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SYNCHROTRON STUDIES OF HP-HT TREATED SILICON IMPLANTED WITH 42 MeV NITROGEN IONS

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KSUPS 2005: Extended abstracts / Synchrotron Radiation in Natural Science Vol. 4, No 1-2 (2005)

40 PA12

SYNCHROTRON STUDIES OF HP-HT TREATED SILICON IMPLANTED WITH 42 MeV NITROGEN IONS

K. Wieteska

1

, W. Wierzchowski

2*

, D. Żymierska

3

, J. Auleytner

3

, W. Graeff

4

, A. Misiuk

5

, and J. Choiński

6

1Institute of Atomic Energy, PL-05-400 Świerk, Poland

2Institute of Electronic Materials Technology, ul. Wólczyńska 133, PL 01-919Warsaw, Poland

3Institute of Physics of PAS, Al. Lotników 32/46, PL-02-668 Warsaw, Poland

4HASYLAB at DESY, Notke str. 85, D-22603 Hamburg, Germany

5Institute of Electron Technology, Al. Lotników 32/46, PL-02-668 Warsaw, Poland

6Heavy Ion Laboratory of the University of Warsaw, ul. Pasteura 5a, PL-02-093 Warsaw, Poland

Keywords: Si:N, high-pressure treatment, semiconductors, topography, swift heavy ion, ion implantation

*) e-mail: wierzc_w@sp.itme.edu.pl

The aim of present research is an attempt to explore physical mechanisms affecting transformations of nitro- gen-implanted silicon crystals if annealed under en- hanced pressure. The previously reported results con- cerned pressure-treated Si:N prepared by nitrogen im- plantation with a 2×1016 cm-2 dose of total energy up to 150 keV [1-3].

The dislocation-free silicon single crystal was grown by the Czochralski method. The (100)-oriented samples were implanted with a 5×1014ions⋅cm-2dose of N ions, with the total energy 42 MeV (corresponding to

3 MeV/nucleon) of the ion beam, from a K=160 Cyclo- tron at the Heavy Ion Laboratory of the Warsaw Univer- sity. The beam current was equal to 50 enA. The implan- tation was performed at room temperature by a uni- formly defocused beam. The calculated mean range of 42 MeV N ions in silicon is equal to 37 µm. The buried layer is 2 µm thick. Some investigation of Si implanted with high energy ions were described in Refs. [4-6].

a. c.

b. d.

Figure 1. Monochromatic beam topographs from: (a) and (b) - sample 1 taken for different angular positions, (c) - sample 2, and (d) - sample 4.

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41

16.715 16.725 16.735 16.745 16.755

Angle [degrees]

10 100 1000 10000 100000

Intensity [counts]

16.900 16.910 16.920 16.930 16.940

Angle [degrees]

10 100 1000 10000

Intensity [counts]

a b

Figure 2. Rocking curves recorded in 511 asymmetric reflection of 0.115 nm radiation with small point probe beam 50×100 µm2 from samples 1 (a) and 3 (b).

Next, the samples were subjected to annealing under enhanced hydrostatic pressure (HP-HT treatment) in inert gas (Ar) atmosphere at up to 1000°C (see Ref. [7]

for details of the method). Experimental conditions ap- plied for studied samples are given in Table 1. The HP- HT treatment is known to affect strongly the profiles of implanted ions in silicon as well as to influence the crea- tion of clusters/precipitates containing the implanted species, e.g. oxygen [8].

The samples were investigated at the monochro- matic-beam station E-2 at HASYLAB [511 asymmetric reflection of 0.115 nm radiation] by recording local rocking curves using the beam limited to the 50×100 µm2 and by taking monochromatic beam topog- raphs at various angular positions with 2×8 mm2 beam.

Table 1. Conditions of HP–HT treatment.

Sample HT [ºC]

HP [kbar]

Duration [h]

1 325 11.0 0.75

2 1000 11.46 1.0

3 450 10.6 10.0

4 650 11.0 10.0

It was found that only the treatment performed dur- ing 0.75 h at 325ºC (sample 1) did not remove the strain caused by ion implantation. In this case we observed the interference maxima at low angle side of the main peak (Fig. 2a), characteristic for the strain maximum located at certain depth under the surface [9, 10]. The topog- raphs, presented in Figures 1a and 1b, taken for this sample revealed some interference fringes, forming the pattern corresponding to the irregularities of the ion dose, and changing for different angular setting. For the

treatment performed at higher temperatures (samples 2, 3 and 4) we observed a single maximum only with in- significant amount of diffuse scattering (Fig. 2b). We observed some contrast at the topographs shown in Fig- ures 1c and 1d, which may be attributed to some initial stages of the exfoliation. Almost complete exfoliation was observed in the case of the treatment performed at the temperature 650oC for 11 hours (Fig. 1d).

References

[1] J. Bak-Misiuk, A. Misiuk, W. Paszkowicz, A. Shalimov, J.

Hartwig, L. Bryja, J.Z. Domagala, J. Trela, W. Wierz- chowski, K. Wieteska, J. Ratajczak, W. Graeff, J. Alloys Compds. 362 (2004) 275.

[2] W. Rzodkiewicz, A. Kudła, A. Misiuk, B. Surma, J. Bąk- Misiuk, J. Hartwig, J. Ratajczak, Mater. Sci. Semicond.

Process. 7 (2004) 399.

[3] B. Surma, A. Misiuk, A. Wnuk, A. Bukowski, W. Rzod- kiewicz, Mater. Sci. Semicond. Process. 7 (2004) 405. [4] D. Żymierska, K. Godwod, J. Adamczewska, J. Auleytner,

J. Choiński, K. Regiński, Acta Phys. Polon. A 101 (2002) 743.

[5] S.J. Pearson, Int. J. Mod. Phys. B 7 (1993) 4687.

[6] D. Żymierska, J. Auleytner, K. Godwod, J. Domagała, L.

Datsenko, J. Choiński, J. Alloys Compds. 328 (2001) 237.

[7] A. Misiuk, Mater. Phys. Mech. 1 (2000) 119.

[8] A. Misiuk, L. Bryja, J. Kątcki, J. Ratajczak, Optica Appli- cata 2 (2002) 397.

[9] K. Wieteska, W. Wierzchowski, phys. stat. sol. (a) 147 (1995) 55.

[10] K. Wieteska, W. Wierzchowski, W. Graeff, K. Dłużew- ska, phys. stat. sol. (a) 168 (1999) 11.

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