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sinnGtics DUAL 128-132 NT STATIC

SHIFT REGISTERS 2521 2522

DESCRIPTION

These Signetics 2500 Series Dual 128 and 132 bit recircu­

lating static shift registers consist of enhancement mode P-channel silicon gate MOS devices integrated on a single monolithic chip.

FEATURES

• P U SH -P U LL O U TPUTS

• T T L /D T L CO M PA TIB LE CLOCK - P R O VIDES E X T R E M E L Y LOW CLOCK C A PA C ITA N CE

• R E C IR C U L A T IO N PATH ON CHIP

• TWO B IT LEN G THS A V A IL A B L E

• H IG H FR E Q U E N C Y O P E R A T IO N - 2M H z T Y P IC A L CLOCK R ATE

• T T L , D T L C O M PA TIB LE SIG N A LS

• S T A N D A R D PACKAGE - 8 LEA D S ILIC O N E DIP

• S IG N E TIC S P-MOS S ILIC O N G A TE PROCESS T E C H N O LO G Y

APPLICATIONS

LOW COST S E Q U E N T IA L ACCESS M E M O R IE S LOW COST S TA TIC B U FFER M E M O R IE S C R T R E FR ESH M E M O R IE S - LIN E STO R A G E L IN E PR IN TE R S

CASSETTE RECO RDERS

BIPOLAR COMPATIBILITY

The clock and signal inputs of these registers can be driven directly by standard bipolar integrated (T T L , D T L , etc.) or by MOS circuits.

SILICON GATE MOS 2500 SERIES

PIN CONFIGURATION

(Top View) V PACKAGE

c

L 1. Recirculate 8. V Gc

*L

□ 7 2. IN-] 7. IN2

3 | I 3. OUT 1 6. OUT2

«c

_ 4. V GG 5. 01N

J B

TRUTH TABLE

RECIRCULATE INPUT FUNCTION

0 0 Recirculate

0 1 Recirculate

1 0 "0 " is Written

1 1 "1 " is Written

N O T E : " 0 " = O V ; " 1 " - + 5 V .

PART IDENTIFICATION TABLE

PART B IT LEN G TH PACKAGE

NUMBER

2521V Dual 128 8 Pin DIP

2522V Dual 132 8 Pin DIP

BLOCK DIAGRAM

7-102

(2)

SILICON GATE MOS ■ 2521, 2522 MAXIMUM GUARANTEED RATINGS (1)

Operating Ambient Temperature (2) 0°C to +70°C

2.

Storage Temperature -6 5 °C to + 1 50°C

3.

4.

Package Power Dissipation

at T A = 70 °C 535 mW 5-

M 6.

7.

Data and Clock Input Voltages 8.

and Supply Voltages with

NOTES:

1. Stresses above those listed under "M axim um Guaranteed Rating"

may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or at any other condition above those indicated In the operational sections of this specification is not implied.

For operating at elevated temperatures the device must be derated based on a + 1 5 0 °C maxim um Junction tem perature and a'thermal resistance of 150 °C /W junction to ambient.

All Inputs are protected against static charge.

Parameters are valid over operating tem perature range unless specified.

All voltage measurements are referenced to ground.

Manufacturer reserving the right to make design and process changes and improvements.

Typical values are at +25°C and nom in. supply voltages.

V ę ę tolerance is Ż5% . Any variation in actual V ę ę will be tracked directly by V | L, V |H ' ancl v OH wh,cł1 are stated fo ra V Cc ° f exactly 5 volts.

respect to Vq q + 0 .3 V to -2 0 V

DC CHARACTERISTICS

= 0°C to + 7 0 ° C ;V c c = + 5Vi[8);,VQQ = -1 2 V ±5% unless otherwise noted.

SYM B O L TEST M IN TY P M A X U N IT C O N D IT IO N S

'Ll INPUT LOAD CURRENT 10 500 nA V |n=5 .5 V ,TA = 25°C

'l c CLOCK LEAKAGE CURRENT 10 500 nA V ILC = G N D ' T A = 25 c

'g g POWER SUPPLY CURRENT 28 32 mA CONTINUOUS OPERATION

F = 1,5MHz, Ta=25°C

V IL INPUT "LOW" VOLTAGE 1.05 V

V IH INPUT "H IG H " VOLTAGE 3.2 5.3 V

V ILC CLOCK INPUT "LOW" VOLTAGE 1.05 V

V IHC CLOCK IN P U T " H IG H " VOLTAGE 3.2 5j3 V

CONDITIONS OF TEST Input rise and fall times: 10 nsec. Output load is 1 T T L gate

TIMING DIAGRAM

7-103

(3)

SILICON GATE MOS ■ 2521, 2522

AC CHARACTERISTICS

% : = + 5 V <8 >; V GG =

‘ 12v

± 5 % « V IC = 0.4 to 4.0; t A =0° to +70°C

SYM BOL TEST M IN TY P M A X U N IT C O N D IT IO N S

FREQUENCY CLOCK REP RATE DC 1.5 MHz See Maximum Frequency Curve

t^PW CLOCK PULSE WIDTH .350 .100 100 Msec

40PW CLOCK PULSE WIDTH .200 DC H$ec

t R/ *F CLOCK PULSE TR A NSITIO N 1 usee

l DS DATA WRITE (SET-UP) TIME 75 nsec

l DH DATA TO CLOCK HOLD TIME 50 nsec

ł A CLOCK TO DATA OUT D ELAY 250 350 nsec

ł RS RECIRCULATE SET-UP TIME 50 ns

*RH RECIRCULATE HOLD TIME 50 ns

C IN INPUT CAPACITANCE 5 PF @ 1MHz; V in = V c c ;

V AC = 25m V p-p

C0 CLOCK CAPACITANCE 5 PF @ 1MHz; V0 = V CC;

Va c = 2 5 r n V p-p

< O r OUTPUT "LOW" VOLTAGE -4.0 0.4 V 1 TT L load ( lL=1.6mA)

v OHI OUTPUT "H IG H " VOLTAGE

D R IV IN G 1 TT L LOAD 3.0 3.5 V 1 TT L load (I, = 100|UA)

V OH2 OUTPUT "H IG H " VOLTAGE

D R IV IN G MOS 3.5 4.0 V

TIMING DIAGRAM

7-104

(4)

SILICON GATE MOS ■ 2521,2522 SCHEMATIC DIAGRAM

APPLICATIONS DATA

T T L /D T L /M O S IN TE R FA C E S

7-105

(5)

SILICON GATE MOS ■ 2521, 2522 APPLICATIONS INFORMATION

M U L T IP L E X IN G LIN E M E M O R Y REGISTERS A T 3M H z D A T A R A TE

CHARACTERISTIC CURVES

7-106

(6)

SILICON GATE MOS ■ 2521, 2522 132 COLUMN LINE PRINTER

LINE MEMORY 132 X 10

7-107

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