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5 4 6

3 2 1

NPN Silicon AF Transistor Array

• For AF stages and driver applications

• High current gain

• Low collector-saturation voltage

• Two (galvanic) internal isolated transistors with good matching in one package

• Pb-free (RoHS compliant) package

• Qualified according AEC Q101

EHA07178

6 5 4

3 2 1

C1 B2 E2

C2 B1 E1 TR1

TR2

Type Marking Pin Configuration Package

BC817U 6Bs 1=E1 2=B1 3=C2 4=E2 5=B2 6=C1 SC74

Maximum Ratings

Parameter Symbol Value Unit

Collector-emitter voltage VCEO 45 V

Collector-base voltage VCBO 50

Emitter-base voltage VEBO 5

Collector current IC 500 mA

Peak collector current, tp ≤ 10 ms ICM 1000

Base current IB 100

Peak base current IBM 200

Total power dissipation- TS ≤ 115 °C

Ptot 330 mW

Junction temperature Tj 150 °C

Storage temperature Tstg -65 ... 150

(2)

Thermal Resistance

Parameter Symbol Value Unit

Junction - soldering point1) RthJS ≤ 105 K/W

Electrical Characteristics at TA = 25°C, unless otherwise specified

Parameter Symbol Values Unit

min. typ. max.

DC Characteristics

Collector-emitter breakdown voltage IC = 10 mA, IB = 0

V(BR)CEO 45 - - V

Collector-base breakdown voltage IC = 10 µA, IE = 0

V(BR)CBO 50 - -

Emitter-base breakdown voltage IE = 10 µA, IC = 0

V(BR)EBO 5 - -

Collector-base cutoff current VCB = 25 V, IE = 0

VCB = 25 V, IE = 0 , TA = 150 °C

ICBO

- -

- -

0.1 50

µA

Emitter-base cutoff current VEB = 4 V, IC = 0

IEBO - - 100 nA

DC current gain2)

IC = 100 mA, VCE = 1 V IC = 300 mA, VCE = 1 V

hFE

160 100

250 -

400 -

-

Collector-emitter saturation voltage2) IC = 500 mA, IB = 50 mA

VCEsat - - 0.7 V

Base emitter saturation voltage2) IC = 500 mA, IB = 50 mA

VBEsat - - 1.2

AC Characteristics Transition frequency

IC = 50 mA, VCE = 5 V, f = 100 MHz

fT - 170 - MHz

Collector-base capacitance f = 1 MHz, VBE = 10 V

Ccb - 6 - pF

Emitter-base capacitance VEB = 0.5 V, f = 1 MHz

Ceb - 60 -

1For calculation of RthJA please refer to Application Note AN077 (Thermal Resistance Calculation) 2Pulse test: t < 300µs; D < 2%

(3)

DC current gain hFE = ƒ(IC) VCE = 1 V

10 -5 10 -4 10 -3 10 -2 10 -1 A 10 0

IC

10 1

10 2

10 3

hFE

105 °C 85 °C 65 °C 25 °C -40 °C

Collector-emitter saturation voltage IC = ƒ(VCEsat), hFE = 10

10 0

EHP00223 BC 817/818

CEsat

V

0.4 V 0.8

-1

100 101 103

5 5 ΙC

mA

5 102

0.2 0.6

˚C -5025 ˚C 150 ˚C

Base-emitter saturation voltage IC = ƒ(VBEsat), hFE = 10

10 0

EHP00222 BC 817/818

BEsat

V

2.0 V 4.0

-1

100 101 103

5 5 ΙC

mA

5 102

1.0 3.0

˚C -50

25 ˚C

˚C 150

Collector cutoff current ICBO = ƒ(TA) VCBO = 25 V

10 0

EHP00221 BC 817/818

TA

150

0

105

ΙCBO

nA

50 100

101

102

104

˚C typ

max 103

(4)

Transition frequency fT = ƒ(IC) VCE = parameter in V, f = 2 GHz

10

EHP00218 BC 817/818

0 3

10 mA 101

103

5 5

101 102

102

C

fT MHz

Ι

Collector-base capacitance Ccb=ƒ(VCB) Emitter-base capacitance Ceb=ƒ(VEB)

0 2 4 6 8 10 12 14 16 V 20

VCB/VEB 0

5 10 15 20 25 30 35 40 45 50 55 pF

65

CCB/CEB

CCB

CEB

Total power dissipation Ptot = ƒ(TS)

0 20 40 60 80 100 120 160

0 30 60 90 120 150 180 210 240 270 300 360

Permissible Pulse Load RthJS = ƒ(tp)

10 -6 10 -5 10 -4 10 -3 10 -2 s 10 0

tp

10 -1

10 0

10 1

10 2

10 3

K/W

RthJS

D=0.5 0.2 0.1 0.05 0.02 0.01 0.005 0

(5)

Permissible Pulse Load Ptotmax/PtotDC = ƒ(tp)

10 -6 10 -5 10 -4 10 -3 10 -2 s 10 0

tp

10 0

10 1

10 2

10 3

Ptotmax/PtotDC D=0

0.005 0.01 0.02 0.05 0.1 0.2 0.5

(6)

P a c k a g e O u t l i n e

F o o t P r i n t

S t a n d a r d P a c k i n g

0.5

0.95

1.9 2.9

5 4

6

3 2 1

1.1 MAX.

(0.35) (2.25) 2.9±0.2

B

0.2

+0.1 -0.05

Pin 1 0.35 marking

M B 6x 0.95

1.9

0.15-0.06+0.1

1.6

10˚ MAX. A

±0.1

2.5 0.25 10˚ MAX.

±0.1 ±0.1

A 0.2M

0.1 MAX.

2.7

4

Pin 1 3.15

8

0.2

1.15 Reel ø180 mm = 3.000 Pieces/Reel

Reel ø330 mm = 10.000 Pieces/Reel

For symmetric types no defined Pin 1 orientation in reel.

Manufacturer 2005, June

Date code (Year/Month)

BCW66H Type code Pin 1 marking

Laser marking

M a r k i n g L a y o u t ( E x a m p l e )

Small variations in positioning of

Date code, Type code and Manufacture are possible.

(7)

Edition 2009-11-16 Published by

Infineon Technologies AG 81726 Munich, Germany

 2009 Infineon Technologies AG All Rights Reserved.

Legal Disclaimer

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party.

Information

For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (<www.infineon.com>).

Warnings

Due to technical requirements, components may contain dangerous substances.

For information on the types in question, please contact the nearest Infineon Technologies Office.

Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system.

Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

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