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EFFECT OF HIGH ELECTROSTATIC ACTUATION ON THERMOELASTIC DAMPING IN THIN RECTANGULAR MICROPLATE RESONATORS

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53, 2, pp. 317-329, Warsaw 2015 DOI: 10.15632/jtam-pl.53.2.317

EFFECT OF HIGH ELECTROSTATIC ACTUATION ON THERMOELASTIC DAMPING IN THIN RECTANGULAR MICROPLATE RESONATORS

Ardeshir Karami Mohammadi, Nassim Ale Ali

Department of Mechanical Engineering, Shahrood University of Technology, Iran e-mail: akaramim@yahoo.com

In this paper, a micro resonator is modeled as a thin rectangular microplate with ther-moelastic damping that is actuated electrostatically. Large static deformation due to high polarization voltage is considered, and vibration of microplate occurs around the static de-flection. Due to the effect of thermoelastic damping, the frequency of vibration is a complex value that is used to determine the quality factor of thermoelastic damping. Also, the pull-in voltage is considered because nonlinear properties are more appeared when approaching the polarization voltage to the pull-in voltage.

Keywords:microplate resonator, thermoelastic damping, high polarization voltage

1. Introduction

Thermoelastic damping is the intrinsic damping in Micro Electro Mechanical Systems (MEMS). It arises from the entropy generation due to irreversible heat flux in vibrating device (Sun and Saka, 2009). Zener (1937, 1938) was the first who predicted thermo-elastic damping. He found an expression for quality factor of thermoelastic damping in beams. Conversion of mechanical energy into heat in vibrating elastic beams was treated by Alblas (1981). He also found that this damping is negligible for macro structures. Lifshitz and Roukes (2000) investigated the quality factor of a thermo-elastic microbeam and found that thermoelastic damping has important effects in micro and nano scales.

There are two methods for calculating the quality factor of thermoelastic damping: energy method, in which dissipated and maximum stored energy should be calculated (Sudipto et al., 2006; Prabhakar and Vengallatore, 2008; Serra and Bonaldi, 2009; Guo and Rogerson, 2003), and eigenfrequency method, in which real and imaginary parts of the eigenfrequency should be calculated (Sun and Saka, 2009; Nayfeh and Younis, 2004b; Yi and Matin, 2007; Choi et al., 2010). Each method can be done with numerical or analytical procedures or combination of them.

Nayfeh and Younis (2004b) modeled the electrostatically actuated microplate by considering thermoelastic damping. They obtained an expression for quality factor analytically by using perturbation theory. Sudipto and Aluru (2006) investigated thermoelastic damping in an elec-trostatically actuated microbeam by the thermal energy method. They studied the effect of applied voltage on thermoelastic damping.

In MEMS, there are different actuation and sensing properties such as thermal, optical, electrostatic, electromagnetic, piezoresistive and piezoelectric but electrostatics is often preferred (Fargas Marqu`es et al., 2005). In electrostatics actuation, an elastic conductor is located above a stationary conductor. The electrical load can be composed of two components, including DC and AC voltage. The applied DC voltage deforms the elastic surface that causes to change the system capacitance and to stretch the mid-plane of the elastic surface. The applications are transistors, switches, micro-mirrors, pressure sensors, micro-pumps, moving valves and micro-grippers which

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have no harmonic motion in their systems. If AC voltage is added then resonators are obtained (Batra et al., 2007).

There are many works and papers that investigated the electrical actuation in micro struc-tures. Batra et al. (2007) reviewed them in their work. Abdel-Rahman et al. (2002) presented a nonlinear model of electrically actuated microbeams considering mid-plane stretching. They sho-wed static deflection of the microbeam due to DC polarization and vibration of the microbeam around its statically deflected position.

MEMS resonators are devices that vibrate with AC voltage around the static deflection due to DC polarization voltage. The thermoelastic damping as well as frequency of the structure of the resonator is affected by the DC voltage because the thermoelastic damping is directly related to the imaginary part of the frequency. In addition, in MEMS resonators, high sensitivity and resolution are needed (Nayfeh and Younis, 2004a), so for achieving this purpose, the damping in such devices should be decreased. However, studying the behavior of thermoelastic damping in resonators is necessary for manufacturers of MEMS.

In this paper, a resonator is modeled as a thin rectangular microplate with thermoelastic damping that is actuated electrostatically. Large static deformation due to high polarization voltage is considered, and vibration of the microplate occurs around the static deflection. Because of thermoelastic damping, the frequency of vibration is a complex value that is used to determine the quality factor of thermoelastic damping. Also, the pull-in voltage is investigated because nonlinear properties are more appeared when approaching the polarization voltage to the pull-in voltage.

2. Model description and assumptions

A resonator is modeled as a rectangular microplate subject to the effect of a high electrostatic polarization voltage Vp. The equations of motion of the isotropic thin microplate are derived by

using the combination of the classical plate theory and von-Karman type nonlinearity (Nayfeh and Pai, 2004). A Cartesian coordinate system (x, y, z) is attached to the microplate such that the xy plane corresponds to the mid-plane of the rectangular microplate over the domain 0 ¬ x ¬ a and 0 ¬ y ¬ b 2 ∂x2 + 1 2(1 + ν) 2v ∂x∂y + 1 2(1 − ν) 2 ∂y2 + ∂w ∂x 2w ∂x2 + 1 2(1 + ν) ∂w ∂y 2w ∂x∂y +1 2(1 − ν) ∂w ∂x 2w ∂y2 = 1 − ν2 Eh  ρh∂ 2 ∂t2 + ∂NT ∂x  2v ∂y2 + 1 2(1 + ν) 2 ∂x∂y + 1 2(1 − ν) 2v ∂x2 + ∂w ∂y 2w ∂y2 + 1 2(1 + ν) ∂w ∂x 2w ∂x∂y +1 2(1 − ν) ∂w ∂y 2w ∂x2 = 1 − ν2 Eh  ρh∂ 2v ∂t2 + ∂NT ∂y  D∇4w + ρh∂ 2w ∂t2 + N T2w = 1 12ρh 3 2 ∂t2(∇ 2w) − ∇2MT + Eh 1 − ν2 nh∂u ∂x + 1 2 ∂w ∂x 2 + ν∂v ∂y + 1 2 ∂w ∂y 2i2w ∂x2 + (1 − ν)∂u ∂y + ∂v ∂x+ ∂w ∂x ∂w ∂y  2w ∂x∂y +h∂v ∂y + 1 2 ∂w ∂y 2 + ν∂u ∂x + 1 2 ∂w ∂x 2i2w ∂y2 o + ε0V 2 p 2(d − w)2 (2.1) where

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MT = EαT 1 − ν h/2 Z −h/2 zθ dz NT = EαT 1 − ν h/2 Z −h/2 θ dz D = Eh 3 12(1 − ν2 2= 2 ∂x2 + 2 ∂y2 (2.2)

which are the thermal moment, thermal axial force, plate flexural rigidity and two-dimensional Laplacian operator, respectively, and θ = T − T0, in which T (x, z, t) and T0 are defined as the

temperature field of the beam, and stress-free temperature (in equilibrium), respectively. Also, t, αT, E, ν, h, d, ε0 and ρ are time, coefficient of thermal expansion, Young’s modulus,

Pois-son’s ratio, thickness of the microplate, capacitor gap, dielectric constant and material density, respectively. u, v and w are displacement components along with the x, y and z directions, respectively.

The thermal conduction equation, containing the thermoelastic coupling term, can be written as (Sun and Saka, 2009; Nayfeh and Pai, 2004)

κ∇2θ + κ∂ 2θ ∂z2 = ρcv ∂θ ∂t + βT0z ∂t ∂u ∂x+ ∂v ∂y −z 2w ∂x2 + 2w ∂y2  (2.3)

where cv and κ are the specific heat at constant volume and the thermal conductivity,

respecti-vely. β = EαT/(1 − 2ν) is the thermal modulus.

So equations (2.1) and (2.3) represent the governing equations of nonlinear vibration of the micro-plate with thermoelastic damping (TED). In addition, thermal and elastic properties are assumed independent of temperature, and the temperature change due to TED is assumed to be small, thus the vibration of the micro-plate is investigated in a constant temperature T0.

For convenience, the following nondimensional variables are introduced (denoted by hats)

b x = x a y =b y b z =b z h w =b w d b u = u u bv = v v t =b t t θ =b θ θ (2.4) where u = d 2 a v = d2 b t = 2ab h r E θ = βT0h2d2 tκb2 (2.5)

Substituting equations (2.4) into equations (2.1), the following equations are obtained

α1 2ub ∂xb2 + 1 2(1 + ν) 2bv ∂x∂b yb + 1 2(1 − ν) 2ub ∂yb2 + α1 ∂wb bx 2wb ∂xb2 + 1 2(1 + ν) ∂wb ∂yb 2wb ∂x∂b yb +1 2(1 − ν) ∂wb ∂xb 2wb ∂yb2 = (1 − ν 2 2 2ub ∂bt2 + (1 + ν)α3 ∂NbT ∂xb α−1 1 2vb ∂yb2 + 1 2(1 + ν) 2ub bx∂yb+ 1 2(1 − ν) 2bv ∂xb2 + α 1 1 ∂wb ∂yb 2wb ∂yb2 + 1 2(1 + ν) ∂wb ∂xb 2wb ∂x∂b yb +1 2(1 − ν) ∂wb ∂yb 2wb ∂xb2 = (1 − ν 2 4 2vb ∂bt2 + (1 + ν)α5 ∂NbT ∂yb

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α1 4wb ∂xb4 + 2 4wb ∂xb2yb2 + α 1 1 4wb ∂yb4 + (1 − ν 2)2wb ∂bt2 + (1 + ν)Nb Tα 6 2wb ∂xb2 + α7 2wb ∂yb2  (2.6) = (1 − ν2) 2 ∂bt2  α2 2wb ∂xb2 + α4 2wb ∂yb2  −(1 + ν)α8 2McT ∂xb2 + α9 2McT ∂yb2  +12α210nhα1 ∂ub ∂xb + α1 2 wb ∂xb 2 + ν∂vb ∂yb+ 1 2 wb ∂yb 2i2wb ∂xb2 +(1 − ν)∂ub ∂yb+ ∂vb ∂xb + ∂wb ∂xb ∂wb ∂yb 2wb ∂x∂b yb i +hα−1 1 bv ∂yb+ 1 2α 1 1 wb ∂yb 2 + ν∂ub ∂xb + 1 2 wb ∂xb 2i2wb ∂yb2 o + α11 Vp2 (1 −w)b 2

In this model, Lifshitz and Roukes (2000) assumption is used. So the thermal gradient in the z direction is much larger than the gradients in the x and y directions. Therefore, κ∇2θ in equation (2.3) can be ignored. Thus the equation is simplified, and substituting equations (2.4) into equations (2.3), yields

2θb ∂zb2 = α12 ∂θb ∂bt + ∂bt  α1 ∂ub ∂xb + bv ∂yb b z α10  α1 2wb ∂xb2 + 2wb ∂yb2  (2.7)

Equations (2.6) and (2.7) represent the nondimensional governing equations of the system, where α1= b2 a2 α2 = h2 12a2 α3 = αTθbb 2 d2 α4 = h2 12b2 α5= αTθab 2 d2 α6 = 12αTθbb2 h2 α7 = 12αTθab 2 h2 α8 = 12αTθbb 2 dh α9= 12αTθab 2 dh α10= d h α11= ε0a2b2 2d3D α12= ρcph3 2abκ s E (2.8) and b NT = 1/2 Z −1/2 b θ dzb McT = 1/2 Z −1/2 b θz db zb (2.9)

It should be noted that the parameters of equations (2.8) and (2.9) are related as follows α2 α4 = α1 α8 α9 = α2 α8 = αα10α12 α = 12α2TET0 (1 − 2ν)ρcp (2.10)

3. Large deformations under electrostatic load

The microplate undergoes deflection under electrostatic voltage Vp. For calculating this

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α1 2ubs ∂xb2 + 1 2(1 + ν) 2vbs ∂x∂b yb+ 1 2(1 − ν) 2ubs ∂yb2 + α1 ∂wbs ∂xb 2wbs ∂xb2 + 1 2(1 + ν) ∂wbs ∂yb 2wbs ∂x∂b yb +1 2(1 − ν) ∂wbs ∂xb 2wbs ∂yb2 = 0 α−1 1 2vb s ∂yb2 + 1 2(1 + ν) 2ub s bx∂yb+ 1 2(1 − ν) 2vb s ∂xb2 + α 1 1 ∂wbs ∂yb 2wb s ∂yb2 +1 2(1 + ν) ∂wbs ∂xb 2wb s ∂x∂b yb+ 1 2(1 − ν) ∂wbs ∂yb 2wb s ∂xb2 = 0 α1 4wb s ∂xb4 + 2 4wb s ∂xb2yb2 + α 1 1 4wb s ∂yb4 = 12α 2 10 nh α1 ∂ubs ∂xb + α1 2 wbs ∂xb 2 + νbvs ∂yb + 1 2 wbs ∂yb 2i2wbs ∂xb2 + (1 − ν) ubs ∂yb + bvs ∂xb + ∂wbs ∂xb ∂wbs ∂yb 2wb s ∂x∂b yb +hα−1 1 ∂vbs ∂yb + 1 2α 1 1 wbs ∂yb 2 + ν∂ubs ∂xb + 1 2 wbs ∂xb 2i2wbs ∂yb2 o + α11 Vp2 (1 −wbs)2 (3.1)

whereubs,vbs and wbs are static displacements. Nonlinear static equations (3.1) can be solved by

Galerkin’s method, using the following approximations (Szilared, 2004) b ws(x,b y) =b X m X n Wmns ϕmn(x,b y)b ubs(x,b y) =b X m X n Umns ψmn(bx,y)b b vs(x,b y) =b X m X n Vmns ψmn(x,b y)b (3.2)

To simplify the solution only the first term (m = n = 1) of equations (3.2) is considered. Substituting into equations (3.1) the functions ϕ11 and ψ11 as is listed in Table 1 with respect

to the boundary conditions, equations (3.1) become ZZ h α1U11s 2ψ11 ∂xb2 + 1 2(1 + ν)V s 11 2ψ11 ∂x∂b yb + 1 2(1 − ν)U s 11 2ψ11 ∂yb2 + α1  W11s ∂ϕ11 ∂xb  W11s 2ϕ 11 ∂xb2  +1 2(1 + ν)  W11s ∂ϕ11 ∂yb  W11s 2ϕ 11 ∂x∂b yb  +1 2(1 − ν)  W11s ∂ϕ11 ∂xb  W11s 2ϕ 11 ∂yb2 i ψ11dx db y = 0b ZZ h α−1 1 V11s 2ψ 11 ∂yb2 + 1 2(1 + ν)U s 11 2ψ 11 ∂x∂b yb + 1 2(1 − ν)V s 11 2ψ 11 bx2 + α−1 1  W11s ∂ϕ11 ∂yb  W11s 2ϕ 11 ∂yb2  +1 2(1 + ν)  W11s ∂ϕ11 bx  W11s 2ϕ 11 ∂x∂b yb  +1 2(1 − ν)  W11s ∂ϕ11 ∂xb  W11s 2ϕ 11 ∂yb2 i ψ11dx db y = 0b ZZ h α1W11s 4ϕ11 bx4 + 2W s 11 4ϕ11 ∂xb2yb2 + α 1 1 W11s 4ϕ11 ∂yb4 −12α 2 10 nh α1U11s ∂ψ11 ∂xb +α1 2  W11s ∂ϕ11 ∂xb 2 + νV11s ∂ψ11 ∂yb + 1 2  W11s ∂ϕ11 ∂yb 2i W11s 2ϕ 11 ∂xb2 + (1 − ν)U11s ∂ψ11 ∂yb + V s 11 ∂ψ11 ∂xb + W s 11 ∂ϕ11 ∂xb W s 11 ∂ϕ11 ∂yb  W11s 2ϕ 11 ∂x∂b yb +hα−1 1 V11s ∂ψ11 ∂yb + 1 2α 1 1  W11s ∂ϕ11 ∂yb 2 + νU11s ∂ψ11 ∂xb + 1 2  W11s ∂ϕ11 ∂xb 2i W11s 2ϕ 11 ∂yb2 o α11V 2 p (1 − W1111)2 i ϕ11dbx dy = 0b (3.3)

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Table 1.List of functions ψ11 and ϕ11 with respect to the boundary condition (Leissa, 1969) CCCC φ11= [cos(2πx) − 1][cos(2πb y) − 1]b ψ11= sin(πx) sin(πb y)b CF CF φ11= cos(2πx) − 1b ψ11= sin(πx cos(πb y)b

Introducing new parameters A1 = ZZ h α1 2ψ11 ∂xb2 + 1 2(1 − ν) 2ψ11 ∂yb2 i ψ11dx db yb A2 = 1 2(1 + ν) ZZ 2ψ 11 ∂x∂b ybψ11dbx dyb A3 = ZZ h α1 ∂ϕ11 ∂xb 2ϕ11 ∂xb2 + 1 2(1 + ν) ∂ϕ11 ∂yb 2ϕ11 ∂x∂b yb + 1 2(1 − ν) ∂ϕ11 ∂xb 2ϕ11 ∂yb2 i ψ11dx db yb A4 = ZZ h α−1 1 2ψ11 ∂yb2 + 1 2(1 − ν) 2ψ11 ∂xb2 i ψ11dx db yb A5 = ZZ h α−1 1 ∂ϕ11 ∂yb 2ϕ11 ∂yb2 + 1 2(1 + ν) ∂ϕ11 ∂xb 2ϕ11 ∂x∂b yb + 1 2(1 − ν) ∂ϕ11 ∂xb 2ϕ11 ∂yb2 i ψ11dx db yb A6 = ZZ  α1 4ϕ 11 ∂xb4 + 2 4ϕ 11 ∂xb2yb2 + α 1 1 4ϕ 11 ∂yb4 i ϕ11dx db yb A7 = −12α210 ZZ h α1 ∂ψ11 ∂xb 2ϕ 11 ∂xb2 + (1 − ν) ∂ψ11 ∂yb 2ϕ 11 ∂x∂b yb + ν ∂ψ11 ∂xb 2ϕ 11 ∂yb2 i ϕ11dx db yb A8 = −12α210 ZZ h ν∂ψ11 ∂yb 2ϕ 11 ∂xb2 + (1 − ν) ∂ψ11 ∂xb 2ϕ 11 ∂x∂b yb + α 1 1 ∂ψ11 ∂yb W s 11 2ϕ 11 ∂yb2 i ϕ11dx db yb A9 = −12α210 ZZ nhα1 2 ∂ϕ11 ∂xb 2 +ν 2 ∂ϕ11 ∂yb 2i2ϕ11 ∂xb2 + (1 − ν) ∂ϕ11 ∂xb ∂ϕ11 ∂yb 2ϕ11 ∂x∂b yb +h1 2α 1 1 ∂ϕ11 ∂yb 2 +ν 2 ∂ϕ11 bx 2i2ϕ11 ∂yb2 o ϕ11dx db yb F E = α11Vp2 ZZ ϕ 11 (1 − Ws 11ϕ11)2 dx db yb (3.4)

Equations (3.3) can be rewritten as

A1U11s + A2V11s + A3W11s = 0 A2U11s + A4V11s + A5W11s = 0

A6W11s + A7U11sW11s + A8V11sW11s + A9W11s = 0

(3.5) Now, by solving these equations, Us

11, V11s and W11s can be calculated, and then substituting

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4. Transverse vibration around the static deflection

The micro plate deflections have two components. The static deflections, as discussed in the previous section, due to the polarization voltage Vpand the dynamic vibration deflections, occur

around the static state. Consider only lateral vibration, thus the deflectionsu(b x,b y),b v(b x,b y) andb b w(bx,y,b bt) can be written as b w(bx,y,b bt) =wbs(x,b y) +b wbd(x,b by,t)b bv(x,b y,b bt) =vbs(x,b y)b b u(x,b y,b bt) =ubs(x,b y)b (4.1)

The equations describing vibration of the microplate around the static deflections are obtained by substituting equation (4.1) into equations (2.6)3 and (2.7) and dropping the terms representing

the equilibrium position that is the static deflection, equation (3.1)3, and high order terms of

the dynamic deflections. The result can be written as

α1 4wb d ∂xb4 + 2 4wb d ∂xb2yb2 + α 1 1 4wb d ∂yb4 + (1 − ν 2)2wbd ∂bt2 + (1 + ν)Nb Tα 6 2wb s ∂xb2 + α7 2wb s ∂yb2  = (1 − ν2) 2 ∂bt2  α2 2wbd ∂xb2 + α4 2wbd ∂yb2  −(1 + ν)α8 2McT ∂xb2 + α9 2McT ∂yb2  + 12α210nhα1 ∂ubs ∂xb + α1 2 wbs ∂xb 2 + νbvs ∂yb + 1 2 wbs ∂yb 2i2wbd ∂xb2 +hα1 ∂wbs ∂xb ∂wbd ∂xb + ν wbs ∂xb ∂wbd bx i2wb s ∂xb2 + (1 − ν)∂ubs ∂yb + ∂vbs bx + ∂wbs ∂xb ∂wbs ∂yb 2wb d ∂x∂b yb+ (1 − ν) wbs ∂xb ∂wbd ∂yb + ∂wbd ∂xb ∂wbs ∂yb 2wb s ∂x∂b yb +hα−1 1 ∂vbs ∂yb + 1 2α 1 1 wbs ∂yb 2 + ν∂ubs ∂xb + 1 2 wbs ∂xb 2i2wbd ∂yb2 +hα−1 1 ∂wbs ∂yb ∂wbd ∂yb + ν wbs bx ∂wbd ∂xb i2wb s ∂yb2 o + 11V 2 p (1 −wbs)3 b wd+ 11Vp (1 −wbs)2 v(bt) 2θb ∂zb2 = α12 ∂θb ∂bt + ∂bt  zb α10  α1 2wb d ∂xb2 + 2wbd ∂yb2  (4.2)

For calculating the quality factor of TED, coupled thermoelastic equations (4.2) should be solved in the case of harmonic vibrations. So,wbd andθ are set as in the followingb

b wd(x,b y,b z,b bt) = X n=0 X m=0 Wmn(x,b y,b z)eb iΩmnbt b θ(bx,y,b z,b bt) = X n=0 X m=0 Θmn(x,b y,b z)eb iΩmnbt (4.3)

where Wmn(x,b y) and Θb mn(x,b y,b z) are the (m, n)-th transverse mode shapes of the plate, andb

the associated temperature variation, respectively, and Ωmn is the complex frequency that has

the real part ωmn, and the imaginary part λmn which is related to the damping. Therefore,

substituting equations (4.3) into the equation of transverse vibration around static deflection (4.4)1 and thermal conduction equation (4.4)2 yields

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α1 4W mn ∂xb4 + 2 4W mn ∂xb2yb2 + α 1 1 4W mn ∂yb4 −Ω 2 mn(1 − ν2)Wmn + (1 + ν)NbmnT α6 2wbs ∂xb2 + α7 2wbs ∂yb2  = −Ωmn2 (1 − ν2)α2 2Wmn ∂xb2 + α4 2Wmn ∂yb2  −(1 + ν)α8 2McT mn ∂xb2 + α9 2McT mn ∂yb2  + 12α210nhα1 ∂ubs ∂xb + α12 wbs ∂xb 2 + νbvs ∂yb + 1 2 wbs ∂yb 2 )i 2W mn ∂xb2 + h α1 ∂wbs ∂xb ∂Wmn ∂xb + ν wbs ∂xb ∂Wmn ∂xb i2wb s ∂xb2 + (1 − ν)∂ubs ∂yb + ∂vbs bx + ∂wbs ∂xb ∂wbs ∂yb 2W mn ∂x∂b yb + (1 − ν)∂wbs ∂xb ∂Wmn ∂yb + ∂Wmn ∂xb ∂wbs ∂yb 2wb s ∂x∂b yb +hα−1 1 ∂vbs ∂yb + 1 2α 1 1 wbs ∂yb 2 + ν∂ubs ∂xb + 1 2 wbs ∂xb 2i2Wmn ∂yb2 +hα−1 1 ∂wbs ∂yb ∂Wmn ∂yb + ν wbs ∂xb ∂Wmn ∂xb i2wb s ∂yb2 o + 11V 2 p (1 −wbs)3 Wmn 2Θmn bz2 = α12 ∂Θmn ∂bt + ∂bt  zb α10  α1 2Wmn ∂xb2 + 2Wmn ∂yb2  (4.4) where b NmnT = 1/2 Z −1/2 Θmndzb McmnT = 1/2 Z −1/2 Θmnz db zb (4.5)

Assuming that there is no heat flow across the upper and lower surface of the beam, the boundary conditions for solving equation (4.4)2 are ∂Θmn/∂z = 0 atb z = ±1/2. Then solvingb

equation (4.4)2, and substituting the results into equation (4.5), the following equations are

obtained c MmnT = 1 α10α12 CmnT α1 2W mn ∂xb2 + 2W mn ∂yb2  b NmnT = 0 (4.6) where CmnT = 1 12 2 N3 mn h tanNmn 2  Nmn 2 i Nmn= (1 − i) s Ωmnα12 2 (4.7)

Therefore, equations (4.6) should be substituted into equation (4.4)1. Since in the case of

free vibration the amplitude of higher harmonic terms are dramatically small relative to the primary amplitude, their effects on thermoelastic damping are negligible. Thus by considering m = n = 1 and setting Wmn = ϕmn, Galerkin’s method is used for calculating Ωmn, see

Hagedorn and Gupta (2007). The function ϕ11 should satisfy the boundary conditions and is

selected with respect to the boundary conditions that are listed in Table 1. Therefore, equation (4.4)1 should be rewritten as

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ZZ h α1 4ϕ11 bx4 + 2 4ϕ11 ∂xb2yb2 + α 1 1 4ϕ11 ∂yb4 −Ω 2 mn(1 − ν211+ Ω2mn(1 − ν2)  α2 2ϕ11 ∂xb2 + α4 2ϕ11 ∂yb2  + (1 + ν)αCmnT α1 4ϕ11 bx4 + 2 4ϕ11 ∂xb2yb2 + α 1 1 4ϕ11 ∂yb4  −12α210nhα1 ∂ubs ∂xb + α1 2 wbs ∂xb 2 + νbvs ∂yb + 1 2 wbs ∂yb 2i2ϕ 11 ∂xb2 +hα1 ∂ψ11 ∂xb + α1 ∂wbs ∂xb ∂ϕ11 ∂xb + ν ∂ψ11 ∂yb + ∂wbs ∂xb ∂ϕ11 ∂xb i2wb s ∂xb2 + (1 − ν)∂ubs ∂yb + ∂vbs bx + ∂wbs ∂xb ∂wbs ∂yb 2ϕ 11 bx∂yb + (1 − ν)∂ψ11 ∂yb + ∂ψ11 ∂xb + ∂wbs ∂xb ∂ϕ11 ∂yb + ∂ϕ11 ∂xb ∂wbs ∂yb 2wb s ∂x∂b yb +hα−1 1 ∂vbs ∂yb + 1 2α 1 1 wbs ∂yb 2 + ν∂ubs ∂xb + 1 2 wbs ∂xb 2i2ϕ11 ∂yb2 + h α−1 1 ∂ψ11 ∂yb + α−1 1 ∂wbs ∂yb ∂ϕ11 ∂yb + ν ∂ψ11 ∂xb + ∂wbs ∂xb ∂ϕ11 ∂xb i2wb s ∂yb2 o 11V 2 p (1 −wbs)3 ϕ11 i ϕ11 dx db yb (4.8)

Introducing new parameters

L1 = α1[1 + (1 + ν)αC11T] L2 = 2[1 + (1 + ν)αC11T ] L3 = α−11[1 + (1 + ν)αC11T] P1 = ZZ 4ϕ 11 ∂xb4 ϕ11dx db yb P2 = ZZ 4ϕ 11 ∂xb2yb2ϕ11dx db yb P3= ZZ 4ϕ 11 ∂yb4 ϕ11dx db yb P4 = ZZ ϕ211dx db yb P5= (1 − ν2) ZZ h α2 2ϕ11 ∂xb2 + α2 α1 2ϕ11 ∂yb2  −ϕ11 i ϕ11dx db yb P6 = ZZ ( −12α210nhα1 ∂ubs ∂xb + α1 2 wbs ∂xb 2 + νbvs ∂yb + 1 2 wbs ∂yb 2i2ϕ11 ∂xb2 +hα1 ∂wbs ∂xb ∂ϕ11 ∂xb + ν wbs ∂xb ∂ϕ11 ∂xb i2wb s ∂xb2 + (1 − ν) ubs ∂yb + ∂vbs bx + ∂wbs ∂xb ∂wbs ∂yb 2ϕ 11 bx∂yb + (1 − ν)∂wbs ∂xb ∂ϕ11 ∂yb + ∂ϕ11 ∂xb ∂wbs ∂yb 2wb s ∂x∂b yb +hα−1 1 ∂vbs ∂yb + 1 2α 1 1 wbs ∂yb 2 + ν∂ubs ∂xb + 1 2 wbs ∂xb 2i2ϕ11 ∂yb2 +hα−1 1 ∂wbs ∂yb ∂ϕ11 ∂yb + ν wbs ∂xb ∂ϕ11 ∂xb i2wb s ∂yb2 o 11V 2 p (1 −wbs)3 ϕ11 ) ϕ11dx db yb (4.9)

Equation (4.8) can be written as follows

L1P1+ L2P2+ L3P3+ Ω112 P5+ P6 = 0 (4.10)

Finally, by calculating Ω11from equation (4.10) and separating the real and imaginary parts,

the quality factor of TED for large deformation of the microplate is obtained Q−1 = 2 λ11 ω11 (4.11)

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5. Pull-in voltage

Beyond the maximum value of DC voltage, the microplate of the resonator snaps and touches the rigid plate. This maximum value, denoted by VM, is called pull-in voltage (Batra et al., 2007).

For calculating VM, the minimum voltage at which the microplate becomes unstable, should be

found. For example, for a microplate whose properties are listed in Table 2, the pull-in voltage is shown in Fig. 1. As can be seen in this figure, beyond this voltage, that the microplate becomes unstable and the deflection grows suddenly. In this case, the pull-in voltage is VM = 130.73 V

and the related deflection is wbmax = 0.45.

Table 2.List of geometrical and material properties of the microplate

h [µm] d [µm] a [µm] b [µm] T0 [K] κ [Wm−1K1]

1.5 1.2 200 100 300 148

cp [Jkg1K1] αT [106K1] E [Gpa] υ [–] ρ [kg m−3] ε0 [C2m2N1]

712 2.6 170 0.25 2330 8.85 · 10−12

Fig. 1. Pull-in voltage in the microplate with properties listed in Table 2

6. Results

Francais and Dufour (1999) measured the centre deflection of a fully clamped square microplate under various electrostatic actuations. They depicted the center deflection versus the following parameter

CD = ε0V

2 p(ab)2

32d3D (6.1)

In Fig. 2, the static deflection at the centre of the plate wbmax, which is calculated here

using the Galerkin’s method, is compared with the experimental results of Francais and Dufour (1999). There is a good agreement between Francais and Dufour’s measurments and the large deformation model of microplate.

In Fig. 3, the large deformation model in two cases ν = 0 and ν = 0.25 are compared with Lifshitz model (Lifshitz and Roukes, 2000) in which the TED is calculated for the clamped-clamped microbeam. The microplate and microbeam have the same properties that are listed in Table 2. The microplate is also considered with the CFCF boundary condition and without electrical load (Vp= 0). As can be seen in Fig. 3, TED in the Lifshitz model and the microplate

with ν = 0 are in good agreement.

In Fig. 4, the TED of large deformation model is depicted versus α based on the configuration of Table 2, for two cases of voltages: Vp= 0.1VM and Vp= 0.9VM. α is an important parameter

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Fig. 2. Comparison of bwmax calculated using Galerkin’s method with the experimental results of Francais and Dufour (1999)

Fig. 3. Comparison of TED in large deformation models of the microplate (ν = 0 and ν = 0.25) with the Lifshitz model

because it represents the properties of the material. As can be seen in this figure, by increasing α the difference between two cases becomes larger. In small values of α, these two cases are coincided, so small α can change the nonlinear model to a linear model of the microplate. For example, α of silicon is α = 0.005, thus silicon has linear properties.

Fig. 4. TED of the large deformation model versus α

In Fig. 5, TED is depicted versus α1 that is geometrical parameter for α = α10 = α11 =

α12 = 1, α2 = 0.1, VM = 10.0899 and ν = 0.25. As can be seen in this figure, there is a critical

value of α1 in which TED has the maximum value. Also, the maximum values of TED are

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Fig. 5. TED of the large deformation model versus α

7. Conclusion

In this paper, a resonator is modeled as a rectangular microplate. TED of the microplate is cal-culated by linear and nonlinear assumptions. In the large deformation model, large deformation due to electrostatic load is considered by von-Karman assumptions. For calculating the thermo-elastic damping, the static and vibration equations are solved by using Galerkin’s method.

The material properties may exhibit nonlinear effects on TED, but silicon has linear proper-ties. Figures 4 and 5 have useful results for MEMS resonator designers about material properties and geometrical dimensions of the resonators. In the future work, the thermoelastic damping of a thick plate can be studied, and the thermal conduction equation can be solved in two dimensional space.

References

1. Abdel-Rahman E.M., Younis M.I., Nayfeh A.H., 2002, Characterization of the mechanical behavior of an electrically actuated microbeam, Journal of Micromechanics and Microengineering,

12, 759-766

2. Alblas J.B., 1981, A note on the theory of thermoelastic damping, Journal of Thermal Stresses,

4, 3/4, 333-355

3. Batra R.C., Porfiri M., Spinello D., 2007, Review of modeling electrostatically actuated microelectromechanical systems, Smart Materials and Structures, 16, 6, R23-R31

4. Choi J., Cho M., Rhim J., 2010, Efficient prediction of the quality factors of micromechanical resonators, Journal of Sound and Vibration, 329, 1, 84-95

5. Fargas M.A., Costa Castelló R., Shkel A.M., 2005, Modelling the electrostatic actuation of MEMS: state of the art 2005, Technical Report

6. Francais O., Dufour I., 1999, Normalized abacus for the global behavior of diaphragms: pneu-matic, electrostatic, piezoelectric or electromagnetic actuation, Journal of Modeling and Simulation

of Microsystems, 2, 149-160

7. Guo F.L., Rogerson G.A., 2003, Thermoelastic coupling effect on a micro-machined beam resonator, Mechanics Research Communications, 30, 6, 513-518

8. Hagedorn P., Gupta A.D., 2007, Vibrations and Waves in Continuous Mechanical Systems, Wiley

9. Leissa A.W., 1969, Vibration of Plates, DC: NASA, Washington

10. Lifshitz R., Roukes M.L., 2000, Thermoelastic damping in micro- and nanomechanical systems,

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11. Nayfeh A.H., Pai P.F., 2004, Linear and Nonlinear Structural Mechanics, Wiley, New Jersey 12. Nayfeh A.H., Younis M.I., 2004a, A new approach to the modeling and simulation of flexible

microstructures under the effect of squeeze-film damping, Journal of Micromechanics and

Micro-engineering, 14, 2, 170-181

13. Nayfeh A.H., Younis M.I., 2004b, Modeling and simulations of thermoelastic damping in mi-croplates, Journal of Micromechanics and Microengineering, 14, 1711-1717

14. Prabhakar S., Vengallatore S., 2008, Theory of thermoelastic damping in micromechanical resonators with two-dimensional heat conduction, Journal of Microelectromechanical Systems, 17, 2, 494-502

15. Serra E., Bonaldi M., 2009, A finite element formulation for thermoelastic damping analysis,

International Journal for Numerical Methods in Engineering, 78, 6, 671-691

16. Sudipto K. De, Aluru N.R., 2006, Theory of thermoelastic damping in electrostatically actuated microstructures, Physical Review B, 10, 144305-144318

17. Sun Y., Saka M., 2009, Thermoelastic damping in micro-scale circular plate resonators, Journal

of Sound and Vibration, 310, 392-405

18. Yi Y.-B., Matin M.A., 2007, Eigenvalue solution of thermoelastic damping in beam resonators using a finite element analysis, Journal of Vibration and Acoustics, 129, 4, 478-483

19. Zener C., 1937, Internal friction in solids. I. Theory of internal friction in reeds, Physical Review,

52,3, 230-235

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Physical Review, 53, 90-99

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