 25) to infer the value of the c h a r a c t e r i s t i c accommodation time T . The value of T was calculated from the T a l y s u r f m e a s u r e m e n t s of the film t h i c k n e s s and ^ the b u l k - m a t e r i a l value for the t h e r m a l diffusivity in platinum. The value of T i n f e r r e d in this m a n n e r was then c o n v e r t e d to a value for the

a c c o m m o d a t i o n coefficient a using the definition provided in Eq. (3.7) t o g e t h e r with the values of T plotted in Fig. 4.

The plot shown in Fig. 10 c o r r e s p o n d s to the t r a c e shown in Fig. 9b, but the c h a r a c t e r of the plot is r e p r e s e n t a t i v e of the other e x p e r i m e n t s as well. A point worth noting i s that plotted data w e r e g e n e r a l l y r e s t r i c t e d

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24

-to times greater than 0. 1 jusec following shock reflection in order -to avoid e r r o r s associated with finite circuit response time, any misalignment of the gauge, and shock-structure effects. Therefore at high pressures the maxim.um plotted value for the quantity 1 - AT (t)/AT (oo) was substantially less than at lower pressures, and accordingly the accuracy for the slope of the line drawn through the data was poorer. Since the slope of the straight-line asymptote actually depends on two factors, the gauge-response tinae and the characteristic accommodation time, it is also clear that any e r r o r in the value taken for the gauge-response time affects the accuracy of the value inferred for the accommodation time. The most accurate values for a are thus measured at low pressures, when the accommodation time is largest, and with a thin gauge so that the influence of the gauge-response time is minimized. The minimum pressure which can be used is fixed of course by the shock-tube performance, and this depends strongly on the size of the shock tube available and the growing influence of shock-structure effects at low p r e s s u r e s .

Also shown in Fig. 10 is a solid curve computed from the exact theoretical result, Eq. (3. 16), using the value of a inferred from the straight-line asymptote. The theoretical curve fits the data quite well for values of 1//T less than about 2, ( i . e . , for values of t > 0. 2 lusec), thereby justifying the use of the straight-line technique. In fact a computer program was written for calculating this curve for input values of T , T and Q. (see Eq. (3. 16)), and this program was used to check the straignt-line result of each experiment. Another check was provided by replotting the theoretical and experimental responses of the gauge in real time as shown in Fig. 11, again making use of the data shown in Fig. 9b, The agreement is clearly quite acceptable, and only for times less than 0, 2 /usee are there any large differences between experiment and theory. Most of this discrepancy, also visible in Fig. 10, is almost certainly associated with shock-structure effects which represent an increasing problem at low pressure since the finite thicknesses of the incident and reflected shock waves (and hence the time required to compress and heat the gas to its reflected-shock value) are inversely proportional to the initial pressure. The distortion in the temperature-time histories introduced by finite shock thickness can be tolerated of course until it begins to affect the straight-line asymptote. Ultimately, however, this non-ideal effect does become important, thus providing yet another reason for not performing shock-tube accommodation experinaents at very low pressures,

Final results for the accommodation coefficients found in the present study are plotted as a function of pressure in Fig. 12. The values appear to be nearly constant with pressure for each gauge, although a slight trend for decreasing a with increasing pressure may be present. The scatter of the data precludes any quantitative statenaent on this point. There is also apparently little dependence of the accommodation coefficient on the average gas temperature since the experiments were run over a Mach number range of 1. 3 to 2. 7 which corresponds to a range of average gas temperatures from 360 to 750°K.

The similarity of the results for the three gauges leads to speculation that the surface finish and the physical structure of the thin film do not play a dominant role in determining o over this range of pressure. This

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hypothesis would be true, for example, if an adsorbed layer of gas was present on all the gauge surfaces so that the shock-heated gas was accommodated by collisions with adsorbed gas molecules rather than by collisions with platinum atoms. The results for the different gauges do differ enough, however, and with sufficient consistency, to conclude that the type of platinum film has some effect on the accommodation coefficient, even at high pressure.

Presumably, the most accurate data were obtained with the vacuum-sputtered and vacuuna-evaporated gauges, since these gauges have the smallest gauge-response times, but roughly the same amount of scatter if present in the data corresponding to each of the three gauges. One would thus suspect that the scatter was due primarily to shock-tube irregularities and e r r o r s in auxiliary measurements such as shock speed, initial temperature and pressure, e t c . , rather tlian to e r r o r in the value taken as the gauge-response time.

The results of the present study are conapared with the findings of previous investigations in Fig. 13. At the relatively high pressure levels employed here only the data of Busing and Clarke (Ref, 3) are available for direct comparison, and their results are represented by means of a curve drawn with least-niean-square deviation through their data. The present data agree poorly v/ith those of Busing and Clarke, but it is now known that the source of this disagreement was the neglect of finite gauge thickness in their data reduction scheme. Since their gauge was approximately 5000 A thick, and their tests were conducted at rather high pressures, the dominant influence in their temperature-time histories was actually gauge thickness rather than acconamodation effects. The present shock-tube data thus supercede those of Busing and Clarke.

The results presented by Wachmann (Ref. 1) were obtained at much lower pressures and by an entirely different technique, so the agreenaent with the present findings can be regarded as quite good. As with nearly all thermal-accommdoation data, these results were obtained with a conductivity cell. The technique involves naeasurenaents made with steady-state con-ditions of thermal accommodation, so the precision of the data and the lack of scatter are generally excellent. However, large differences between accommodation coefficients naeasured in different laboratories still exist, In fact, published data for the acconamodation coefficient of N on platinum. obtained with this technique range from about 0, 55-0, 81, so tne results shown in Fig, 13 are reasonably representative of previous conductivity-cell results. (See Wachmann Ref, 1, Kennard Ref, 5, and Devienne Ref. 15, for a summary of such results and a description of the apparatus and techniques comnaonly employed at low pressures).

The present results obviously exhibit a larger scatter than the

conductivity-cell data, but this is to be expected with measurements made on a naicrosecond tinae scale, and it should be possible to reduce this scatter sonaewhat in future work. In spite of the scatter, the results obtained here are quite useful in that they provide data at pressures not accessible with previous techniques. In addition, and perhaps more importantly, we have developed a theory for the influence of thermal accommodation in an nonsteady situation and have shown experimentally that the same accommodation coefficient holds for the the unsteady case as has been measured in steady circunastances.

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