ESD114-U1-02

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(1)Protection Device TVS (Transient Voltage Suppressor). ESD114-U1-02 Series Uni-directional, 5.3 V, 0.4 pF, 0402, 0201, RoHS and Halogen Free compliant. ESD114-U1-02ELS ESD114-U1-02EL. Data Sheet Revision 1.0, 2014-10-30 Final. Power Management & Multimarket.

(2) Edition 2014-10-30 Published by Infineon Technologies AG 81726 Munich, Germany © 2014 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com) Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered..

(3) ESD114-U1-02 Series Product Overview. 1. Product Overview. 1.1. Features. •. • • • • • •. ESD / Transient protection of high speed data lines exceeding – IEC61000-4-2 (ESD): ±20 kV (contact) – IEC61000-4-4 (EFT): ±2 kV / ±40 A (5/50 ns) – IEC61000-4-5 (surge): ±3 A (8/20 μs) Maximum working voltage: VRWM = ±5.3 V Ultra low capacitance: CL = 0.4 pF (typical) Very low clamping voltage VCL = +20 / -15 V (typical) at ITLP = 16 A Low dynamic resistance RDYN = 0.5 Ω (typical) Very small form factor down to 0.62 x 0.32 x 0.31 mm3 Pb-free (RoHS compliant) and halogen free package. 1.2 • •. Application Examples. USB 2.0, Mobile HDMI Link, MDDI, MIPI, etc. HDMI, DisplayPort, DVI, Ethernet, Firewire, S-ATA. 1.3. Product Description. Pin 1 Pin 1. Pin 1 marking (lasered). Pin 2. Pin 2 a) Pin configuration. b) Schematic diagram Single _Die_diode_PinConf_and_SchematicDiag.vst .vsd. Figure 1. Pin Configuration and Schematic Diagram. Table 1. Ordering Information. Type. Package. Configuration. Marking code. ESD114-U1-02ELS. TSSLP-2-3. 1 line, uni-directional. K. ESD114-U1-02EL. TSLP-2-19. 1 line, uni-directional. K. FinalData Sheet. 4. Revision 1.0, 2014-10-30.

(4) ESD114-U1-02 Series Maximum Ratings. 2. Maximum Ratings. Table 2. Maximum Ratings at TA = 25 °C, unless otherwise specified. Parameter. Symbol 1). Values. Unit. VESD. ±20. kV. IPP. ±3. A. Operating temperature range. TOP. -55 to 125. °C. Storage temperature 1) VESD according to IEC61000-4-2. Tstg. -65 to 150. °C. ESD contact discharge. Peak pulse current (tp = 8/20 μs). 2). 2) Non-repetitive current pulse 8/20µs exponential decay waveform according to IEC61000-4-5. Attention: Stresses above the max. values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit.. 3. Electrical Characteristics at TA = 25 °C, unless otherwise specified . . . . . . . . . .

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(11) ESD114-U1-02 Series Electrical Characteristics at TA = 25 °C, unless otherwise specified. Table 3. DC Characteristics at TA = 25 °C, unless otherwise specified. Parameter. Symbol. Reverse working voltage VRWM. Values. Unit. Note / Test Condition. Min.. Typ.. Max.. –. –. 5.3. V. Pin 1 to Pin 2. Breakdown voltage. VBR. 6. –. –. V. IBR = 1 mA, from Pin 1 to Pin 2. Reverse current. IR. –. <10. 100. nA. VR = 5.3 V, from Pin 1 to Pin 2. Table 4. RF Characteristics at TA = 25 °C, unless otherwise specified. Parameter. Symbol. Values Min.. Typ.. Max.. Unit. Note / Test Condition. Line capacitance1). CL. –. 0.4. 0.6. pF. VR = 0 V, f = 1 MHz. Serie inductance. LS. –. 0.2. –. nH. ESD114-U1-02ELS. –. 0.4. –. nH. ESD114-U1-02EL. Unit. Note / Test Condition. V. ITLP = 1 A, from Pin 1 to Pin 2. 1) Total capacitance line to ground. Table 5. ESD Characteristics at TA = 25 °C, unless otherwise specified. Parameter. Symbol. VCL. Clamping voltage. Values Min.. Typ.. Max.. –. 10. –. –. 20. –. ITLP = 16 A, from Pin 1 to Pin 2. –. 28. –. ITLP = 30 A, from Pin 1 to Pin 2. –. 3. –. ITLP = 1 A, from Pin 2 to Pin 1. –. 15. –. ITLP = 16 A, from Pin 2 to Pin 1. –. 21. ITLP = 30 A,. –. from Pin 2 to Pin 1 Dynamic resistance. 1). RDYN. –. 0.56. –. 0.43. –. V. Pin 1 to Pin 2. – V Pin 2 to Pin 1 1) Please refer to Application Note AN210[1]. TLP parameter: Z0 = 50 Ω , tp = 100ns, tr = 300ps, averaging window: t1 = 30 ns to t2 = 60 ns, extraction of dynamic resistance using least squares fit of TLP charactertistics between IPP1 = 10 A and IPP2 = 40 A.. FinalData Sheet. 6. Revision 1.0, 2014-10-30.

(12) ESD114-U1-02 Series Typical Characteristics Diagrams. 4. Typical Characteristics Diagrams. Typical characteristics diagrams at TA = 25°C, unless otherwise specified. 10-2 -3. 10. 10-4 10-5 10-6 IR [A]. 10-7 -8. 10. -9. 10. 10-10 10-11 -12. 10. 10-13. Figure 3. 0. 1. 2. 3 VR [V]. 4. 5. 6. Reverse leakage current:IR = f(VR). 1 0.9 0.8. CL [pF]. 0.7 0.6 0.5 0.4. 1 MHz. 0.3. 1 GHz. 0.2. Figure 4. 0. 0.5. 1. 1.5. 2. 2.5. 3 3.5 VR [V]. 4. 4.5. 5. 5.5. 6. Line capacitance: CL = f(VR). FinalData Sheet. 7. Revision 1.0, 2014-10-30.

(13) ESD114-U1-02 Series Typical Characteristics Diagrams. 120. Scope: 6 GHz, 20 GS/s. 100. VCL [V]. 80 VCL-max-peak = 112 V. 60. VCL-30ns-peak = 17 V. 40 20 0 -20 -50. Figure 5. 0. 50. 100. 150. 200 tp [ns]. 250. 300. 350. 400. 450. IEC61000-4-2 : VCL = f(t), 8 kV positive pulse from pin 1 to pin 2. 20. Scope: 6 GHz, 20 GS/s. 0. VCL [V]. -20 -40 -60 VCL-max-peak = -99 V. -80. VCL-30ns-peak = -13 V. -100 -120 -50. Figure 6. 0. 50. 100. 150. 200 tp [ns]. 250. 300. 350. 400. 450. IEC61000-4-2 : VCL = f(t), 8 kV negative pulse from pin 1 to pin 2. FinalData Sheet. 8. Revision 1.0, 2014-10-30.

(14) ESD114-U1-02 Series Typical Characteristics Diagrams. 180. Scope: 6 GHz, 20 GS/s. 160 140. VCL [V]. 120 VCL-max-peak = 154 V. 100 80. VCL-30ns-peak = 25 V. 60 40 20 0 -20 -50. Figure 7. 0. 50. 100. 150. 200 tp [ns]. 250. 300. 350. 400. 450. IEC61000-4-2 : VCL = f(t), 15 kV positive pulse from pin 1 to pin 2. 20. Scope: 6 GHz, 20 GS/s. 0 -20. VCL [V]. -40 -60 -80 -100. VCL-max-peak = -139 V. -120. VCL-30ns-peak = -19 V. -140 -160 -180 -50. Figure 8. 0. 50. 100. 150. 200 tp [ns]. 250. 300. 350. 400. 450. IEC61000-4-2 : VCL = f(t), 15 kV negative pulse from pin 1 to pin 2. FinalData Sheet. 9. Revision 1.0, 2014-10-30.

(15) ESD114-U1-02 Series Typical Characteristics Diagrams. ESD114-U1-02EL RDYN. 20 RDYN = 0.56 Ω. 30. 15. 20. 10. 10. 5. 0. 0. -10. -5. -20. -10. -30. -15. Equivalent VIEC [kV]. ITLP [A]. 40. RDYN = 0.43 Ω -40 -35 -30 -25 -20 -15 -10 -5 0 5 VTLP [V] Figure 9. -20 10 15 20 25 30 35. Clamping voltage (TLP): ITLP = f(VTLP) [1], pin 1 to pin 2. FinalData Sheet. 10. Revision 1.0, 2014-10-30.

(16) ESD114-U1-02 Series Package Information. 5. Package Information. 5.1. TSSLP-2-3 (mm)[3]. Top view. Bottom view 0.31 +0.01 -0.02. 0.32 ±0.05. 0.355. 0.62 ±0.05. 2. Pin 1 marking. 0.05 MAX.. 0.26 ±0.035. 0.2 ±0.035 1). 1 1). 1) Dimension applies to plated terminals TSSLP-2-3, -4-PO V01. TSSLP-2-3: Package overview. 0.19. 0.24 Solder mask. 0.19. 0.57. 0.62 Copper. 0.19. 0.27 0.14. 0.32. 0.24. Figure 10. Stencil apertures TSSLP-2-3, -4-FP V02. Figure 11. TSSLP-2-3 Footprint 0.35. Tape type Ex Ey Punched Tape 0.43 0.73 Embossed Tape 0.37 0.67. 8. Ey. 4. Deliveries can be both tape types (no selection possible). Specification allows identical processing (pick & place) by users.. Pin 1 marking. Figure 12. Ex. TSSLP-2-3, -4-TP V03. TSSLP-2-3: Packing. 1. Type code. Pin 1 marking TSSLP-2-3, -4-MK V01. Figure 13. TSSLP-2-3: Marking (example). FinalData Sheet. 11. Revision 1.0, 2014-10-30.

(17) ESD114-U1-02 Series Package Information. 5.2. TSLP-2-19 (mm)[3]. Top view. Bottom view 0.31 +0.01 -0.02 0.6 ±0.05. 0.05 MAX.. 1±0.05. 0.65 ±0.05. 2. 0.25 ±0.035 1). 1. 0.5 ±0.035 1). Pin 1 marking. 1) Dimension applies to plated terminals. TSLP-2-19, -20-PO V01. TSLP-2-19: Package Overview. 0.28. 0.35 Solder mask. 0.38. 0.93. 1 Copper. 0.28. 0.45 0.3. 0.6. 0.35. Figure 14. Stencil apertures TSLP-2-19, -20-FP V01. TSLP-2-19: Footprint. 0.93. 0.3 0.35. 0.28. 1 Copper. 0.28. 0.45. 0.35. 0.6. Solder mask. 0.38. Figure 15. Stencil apertures TSLP-2-19, -20-FP V01. Figure 16. TSLP-2-19: Packing Type code. 12 Pin 1 marking TSLP-2-19, -20-MK V01. Figure 17. TSLP-2-19: Marking (example). FinalData Sheet. 12. Revision 1.0, 2014-10-30.

(18) ESD114-U1-02 Series References. References [1]. Infineon AG - Application Note AN210: Effective ESD Protection Design at System Level Using VF-TLP. [2]. Infineon AG - Application Note AN140: ESD Protection for Digital High-Speed Interfaces (HDMI, FireWire, ...) using ESD5V3U1U). [3]. Infineon AG - Recommendations for PCB Assembly of Infineon TSLP and TSSLP Package. FinalData Sheet. 15. Revision 1.0, 2014-10-30.

(19) ESD114-U1-02 Series. Revision History: Rev.09, 2014-06-20 Page or Item. Subjects (major changes since previous revision). Revision 1.0, 2014-10-30 All. Status change to Final. Trademarks of Infineon Technologies AG AURIX™, BlueMoon™, COMNEON™, C166™, CROSSAVE™, CanPAK™, CIPOS™, CoolMOS™, CoolSET™, CORECONTROL™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, EUPEC™, FCOS™, HITFET™, HybridPACK™, ISOFACE™, I²RF™, IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OptiMOS™, ORIGA™, PROFET™, PRO-SIL™, PRIMARION™, PrimePACK™, RASIC™, ReverSave™, SatRIC™, SIEGET™, SINDRION™, SMARTi™, SmartLEWIS™, TEMPFET™, thinQ!™, TriCore™, TRENCHSTOP™, X-GOLD™, XMM™, X-PMU™, XPOSYS™. Other Trademarks Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, PRIMECELL™, REALVIEW™, THUMB™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Sattelite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited. Last Trademarks Update 2010-06-09. FinalData Sheet. 3. Revision 1.0, 2014-10-30.

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