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TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type
CUS01
Portable Equipment Battery Application
· Forward voltage: VFM = 0.37 V (max) @IF = 0.7 A
· Average forward current: IF (AV) = 1.0 A
· Repetitive peak reverse voltage: VRRM = 30 V
· Suitable for compact assembly due to small surface-mount package “US−FLATTM” (Toshiba package name)
Maximum Ratings (Ta = 25°C)
Characteristics Symbol Rating Unit
Repetitive peak reverse voltage VRRM 30 V
Average forward current IF (AV) 1.0
(Note 1) A Peak one cycle surge forward current IFSM 20 (50 Hz) A Junction temperature Tj −40 to 125 °C Storage temperature range Tstg −40 to 150 °C
Note 1: TI = 86°C: Rectangular waveform (α = 180°), VR = 15 V
Electrical Characteristics (Ta = 25°C)
Characteristics Symbol Test Condition Min Typ. Max Unit
VFM (1) IFM = 0.1 A ― 0.25 ―
VFM (2) IFM = 0.7 A ― 0.33 0.37
Peak forward voltage
VFM (3) IFM = 1.0 A ― 0.39 ―
V
IRRM (1) VRRM = 5 V ― 50 ― µA
Repetitive peak reverse current
IRRM (2) VRRM = 30 V ― 0.5 1.5 mA
Junction capacitance Cj VR = 10 V, f = 1.0 MHz ― 40 ― pF
Device mounted on a ceramic board
(soldering land: 2 mm × 2 mm) ― ― 75 Thermal resistance
(junction to ambient) Rth (j-a) Device mounted on a glass-epoxy board
(soldering land: 6 mm × 6 mm) ― ― 150
°C/W
Thermal resistance (junction to lead) Rth (j-I) Junction to lead of cathode side ― ― 30 °C/W Unit: mm
JEDEC ―
JEITA TOSHIBA 3-2B1A Weight: 0.004 g (typ.)
the Date of Manufacture
Standard Soldering Pad
Handling Precaution
Schottky barrier diodes are having large-reverse-current-leakage characteristic compare to the other rectifier products. This current leakage and improper operating temperature or voltage may cause thermal runaway.
Please take forward and reverse loss into consideration when you design.
2.0
1.1
Unit: mm
0.5
0.8 0.8
0 1 2 3 4
5 6 7 8 9 Type code
Month of manufac- ture
January to December are denoted by letter A to L respectively.
Year of manufac- ture
Last decimal digit of the year of manufacture Cathode mark
Lot No.
1
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Transient thermal impedance rth (j-a) (°C/W) Maximum allowable lead temperature TI max (°C)
Instantaneous forward voltage vF (V) iF – vF
Instantaneous forward current iF (A)
Average forward current IF (AV) (A) PF (AV) – IF (AV)
Average forward power dissipation PF (AV) (W)
Average forward current IF (AV) (A) Ta max – IF (AV)
Maximum allowable ambient temperature Ta max (°C)
Average forward current IF (AV) (A) TI max – IF (AV)
Time t (s) rth (j-a) – t
0.010.0
75°C
25°C Tj = 125°C 10
1
0.1
0.2 0.4 0.6 0.8 1.0
0.001 1 1000
0.01 0.1 1 10 100 1000 10
100
10000 (1) Device mounted on a ceramic board Soldering land: 2.0 mm × 2.0 mm (2) Device mounted on a glass-epoxy board
Soldering land: 6.0 mm × 6.0 mm (3) Device mounted on a glass-epoxy board
Standard Soldering pad
(2) (3)
(1)
0.5
0.00.0
Rectangular waveform
0.2 0.4 0.6 0.8 1.4 1.0 1.2 1.6 0.3
0.1 0.2
0.4 180°
120°
DC
α = 60°
α 0° 360°
Conduction angle: α
00.0 140
0.2 0.4 0.6 1.0 1.2 60
20 40 80 100
0.8 1.4 1.6
120
DC α = 180°
Device mounted on a ceramic board (board size: 50 mm × 50 mm)
Rectangular waveform
α 0° 360°
Conduction angle: α VR = 15 V
I F
(AV)
140
00.0 0.2 0.4 0.6 1.0 1.2 60
20 40 80 100
0.8 1.4 1.6
120
180°
120° DC
α = 60°
Rectangular waveform
α 0° 360°
Conduction angle: α VR = 15 V
I F
(AV)
Average reverse power dissipation PR (AV) (W) Number of cycles
Surge forward current (non-repetitive)
Peak surge forward current IFSM (A)
Reverse voltage VR (V) Cj – VR (typ.)
Junction capacitance Cj (pF)
Junction temperature Tj (°C) IR – Tj (typ.)
Reverse current IR (mA)
Reverse voltage VR (V) PR(AV) – VR (typ.)
01
Ta = 25°C f = 50 Hz 24
10 100
20
16
12
8
4
1000
101
f = 1 MHz Ta = 25°C
10 100
100
15 V 20 V
VR = 30 V Pulse test
0.010 100
1
0.1 10
5 V
3 V
10 V
0 40 20 80 60 100 120 140
2.5
0.00 10 20 30
2.0
1.0
0.5 1.5
120°
60°
180°
300°
240°
DC Rectangular
waveform
α 0° 360°
Conduction angle: α Tj = 125°C
2002-08-29 5
· TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc..
· The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk.
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· The information contained herein is subject to change without notice.
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